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www.latticesemi.com 1 ds1020_23.0 ispmach 4000v/b/c/z family 3.3v/2.5v/1.8v in-system programmable superfast high density plds november 2007 data sheet ds1020 tm ?2007 lattice semiconductor corp. all lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www .latticesemi.com/legal. all other brand or product names are trademarks or registered trademarks of their respective holders. the speci?ations and information herein are subject to change without notice. coolest power c tm features high performance ? max = 400mhz maximum operating frequency ? pd = 2.5ns propagation delay up to four global clock pins with programmable clock polarity control up to 80 pts per output ease of design enhanced macrocells with individual clock, reset, preset and clock enable controls up to four global oe controls individual local oe control per i/o pin excellent first-time-fit tm and re? fast path, speedlocking tm path, and wide-pt path wide input gating (36 input logic blocks) for fast counters, state machines and address decoders zero power (ispmach 4000z) and low power (ispmach 4000v/b/c) typical static current 10? (4032z) typical static current 1.3ma (4000c) 1.8v core low dynamic power ispmach 4000z operational down to 1.6v v cc broad device offering multiple temperature range support ?commercial: 0 to 90? junction (t j ) ?industrial: -40 to 105? junction (t j ) ?extended: -40 to 130? junction (t j ) for aec-q100 compliant devices, refer to la-ispmach 4000v/z automotive data sheet easy system integration superior solution for power sensitive consumer applications operation with 3.3v, 2.5v or 1.8v lvcmos i/o operation with 3.3v (4000v), 2.5v (4000b) or 1.8v (4000c/z) supplies 5v tolerant i/o for lvcmos 3.3, lvttl, and pci interfaces hot-socketing open-drain capability input pull-up, pull-down or bus-keeper programmable output slew rate 3.3v pci compatible ieee 1149.1 boundary scan testable 3.3v/2.5v/1.8v in-system programmable (isp) using ieee 1532 compliant interface i/o pins with fast setup path lead-free package options table 1. ispmach 4000v/b/c family selection guide ispmach 4032v/b/c ispmach 4064v/b/c ispmach 4128v/b/c ispmach 4256v/b/c ispmach 4384v/b/c ispmach 4512v/b/c macrocells 32 64 128 256 384 512 i/o + dedicated inputs 30+2/32+4 30+2/32+4/ 64+10 64+10/92+4/ 96+4 64+10/96+14/ 128+4/160+4 128+4/192+4 128+4/208+4 t pd (ns) 2.5 2.5 2.7 3.0 3.5 3.5 t s (ns) 1.8 1.8 1.8 2.0 2.0 2.0 t co (ns) 2.2 2.2 2.7 2.7 2.7 2.7 f max (mhz) 400 400 333 322 322 322 supply voltages (v) 3.3/2.5/1.8v 3.3/2.5/1.8v 3.3/2.5/1.8v 3.3/2.5/1.8v 3.3/2.5/1.8v 3.3/2.5/1.8v pins/package 44 tqfp 48 tqfp 44 tqfp 48 tqfp 100 tqfp 100 tqfp 128 tqfp 144 tqfp 1 100 tqfp 144 tqfp 1 176 tqfp 256 ftbga 2 / fpbga 2, 3 176 tqfp 256 ftbga/ fpbga 3 176 tqfp 256 ftbga/ fpbga 3 1. 3.3v (4000v) only. 2. 128-i/o and 160-i/o con?urations. 3. use 256 ftbga package for all new designs. refer to pcn#14a-07 for 256 fpbga package discontinuance.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 2 table 2. ispmach 4000z family selection guide ispmach 4000 introduction the high performance ispmach 4000 family from lattice offers a superfast cpld solution. the family is a blend of lattices two most popular architectures: the isplsi 2000 and ispmach 4a. retaining the best of both families, the ispmach 4000 architecture focuses on signi?ant innovations to combine the highest performance with low power in a ?xible cpld family. the ispmach 4000 combines high speed and low power with the ?xibility needed for ease of design. with its robust global routing pool and output routing pool, this family delivers excellent first-time-fit, timing predictabil- ity, routing, pin-out retention and density migration. the ispmach 4000 family offers densities ranging from 32 to 512 macrocells. there are multiple density-i/o com- binations in thin quad flat pack (tqfp), chip scale bga (csbga) and fine pitch thin bga (ftbga) packages ranging from 44 to 256 pins/balls. table 1 shows the macrocell, package and i/o options, along with other key parameters. the ispmach 4000 family has enhanced system integration capabilities. it supports 3.3v (4000v), 2.5v (4000b) and 1.8v (4000c/z) supply voltages and 3.3v, 2.5v and 1.8v interface voltages. additionally, inputs can be safely driven up to 5.5v when an i/o bank is con?ured for 3.3v operation, making this family 5v tolerant. the ispmach 4000 also offers enhanced i/o features such as slew rate control, pci compatibility, bus-keeper latches, pull-up resistors, pull-down resistors, open drain outputs and hot socketing. the ispmach 4000 family members are 3.3v/ 2.5v/1.8v in-system programmable through the ieee standard 1532 interface. ieee standard 1149.1 boundary scan testing capability also allows product testing on automated test equipment. the 1532 interface signals tck, tms, tdi and tdo are referenced to v cc (logic core). overview the ispmach 4000 devices consist of multiple 36-input, 16-macrocell generic logic blocks (glbs) interconnected by a global routing pool (grp). output routing pools (orps) connect the glbs to the i/o blocks (iobs), which contain multiple i/o cells. this architecture is shown in figure 1. ispmach 4032zc ispmach 4064zc ispmach 4128zc ispmach 4256zc macrocells 32 64 128 256 i/o + dedicated inputs 32+4/32+4 32+4/32+12/ 64+10/64+10 64+10/96+4 64+10/96+6/ 128+4 t pd (ns) 3.5 3.7 4.2 4.5 t s (ns) 2.2 2.5 2.7 2.9 t co (ns) 3.0 3.2 3.5 3.8 f max (mhz) 267 250 220 200 supply voltage (v) 1.8 1.8 1.8 1.8 max. standby icc (?) 20 25 35 55 pins/package 48 tqfp 56 csbga 48 tqfp 56 csbga 100 tqfp 132 csbga 100 tqfp 132csbga 100 tqfp 132 csbga 176 tqfp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 3 figure 1. functional block diagram the i/os in the ispmach 4000 are split into two banks. each bank has a separate i/o power supply. inputs can support a variety of standards independent of the chip or bank power supply. outputs support the standards com- patible with the power supply provided to the bank. support for a variety of standards helps designers implement designs in mixed voltage environments. in addition, 5v tolerant inputs are speci?d within an i/o bank that is con- nected to v cco of 3.0v to 3.6v for lvcmos 3.3, lvttl and pci interfaces. ispmach 4000 architecture there are a total of two glbs in the ispmach 4032, increasing to 32 glbs in the ispmach 4512. each glb has 36 inputs. all glb inputs come from the grp and all outputs from the glb are brought back into the grp to be connected to the inputs of any other glb on the device. even if feedback signals return to the same glb, they still must go through the grp. this mechanism ensures that glbs communicate with each other with consistent and predictable delays. the outputs from the glb are also sent to the orp. the orp then sends them to the associ- ated i/o cells in the i/o block. generic logic block the ispmach 4000 glb consists of a programmable and array, logic allocator, 16 macrocells and a glb clock generator. macrocells are decoupled from the product terms through the logic allocator and the i/o pins are decou- pled from macrocells through the orp. figure 2 illustrates the glb. i/o block orp orp 16 16 goe0 goe1 v cc gnd tck tms tdi tdo 36 generic logic block generic logic block i/o block orp orp 16 36 generic logic block generic logic block i/o block i/o bank 0 i/o bank 1 i/o block 36 36 clk0/i clk1/i clk2/i clk3/i 16 16 global routing pool v cco0 gnd v cco1 gnd 16 16 16
lattice semiconductor ispmach 4000v/b/c/z family data sheet 4 figure 2. generic logic block and array the programmable and array consists of 36 inputs and 83 output product terms. the 36 inputs from the grp are used to form 72 lines in the and array (true and complement of the inputs). each line in the array can be con- nected to any of the 83 output product terms via a wired-and. each of the 80 logic product terms feed the logic allocator with the remaining three control product terms feeding the shared pt clock, shared pt initialization and shared pt oe. the shared pt clock and shared pt initialization signals can optionally be inverted before being fed to the macrocells. every set of ?e product terms from the 80 logic product terms forms a product term cluster starting with pt0. there is one product term cluster for every macrocell in the glb. figure 3 is a graphical representation of the and array. logic allocator 36 inputs from grp 16 macrocells to orp to grp to product term output enable sharing 1+oe 16 mc feedback signals clock generator 1+oe 1+oe 1+oe 1+oe 1+oe 1+oe clk0 clk1 clk2 clk3 1+oe and array 36 inputs, 83 product terms
lattice semiconductor ispmach 4000v/b/c/z family data sheet 5 figure 3. and array enhanced logic allocator within the logic allocator, product terms are allocated to macrocells in product term clusters. each product term cluster is associated with a macrocell. the cluster size for the ispmach 4000 family is 4+1 (total 5) product terms. the software automatically considers the availability and distribution of product term clusters as it ?s the functions within a glb. the logic allocator is designed to provide three speed paths: 5-pt fast bypass path, 20-pt speed locking path and an up to 80-pt path. the availability of these three paths lets designers trade timing variability for increased performance. the enhanced logic allocator of the ispmach 4000 family consists of the following blocks: product term allocator cluster allocator wide steering logic figure 4 shows a macrocell slice of the logic allocator. there are 16 such slices in the glb. figure 4. macrocell slice pt0 pt1 cluster 0 pt2 pt3 pt4 in[0] in[34] in[35] note: indicates programmable fuse. pt80 pt81 pt82 shared pt clock shared pt initialization shared ptoe pt76 pt77 pt78 pt79 pt75 cluster 15 to n +1 to n -1 to n -2 from n -1 from n -4 from n +2 from n +1 5-pt from n -4 1-80 pts to n +4 fast 5-pt path to xor (mc) cluster individual product term allocator cluster allocator superwide steering logic n
lattice semiconductor ispmach 4000v/b/c/z family data sheet 6 product term allocator the product term allocator assigns product terms from a cluster to either logic or control applications as required by the design being implemented. product terms that are used as logic are steered into a 5-input or gate associ- ated with the cluster. product terms that used for control are steered either to the macrocell or i/o cell associated with the cluster. table 3 shows the available functions for each of the ?e product terms in the cluster. the or gate output connects to the associated i/o cell, providing a fast path for narrow combinatorial functions, and to the logic allocator. table 3. individual pt steering cluster allocator the cluster allocator allows clusters to be steered to neighboring macrocells, thus allowing the creation of functions with more product terms. table 4 shows which clusters can be steered to which macrocells. used in this manner, the cluster allocator can be used to form functions of up to 20 product terms. additionally, the cluster allocator accepts inputs from the wide steering logic. using these inputs, functions up to 80 product terms can be created. table 4. available clusters for each macrocell wide steering logic the wide steering logic allows the output of the cluster allocator n to be connected to the input of the cluster alloca- tor n +4. thus, cluster chains can be formed with up to 80 product terms, supporting wide product term functions and allowing performance to be increased through a single glb implementation. table 5 shows the product term chains. product term logic control pt n logic pt single pt for xor/or pt n +1 logic pt individual clock (pt clock) pt n +2 logic pt individual initialization or individual clock enable (pt initialization/ce) pt n +3 logic pt individual initialization (pt initialization) pt n +4 logic pt individual oe (ptoe) macrocell available clusters m0 c0c1c2 m1 c0 c1 c2 c3 m2 c1 c2 c3 c4 m3 c2 c3 c4 c5 m4 c3 c4 c5 c6 m5 c4 c5 c6 c7 m6 c5 c6 c7 c8 m7 c6 c7 c8 c9 m8 c7 c8 c9 c10 m9 c8 c9 c10 c11 m10 c9 c10 c11 c12 m11 c10 c11 c12 c13 m12 c11 c12 c13 c14 m13 c12 c13 c14 c15 m14 c13 c14 c15 m15 c14 c15
lattice semiconductor ispmach 4000v/b/c/z family data sheet 7 table 5. product term expansion capability every time the super cluster allocator is used, there is an incremental delay of t exp . when the super cluster alloca- tor is used, all destinations other than the one being steered to, are given the value of ground (i.e., if the super clus- ter is steered to m (n+4), then m (n) is ground). macrocell the 16 macrocells in the glb are driven by the 16 outputs from the logic allocator. each macrocell contains a pro- grammable xor gate, a programmable register/latch, along with routing for the logic and control functions. figure 5 shows a graphical representation of the macrocell. the macrocells feed the orp and grp. a direct input from the i/o cell allows designers to use the macrocell to construct high-speed input registers. a programmable delay in this path allows designers to choose between the fastest possible set-up time and zero hold time. figure 5. macrocell enhanced clock multiplexer the clock input to the ?p-?p can select any of the four block clocks along with the shared pt clock, and true and complement forms of the optional individual term clock. an 8:1 multiplexer structure is used to select the clock. the eight sources for the clock multiplexer are as follows: block clk0 block clk1 expansion chains macrocells associated with expansion chain (with wrap around) max pt/ macrocell chain-0 m0 m4 m8 m12 m0 75 chain-1 m1 m5 m9 m13 m1 80 chain-2 m2 m6 m10 m14 m2 75 chain-3 m3 m7 m11 m15 m3 70 single pt block clk0 block clk1 block clk2 block clk3 pt clock (optional) shared pt clock ce d/t/l q rp shared pt initialization pt initialization/ce (optional) pt initialization (optional) from logic allocator power-up initialization to orp to grp from i/o cell delay
lattice semiconductor ispmach 4000v/b/c/z family data sheet 8 block clk2 block clk3 pt clock pt clock inverted shared pt clock ground clock enable multiplexer each macrocell has a 4:1 clock enable multiplexer. this allows the clock enable signal to be selected from the fol- lowing four sources: pt initialization/ce pt initialization/ce inverted shared pt clock logic high initialization control the ispmach 4000 family architecture accommodates both block-level and macrocell-level set and reset capability. there is one block-level initialization term that is distributed to all macrocell registers in a glb. at the macrocell level, two product terms can be ?tolen from the cluster associated with a macrocell to be used for set/reset func- tionality. a reset/preset swapping feature in each macrocell allows for reset and preset to be exchanged, providing ?xibility. note that the reset/preset swapping selection feature affects power-up reset as well. all ?p-?ps power up to a known state for predictable system initialization. if a macrocell is con?ured to set on a signal from the block-level initialization, then that macrocell will be set during device power-up. if a macrocell is con?ured to reset on a signal from the block-level initialization or is not con?ured for set/reset, then that macrocell will reset on power- up. to guarantee initialization values, the v cc rise must be monotonic, and the clock must be inactive until the reset delay time has elapsed. glb clock generator each ispmach 4000 device has up to four clock pins that are also routed to the grp to be used as inputs. these pins drive a clock generator in each glb, as shown in figure 6. the clock generator provides four clock signals that can be used anywhere in the glb. these four glb clock signals can consist of a number of combinations of the true and complement edges of the global clock signals. figure 6. glb clock generator clk0 clk1 clk2 clk3 block clk0 block clk1 block clk2 block clk3
lattice semiconductor ispmach 4000v/b/c/z family data sheet 9 output routing pool (orp) the output routing pool allows macrocell outputs to be connected to any of several i/o cells within an i/o block. this provides greater ?xibility in determining the pinout and allows design changes to occur without affecting the pinout. the output routing pool also provides a parallel capability for routing macrocell-level oe product terms. this allows the oe product term to follow the macrocell output as it is switched between i/o cells. additionally, the out- put routing pool allows the macrocell output or true and complement forms of the 5-pt bypass signal to bypass the output routing multiplexers and feed the i/o cell directly. the enhanced orp of the ispmach 4000 family consists of the following elements: output routing multiplexers oe routing multiplexers output routing pool bypass multiplexers figure 7 shows the structure of the orp from the i/o cell perspective. this is referred to as an orp slice. each orp has as many orp slices as there are i/o cells in the corresponding i/o block. figure 7. orp slice output routing multiplexers the details of connections between the macrocells and the i/o cells vary across devices and within a device dependent on the maximum number of i/os available. tables 5-9 provide the connection details. table 6. orp combinations for i/o blocks with 8 i/os i/o cell available macrocells i/o 0 m0, m1, m2, m3, m4, m5, m6, m7 i/o 1 m2, m3, m4, m5, m6, m7, m8, m9 i/o 2 m4, m5, m6, m7, m8, m9, m10, m11 i/o 3 m6, m7, m8, m9, m10, m11, m12, m13 i/o 4 m8, m9, m10, m11, m12, m13, m14, m15 i/o 5 m10, m11, m12, m13, m14, m15, m0, m1 i/o 6 m12, m13, m14, m15, m0, m1, m2, m3 i/o 7 m14, m15, m0, m1, m2, m3, m4, m5 out p ut routin g multi p lexer oe routing multiplexer orp bypass multiplexer from macrocell from ptoe to i/o cell to i/o cell output oe 5-pt fast path
lattice semiconductor ispmach 4000v/b/c/z family data sheet 10 table 7. orp combinations for i/o blocks with 16 i/os table 8. orp combinations for i/o blocks with 4 i/os table 9. orp combinations for i/o blocks with 10 i/os i/o cell available macrocells i/o 0 m0, m1, m2, m3, m4, m5, m6, m7 i/o 1 m1, m2, m3, m4, m5, m6, m7, m8 i/o 2 m2, m3, m4, m5, m6, m7, m8, m9 i/o 3 m3, m4, m5, m6, m7, m8, m9, m10 i/o 4 m4, m5, m6, m7, m8, m9, m10, m11 i/o 5 m5, m6, m7, m8, m9, m10, m11, m12 i/o 6 m6, m7, m8, m9, m10, m11, m12, m13 i/o 7 m7, m8, m9, m10, m11, m12, m13, m14 i/o 8 m8, m9, m10, m11, m12, m13, m14, m15 i/o 9 m9, m10, m11, m12, m13, m14, m15, m0 i/o 10 m10, m11, m12, m13, m14, m15, m0, m1 i/o 11 m11, m12, m13, m14, m15, m0, m1, m2 i/o 12 m12, m13, m14, m15, m0, m1, m2, m3 i/o 13 m13, m14, m15, m0, m1, m2, m3, m4 i/o 14 m14, m15, m0, m1, m2, m3, m4, m5 i/o 15 m15, m0, m1, m2, m3, m4, m5, m6 i/o cell available macrocells i/o 0 m0, m1, m2, m3, m4, m5, m6, m7 i/o 1 m4, m5, m6, m7, m8, m9, m10, m11 i/o 2 m8, m9, m10, m11, m12, m13, m14, m15 i/o 3 m12, m13, m14, m15, m0, m1, m2, m3 i/o cell available macrocells i/o 0 m0, m1, m2, m3, m4, m5, m6, m7 i/o 1 m2, m3, m4, m5, m6, m7, m8, m9 i/o 2 m4, m5, m6, m7, m8, m9, m10, m11 i/o 3 m6, m7, m8, m9, m10, m11, m12, m13 i/o 4 m8, m9, m10, m11, m12, m13, m14, m15 i/o 5 m10, m11, m12, m13, m14, m15, m0, m1 i/o 6 m12, m13, m14, m15, m0, m1, m2, m3 i/o 7 m14, m15, m0, m1, m2, m3, m4, m5 i/o 8 m2, m3, m4, m5, m6, m7, m8, m9 i/o 9 m10, m11, m12, m13, m14, m15, m0, m1
lattice semiconductor ispmach 4000v/b/c/z family data sheet 11 table 10. orp combinations for i/o blocks with 12 i/os orp bypass and fast output multiplexers the orp bypass and fast-path output multiplexer is a 4:1 multiplexer and allows the 5-pt fast path to bypass the orp and be connected directly to the pin with either the regular output or the inverted output. this multiplexer also allows the register output to bypass the orp to achieve faster t co . output enable routing multiplexers the oe routing pool provides the corresponding local output enable (oe) product term to the i/o cell. i/o cell the i/o cell contains the following programmable elements: output buffer, input buffer, oe multiplexer and bus maintenance circuitry. figure 8 details the i/o cell. figure 8. i/o cell each output supports a variety of output standards dependent on the v cco supplied to its i/o bank. outputs can also be con?ured for open drain operation. each input can be programmed to support a variety of standards, inde- pendent of the v cco supplied to its i/o bank. the i/o standards supported are: i/o cell available macrocells i/o 0 m0, m1, m2, m3, m4, m5, m6, m7 i/o 1 m1, m2, m3, m4, m5, m6, m7, m8 i/o 2 m2, m3, m4, m5, m6, m7, m8, m9 i/o 3 m4, m5, m6, m7, m8, m9, m10, m11 i/o 4 m5, m6, m7, m8, m9, m10, m11, m12 i/o 5 m6, m7, m8, m9, m10, m11, m12, m13 i/o 6 m8, m9, m10, m11, m12, m13, m14, m15 i/o 7 m9, m10, m11, m12, m13, m14, m15, m0 i/o 8 m10, m11, m12, m13, m14, m15, m0, m1 i/o 9 m12, m13, m14, m15, m0, m1, m2, m3 i/o 10 m13, m14, m15, m0, m1, m2, m3, m4 i/o 11 m14, m15, m0, m1, m2, m3, m4, m5 goe 0 from orp *global fuses from orp to macrocell to grp goe 1 goe 2 goe 3 vcc v cco v cco ** *
lattice semiconductor ispmach 4000v/b/c/z family data sheet 12 lvttl lvcmos 1.8 lvcmos 3.3 3.3v pci compatible lvcmos 2.5 all of the i/os and dedicated inputs have the capability to provide a bus-keeper latch, pull-up resistor or pull-down resistor. a fourth option is to provide none of these. the selection is done on a global basis. the default in both hardware and software is such that when the device is erased or if the user does not specify, the input structure is con?ured to be a pull-up resistor. each ispmach 4000 device i/o has an individually programmable output slew rate control bit. each output can be individually con?ured for fast slew or slow slew. the typical edge rate difference between fast and slow slew set- ting is 20%. for high-speed designs with long, unterminated traces, the slow-slew rate will introduce fewer re?c- tions, less noise and keep ground bounce to a minimum. for designs with short traces or well terminated lines, the fast slew rate can be used to achieve the highest speed. global oe generation most ispmach 4000 family devices have a 4-bit wide global oe bus, except the ispmach 4032 device that has a 2-bit wide global oe bus. this bus is derived from a 4-bit internal global oe pt bus and two dual purpose i/o or goe pins. each signal that drives the bus can optionally be inverted. each glb has a block-level oe pt that connects to all bits of the global oe pt bus with four fuses. hence, for a 256-macrocell device (with 16 blocks), each line of the bus is driven from 16 oe product terms. figures 9 and 10 show a graphical representation of the global oe generation. figure 9. global oe generation for all devices except ispmach 4032 shared ptoe (block 0) shared ptoe (block n) global fuses goe (0:3) to i/o cells internal global oe pt bus (4 lines) 4-bit global oe bus global oe fuse connection hard wired
lattice semiconductor ispmach 4000v/b/c/z family data sheet 13 figure 10. global oe generation for ispmach 4032 zero power/low power and power management the ispmach 4000 family is designed with high speed low power design techniques to offer both high speed and low power. with an advanced e 2 low power cell and non sense-ampli?r design approach (full cmos logic approach), the ispmach 4000 family offers superfast pin-to-pin speeds, while simultaneously delivering low standby power without needing any ?urbo bits or other power management schemes associated with a traditional sense-ampli?r approach. the zero power ispmach 4000z is based on the 1.8v ispmach 4000c family. with innovative circuit design changes, the ispmach 4000z family is able to achieve the industrys ?owest static power? ieee 1149.1-compliant boundary scan testability all ispmach 4000 devices have boundary scan cells and are compliant to the ieee 1149.1 standard. this allows functional testing of the circuit board on which the device is mounted through a serial scan path that can access all critical logic notes. internal registers are linked internally, allowing test data to be shifted in and loaded directly onto test nodes, or test node data to be captured and shifted out for veri?ation. in addition, these devices can be linked into a board-level serial scan path for more board-level testing. the test access port operates with an lvcmos interface that corresponds to the power supply voltage. i/o quick con?uration to facilitate the most ef?ient board test, the physical nature of the i/o cells must be set before running any continu- ity tests. as these tests are fast, by nature, the overhead and time that is required for con?uration of the i/os physical nature should be minimal so that board test time is minimized. the ispmach 4000 family of devices allows this by offering the user the ability to quickly con?ure the physical nature of the i/o cells. this quick con?uration takes milliseconds to complete, whereas it takes seconds for the entire device to be programmed. lattice's ispvm system programming software can either perform the quick con?uration through the pc parallel port, or can gen- erate the ate or test vectors necessary for a third-party test system. shared ptoe (block 0) shared ptoe (block 1) global fuses goe (3:0) to i/o cells internal global oe pt bus (2 lines) 4-bit global oe bus global oe fuse connection hard wired
lattice semiconductor ispmach 4000v/b/c/z family data sheet 14 ieee 1532-compliant in-system programming programming devices in-system provides a number of signi?ant bene?s including: rapid prototyping, lower inven- tory levels, higher quality and the ability to make in-?ld modi?ations. all ispmach 4000 devices provide in-sys- tem programming (isp) capability through the boundary scan test access port. this capability has been implemented in a manner that ensures that the port remains complaint to the ieee 1149.1 standard. by using ieee 1149.1 as the communication interface through which isp is achieved, users get the bene? of a standard, well- de?ed interface. all ispmach 4000 devices are also compliant with the ieee 1532 standard. the ispmach 4000 devices can be programmed across the commercial temperature and voltage range. the pc- based lattice software facilitates in-system programming of ispmach 4000 devices. the software takes the jedec ?e output produced by the design implementation software, along with information about the scan chain, and creates a set of vectors used to drive the scan chain. the software can use these vectors to drive a scan chain via the parallel port of a pc. alternatively, the software can output ?es in formats understood by common auto- mated test equipment. this equipment can then be used to program ispmach 4000 devices during the testing of a circuit board. user electronic signature the user electronic signature (ues) allows the designer to include identi?ation bits or serial numbers inside the device, stored in e 2 cmos memory. the ispmach 4000 device contains 32 ues bits that can be con?ured by the user to store unique data such as id codes, revision numbers or inventory control codes. security bit a programmable security bit is provided on the ispmach 4000 devices as a deterrent to unauthorized copying of the array con?uration patterns. once programmed, this bit defeats readback of the programmed pattern by a device programmer, securing proprietary designs from competitors. programming and veri?ation are also defeated by the security bit. the bit can only be reset by erasing the entire device. hot socketing the ispmach 4000 devices are well-suited for applications that require hot socketing capability. hot socketing a device requires that the device, during power-up and down, can tolerate active signals on the i/os and inputs with- out being damaged. additionally, it requires that the effects of i/o pin loading be minimal on active signals. the ispmach 4000 devices provide this capability for input voltages in the range 0v to 3.0v. density migration the ispmach 4000 family has been designed to ensure that different density devices in the same package have the same pin-out. furthermore, the architecture ensures a high success rate when performing design migration from lower density parts to higher density parts. in many cases, it is possible to shift a lower utilization design tar- geted for a high density device to a lower density device. however, the exact details of the ?al resource utilization will impact the likely success in each case.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 15 absolute maximum ratings 1, 2, 3 ispmach 4000c/z ispmach 4000b ispmach 4000v (1.8v) (2.5v) (3.3v) supply voltage (v cc ) . . . . . . . . . . . . . . . . . . . . . . -0.5 to 2.5v . . . . . . . . . .-0.5 to 5.5v . . . . . . . . . . . -0.5 to 5.5v output supply voltage (v cco ) . . . . . . . . . . . . . . . -0.5 to 4.5v . . . . . . . . . .-0.5 to 4.5v . . . . . . . . . . . -0.5 to 4.5v input or i/o tristate voltage applied 4, 5 . . . . . . . . . -0.5 to 5.5v . . . . . . . . . .-0.5 to 5.5v . . . . . . . . . . . -0.5 to 5.5v storage temperature . . . . . . . . . . . . . . . . . . . . . . -65 to 150 c. . . . . . . . . -65 to 150 c . . . . . . . . . .-65 to 150 c junction temperature (t j ) with power applied . . . -55 to 150 c. . . . . . . . . -55 to 150 c . . . . . . . . . .-55 to 150 c 1. stress above those listed under the ?bsolute maximum ratings may cause permanent damage to the device. functional operation of the device at these or any other conditions above those indicated in the operational sections of this speci?ation is not implied. 2. compliance with lattice thermal management document is required. 3. all voltages referenced to gnd. 4. undershoot of -2v and overshoot of (v ih (max) + 2v), up to a total pin voltage of 6.0v, is permitted for a duration of < 20ns. 5. maximum of 64 i/os per device with vin > 3.6v is allowed. recommended operating conditions erase reprogram speci?ations hot socketing characteristics 1,2,3 symbol parameter min. max. units v cc supply voltage for 1.8v devices ispmach 4000c 1.65 1.95 v ispmach 4000z 1.7 1.9 v ispmach 4000z, extended functional voltage operation 1.6 1, 2 1.9 v supply voltage for 2.5v devices 2.3 2.7 v supply voltage for 3.3v devices 3.0 3.6 v t j junction temperature (commercial) 0 90 c junction temperature (industrial) -40 105 c junction temperature (extended) -40 130 c 1. devices operating at 1.6v can expect performance degradation up to 35%. 2. applicable for devices with 2004 date codes and later. contact factory for ordering instructions. parameter min. max. units erase/reprogram cycle 1,000 cycles note: valid over commercial temperature range. symbol parameter condition min. typ. max. units i dk input or i/o leakage current 0 v in 3.0v, tj = 105? ?0 ?50 ? 0 v in 3.0v, tj = 130? ?0 ?00 ? 1. insensitive to sequence of v cc or v cco. however, assumes monotonic rise/fall rates for v cc and v cco, provided (v in - v cco ) 3.6v. 2. 0 < v cc < v cc (max), 0 < v cco < v cco (max). 3. i dk is additive to i pu , i pd or i bh . device defaults to pull-up until fuse circuitry is active.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 16 i/o recommended operating conditions dc electrical characteristics over recommended operating conditions standard v cco (v) 1 min. max. lvttl 3.0 3.6 lvcmos 3.3 3.0 3.6 extended lvcmos 3.3 2 2.7 3.6 lvcmos 2.5 2.3 2.7 lvcmos 1.8 1.65 1.95 pci 3.3 3.0 3.6 1. typical values for v cco are the average of the min. and max. values. 2. ispmach 4000z only. symbol parameter condition min. typ. max. units i il , i ih 1, 4 input leakage current (ispmach 4000z) 0 v in < v cco 0.5 1 a i ih 1 input high leakage current (ispmach 4000z) v cco < v in 5.5v 10 ? i il , i ih 1 input leakage current (ispmach 4000v/b/c) 0 v in 3.6v, t j = 105? 10 ? 0 v in 3.6v, t j = 130? 15 ? i ih 1,2 input high leakage current (ispmach 4000v/b/c) 3.6v < v in 5.5v, t j = 105? 3.0v v cco 3.6v 20 ? 3.6v < v in 5.5v, t j = 130? 3.0v v cco 3.6v 50 ? i pu i/o weak pull-up resistor current (ispmach 4000z) 0 v in 0.7v cco -30 -150 ? i/o weak pull-up resistor current (ispmach 4000v/b/c) 0 v in 0.7v cco -30 -200 ? i pd i/o weak pull-down resistor current v il (max) v in v ih (min) 30 150 ? i bhls bus hold low sustaining current v in = v il (max) 30 ? i bhhs bus hold high sustaining current v in = 0.7 v cco -30 ? i bhlo bus hold low overdrive current 0v v in v bht 150 ? i bhho bus hold high overdrive current v bht v in v cco -150 ? v bht bus hold trip points v cco * 0.35 v cco * 0.65 v c 1 i/o capacitance 3 v cco = 3.3v, 2.5v, 1.8v 8 pf v cc = 1.8v, v io = 0 to v ih (max) c 2 clock capacitance 3 v cco = 3.3v, 2.5v, 1.8v 6 pf v cc = 1.8v, v io = 0 to v ih (max) c 3 global input capacitance 3 v cco = 3.3v, 2.5v, 1.8v 6 pf v cc = 1.8v, v io = 0 to v ih (max) 1. input or i/o leakage current is measured with the pin con?ured as an input or as an i/o with the output driver tristated. i t is not measured with the output driver active. bus maintenance circuits are disabled. 2. 5v tolerant inputs and i/o should only be placed in banks where 3.0v v cco 3.6v. 3. t a = 25?, f = 1.0mhz 4. i ih excursions of up to 1.5? maximum per pin above the spec limit may be observed for certain voltage conditions on no more than 10% of the devices i/o pins.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 17 supply current, ispmach 4000v/b/c over recommended operating conditions symbol parameter condition min. typ. max. units ispmach 4032v/b/c icc 1,2,3 operating power supply current vcc = 3.3v 11.8 ma vcc = 2.5v 11.8 ma vcc = 1.8v 1.8 ma icc 4 standby power supply current vcc = 3.3v 11.3 ma vcc = 2.5v 11.3 ma vcc = 1.8v 1.3 ma ispmach 4064v/b/c icc 1,2,3 operating power supply current vcc = 3.3v 12 ma vcc = 2.5v 12 ma vcc = 1.8v 2 ma icc 5 standby power supply current vcc = 3.3v 11.5 ma vcc = 2.5v 11.5 ma vcc = 1.8v 1.5 ma ispmach 4128v/b/c icc 1,2,3 operating power supply current vcc = 3.3v 12 ma vcc = 2.5v 12 ma vcc = 1.8v 2 ma icc 4 standby power supply current vcc = 3.3v 11.5 ma vcc = 2.5v 11.5 ma vcc = 1.8v 1.5 ma ispmach 4256v/b/c i cc 1,2,3 operating power supply current vcc = 3.3v 12.5 ma vcc = 2.5v 12.5 ma vcc = 1.8v 2.5 ma i cc 4 standby power supply current vcc = 3.3v 12 ma vcc = 2.5v 12 ma vcc = 1.8v 2 ma ispmach 4384v/b/c i cc 1,2,3 operating power supply current vcc = 3.3v 13.5 ma vcc = 2.5v 13.5 ma vcc = 1.8v 3.5 ma i cc 4 standby power supply current vcc = 3.3v 12.5 ma vcc = 2.5v 12.5 ma vcc = 1.8v 2.5 ma ispmach 4512v/b/c i cc 1,2,3 operating power supply current vcc = 3.3v 14 ma vcc = 2.5v 14 ma vcc = 1.8v 4 ma
lattice semiconductor ispmach 4000v/b/c/z family data sheet 18 i cc 4 standby power supply current vcc = 3.3v 13 ma vcc = 2.5v 13 ma vcc = 1.8v 3 ma 1. t a = 25?, frequency = 1.0 mhz. 2. device con?ured with 16-bit counters. 3. i cc varies with speci? device con?uration and operating frequency. 4. t a = 25? supply current, ispmach 4000z over recommended operating conditions symbol parameter condition min. typ. max. units ispmach 4032zc icc 1, 2, 3, 5 operating power supply current vcc = 1.8v, t a = 25? 50 ? vcc = 1.9v, t a = 70? 58 ? vcc = 1.9v, t a = 85? 60 ? vcc = 1.9v, t a = 125? 70 ? icc 4, 5 standby power supply current vcc = 1.8v, t a = 25? 10 ? vcc = 1.9v, t a = 70? 13 20 a vcc = 1.9v, t a = 85? 15 25 a vcc = 1.9v, t a = 125? 22 ? ispmach 4064zc icc 1, 2, 3, 5 operating power supply current vcc = 1.8v, t a = 25? 80 ? vcc = 1.9v, t a = 70? 89 ? vcc = 1.9v, t a = 85? 92 ? vcc = 1.9v, t a = 125? 109 a icc 4, 5 standby power supply current vcc = 1.8v, t a = 25? 11 ? vcc = 1.9v, t a = 70? 15 25 a vcc = 1.9v, t a = 85? 18 35 a vcc = 1.9v, t a = 125? 37 ? ispmach 4128zc icc 1, 2, 3, 5 operating power supply current vcc = 1.8v, t a = 25? 168 a vcc = 1.9v, t a = 70? 190 a vcc = 1.9v, t a = 85? 195 a vcc = 1.9v, t a = 125? 212 a icc 4, 5 standby power supply current vcc = 1.8v, t a = 25? 12 ? vcc = 1.9v, t a = 70? 16 35 a vcc = 1.9v, t a = 85? 19 50 a vcc = 1.9v, t a = 125? 42 ? supply current, ispmach 4000v/b/c (cont.) over recommended operating conditions symbol parameter condition min. typ. max. units
lattice semiconductor ispmach 4000v/b/c/z family data sheet 19 ispmach 4256zc icc 1, 2, 3, 5 operating power supply current vcc = 1.8v, t a = 25? 341 a vcc = 1.9v, t a = 70? 361 a vcc = 1.9v, t a = 85? 372 a vcc = 1.9v, t a = 125? 468 a icc 4, 5 standby power supply current vcc = 1.8v, t a = 25? 13 ? vcc = 1.9v, t a = 70? 32 55 a vcc = 1.9v, t a = 85? 43 90 a vcc = 1.9v, t a = 125? 135 a 1. t a = 25?, frequency = 1.0 mhz. 2. device con?ured with 16-bit counters. 3. i cc varies with speci? device con?uration and operating frequency. 4. v cco = 3.6v, v in = 0v or v cco, bus maintenance turned off. v in above v cco will add transient current above the speci?d standby i cc . 5. includes v cco current without output loading. supply current, ispmach 4000z (cont.) over recommended operating conditions symbol parameter condition min. typ. max. units
lattice semiconductor ispmach 4000v/b/c/z family data sheet 20 i/o dc electrical characteristics over recommended operating conditions standard v il v ih v ol max (v) v oh min (v) i ol 1 (ma) i oh 1 (ma) min (v) max (v) min (v) max (v) lvttl -0.3 0.80 2.0 5.5 0.40 v cco - 0.40 8.0 -4.0 0.20 v cco - 0.20 0.1 -0.1 lvcmos 3.3 -0.3 0.80 2.0 5.5 0.40 v cco - 0.40 8.0 -4.0 0.20 v cco - 0.20 0.1 -0.1 lvcmos 2.5 -0.3 0.70 1.70 3.6 0.40 v cco - 0.40 8.0 -4.0 0.20 v cco - 0.20 0.1 -0.1 lvcmos 1.8 (4000v/b) -0.3 0.63 1.17 3.6 0.40 v cco - 0.45 2.0 -2.0 0.20 v cco - 0.20 0.1 -0.1 lvcmos 1.8 (4000c/z) -0.3 0.35 * v cc 0.65 * v cc 3.6 0.40 v cco - 0.45 2.0 -2.0 0.20 v cco - 0.20 0.1 -0.1 pci 3.3 (4000v/b) -0.3 1.08 1.5 5.5 0.1 v cco 0.9 v cco 1.5 -0.5 pci 3.3 (4000c/z) -0.3 0.3 * 3.3 * (v cc / 1.8) 0.5 * 3.3 * (v cc / 1.8) 5.5 0.1 v cco 0.9 v cco 1.5 -0.5 1. the average dc current drawn by i/os between adjacent bank gnd connections, or between the last gnd in an i/o bank and the e nd of the i/o bank, as shown in the logic signals connection table, shall not exceed n *8ma. where n is the number of i/os between bank gnd connections or between the last gnd in a bank and the end of a bank.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 21 v o output voltage (v) typical i/o output current (ma) 3.3v v cco v o output voltage (v) 0 0 0 20 40 60 80 100 10 20 30 40 50 60 0 10 20 30 40 50 60 70 2.0 1.5 1.0 0.5 0 2.0 2.5 3.0 3.5 1.5 1.0 0.5 0 2.0 2.5 1.5 1.0 0.5 typical i/o output current (ma) 1.8v v cco v o output voltage (v) i oh typical i/o output current (ma) 2.5v v cco i ol i oh i ol i oh i ol
lattice semiconductor ispmach 4000v/b/c/z family data sheet 22 ispmach 4000v/b/c external switching characteristics over recommended operating conditions parameter description 1, 2, 3 -25 -27 -3 -35 units min. max. min. max. min. max. min. max. t pd 5-pt bypass combinatorial propagation delay 2.5 2.7 3.0 3.5 ns t pd_mc 20-pt combinatorial propagation delay through macrocell 3.2 3.5 3.8 4.2 ns t s glb register setup time before clock 1.8 1.8 2.0 2.0 ns t st glb register setup time before clock with t-type register 2.0 2.0 2.2 2.2 ns t sir glb register setup time before clock, input register path 0.7 1.0 1.0 1.0 ns t sirz glb register setup time before clock with zero hold 1.7 2.0 2.0 2.0 ns t h glb register hold time after clock 0.0 0.0 0.0 0.0 ns t ht glb register hold time after clock with t-type register 0.0 0.0 0.0 0.0 ns t hir glb register hold time after clock, input register path 0.9 1.0 1.0 1.0 ns t hirz glb register hold time after clock, input register path with zero hold 0.0 0.0 0.0 0.0 ns t co glb register clock-to-output delay 2.2 2.7 2.7 2.7 ns t r external reset pin to output delay 3.5 4.0 4.4 4.5 ns t rw external reset pulse duration 1.5 1.5 1.5 1.5 - ns t ptoe/dis input to output local product term output enable/disable 4.0 4.5 5.0 5.5 ns t gptoe/dis input to output global product term output enable/disable 5.0 6.5 8.0 8.0 ns t goe/dis global oe input to output enable/disable 3.0 3.5 4.0 4.5 ns t cw global clock width, high or low 1.1 1.3 1.3 1.3 ns t gw global gate width low (for low transparent) or high (for high transparent) 1.1 1.3 1.3 1.3 ns t wir input register clock width, high or low 1.1 1.3 1.3 1.3 ns f max 4 clock frequency with internal feedback 400 333 322 322 mhz f max (ext.) clock frequency with external feedback, [1/ (t s + t co )] 250 222 212 212 mhz 1. timing numbers are based on default lvcmos 1.8 i/o buffers. use timing adjusters provided to calculate other standards. timing v.3.2 2. measured using standard switching circuit, assuming grp loading of 1 and 1 output switching. 3. pulse widths and clock widths less than minimum will cause unknown behavior. 4. standard 16-bit counter using grp feedback.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 23 ispmach 4000v/b/c external switching characteristics (cont.) over recommended operating conditions parameter description 1, 2, 3 -5 -75 -10 units min. max. min. max. min. max. t pd 5-pt bypass combinatorial propagation delay 5.0 7.5 10.0 ns t pd_mc 20-pt combinatorial propagation delay through macrocell 5.5 8.0 10.5 ns t s glb register setup time before clock 3.0 4.5 5.5 ns t st glb register setup time before clock with t-type register 3.2 4.7 5.5 ns t sir glb register setup time before clock, input register path 1.2 1.7 1.7 ns t sirz glb register setup time before clock with zero hold 2.2 2.7 2.7 ns t h glb register hold time after clock 0.0 0.0 0.0 ns t ht glb register hold time after clock with t-type register 0.0 0.0 0.0 ns t hir glb register hold time after clock, input register path 1.0 1.0 1.0 ns t hirz glb register hold time after clock, input register path with zero hold 0.0 0.0 0.0 ns t co glb register clock-to-output delay 3.4 4.5 6.0 ns t r external reset pin to output delay 6.3 9.0 10.5 ns t rw external reset pulse duration 2.0 4.0 4.0 ns t ptoe/dis input to output local product term output enable/disable 7.0 9.0 10.5 ns t gptoe/dis input to output global product term output enable/disable 9.0 10.3 12.0 ns t goe/dis global oe input to output enable/disable 5.0 7.0 8.0 ns t cw global clock width, high or low 2.2 3.3 4.0 ns t gw global gate width low (for low transparent) or high (for high transparent) 2.2 3.3 4.0 ns t wir input register clock width, high or low 2.2 3.3 4.0 ns f max 4 clock frequency with internal feedback 227 168 125 mhz f max (ext.) clock frequency with external feedback, [1/ (t s + t co )] 156 111 86 mhz 1. timing numbers are based on default lvcmos 1.8 i/o buffers. use timing adjusters provided to calculate other standards. timing v.3.2 2. measured using standard switching circuit, assuming grp loading of 1 and 1 output switching. 3. pulse widths and clock widths less than minimum will cause unknown behavior. 4. standard 16-bit counter using grp feedback.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 24 ispmach 4000z external switching characteristics over recommended operating conditions parameter description 1, 2, 3 -35 -37 -42 units min. max. min. max. min. max. t pd 5-pt bypass combinatorial propagation delay 3.5 3.7 4.2 ns t pd_mc 20-pt combinatorial propagation delay through macrocell 4.4 4.7 5.7 ns t s glb register setup time before clock 2.2 2.5 2.7 ns t st glb register setup time before clock with t-type register 2.4 2.7 2.9 ns t sir glb register setup time before clock, input register path 1.0 1.1 1.3 ns t sirz glb register setup time before clock with zero hold 2.0 2.1 2.6 ns t h glb register hold time after clock 0.0 0.0 0.0 ns t ht glb register hold time after clock with t-type register 0.0 0.0 0.0 ns t hir glb register hold time after clock, input register path 1.0 1.0 1.3 ns t hirz glb register hold time after clock, input register path with zero hold 0.0 0.0 0.0 ns t co glb register clock-to-output delay 3.0 3.2 3.5 ns t r external reset pin to output delay 5.0 6.0 7.3 ns t rw external reset pulse duration 1.5 1.7 2.0 ns t ptoe/dis input to output local product term output enable/disable 7.0 8.0 8.0 ns t gptoe/dis input to output global product term output enable/disable 6.5 7.0 8.0 ns t goe/dis global oe input to output enable/disable 4.5 4.5 4.8 ns t cw global clock width, high or low 1.0 1.5 1.8 ns t gw global gate width low (for low transparent) or high (for high transparent) 1.0 1.5 1.8 ns t wir input register clock width, high or low 1.0 1.5 1.8 ns f max 4 clock frequency with internal feedback 267 250 220 mhz t max (ext.) clock frequency with external feedback, [1 / (t s + t co )] 192 175 161 mhz 1. timing numbers are based on default lvcmos 1.8 i/o buffers. use timing adjusters provided to calculate other standards. timing v.2.2 2. measured using standard switching grp loading of 1 and 1 output switching. 3. pulse widths and clock widths less than minimum will cause unknown behavior. 4. standard 16-bit counter using grp feedback.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 25 ispmach 4000z external switching characteristics (cont.) over recommended operating conditions parameter description 1, 2, 3 -45 -5 -75 units min. max. min. max. min. max. t pd 5-pt bypass combinatorial propagation delay 4.5 5.0 7.5 ns t pd_mc 20-pt combinatorial propagation delay through macrocell 5.8 6.0 8.0 ns t s glb register setup time before clock 2.9 3.0 4.5 ns t st glb register setup time before clock with t- type register 3.1 3.2 4.7 ns t sir glb register setup time before clock, input register path 1.3 1.3 1.4 ns t sirz glb register setup time before clock with zero hold 2.6 2.6 2.7 ns t h glb register hold time after clock 0.0 0.0 0.0 ns t ht glb register hold time after clock with t-type register 0.0 0.0 0.0 ns t hir glb register hold time after clock, input regis- ter path 1.3 1.3 1.3 ns t hirz glb register hold time after clock, input regis- ter path with zero hold 0.0 0.0 0.0 ns t co glb register clock-to-output delay 3.8 4.2 4.5 ns t r external reset pin to output delay 7.5 7.5 9.0 ns t rw external reset pulse duration 2.0 2.0 4.0 ns t ptoe/dis input to output local product term output enable/disable 8.2 8.5 9.0 ns t gptoe/dis input to output global product term output enable/disable 10.0 10.0 10.5 ns t goe/dis global oe input to output enable/disable 5.5 6.0 7.0 ns t cw global clock width, high or low 1.8 2.0 3.3 ns t gw global gate width low (for low transparent) or high (for high transparent) 1.8 2.0 3.3 ns t wir input register clock width, high or low 1.8 2.0 3.3 ns f max 4 clock frequency with internal feedback 200 200 168 mhz t max (ext.) clock frequency with external feedback, [1 / (t s + t co )] 150 139 111 mhz 1. timing numbers are based on default lvcmos 1.8 i/o buffers. use timing adjusters provided to calculate other standards. timing v.2.2 2. measured using standard switching grp loading of 1 and 1 output switching. 3. pulse widths and clock widths less than minimum will cause unknown behavior. 4. standard 16-bit counter using grp feedback.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 26 timing model the task of determining the timing through the ispmach 4000 family, like any cpld, is relatively simple. the timing model provided in figure 11 shows the speci? delay paths. once the implementation of a given function is deter- mined either conceptually or from the software report ?e, the delay path of the function can easily be determined from the timing model. the lattice design tools report the timing delays based on the same timing model for a par- ticular design. note that the internal timing parameters are given for reference only, and are not tested. the exter- nal timing parameters are tested and guaranteed for every device. for more information on the timing model and usage, please refer to technical note tn1004: ispmach 4000 timing model design and usage guidelines. figure 11. ispmach 4000 timing model data mc reg. c.e. s/r q sclk in oe in/out delays in/out delays control delays register/latch delays routing/glb delays out note: italicized items are optional delay adders. t fbk feedback from feedback t buf t pdb t mcell t ptclk t bclk t ptsr t bsr t gptoe t ptoe t exp t route t bla t inreg t indio t in t ioi t gclk_in t ioi t goe t ioi t pdi t ioo t orp t en t dis
lattice semiconductor ispmach 4000v/b/c/z family data sheet 27 ispmach 4000v/b/c internal timing parameters over recommended operating conditions parameter description -2.5 -2.7 -3 -3.5 units in/out delays t in input buffer delay 0.60 0.60 0.70 0.70 ns t goe global oe pin delay 2.04 2.54 3.04 3.54 ns t gclk_in global clock input buffer delay 0.78 1.28 1.28 1.28 ns t buf delay through output buffer 0.85 0.85 0.85 0.85 ns t en output enable time 0.96 0.96 0.96 0.96 ns t dis output disable time 0.96 0.96 0.96 0.96 ns routing/glb delays t route delay through grp 0.61 0.81 1.01 1.01 ns t mcell macrocell delay 0.45 0.55 0.55 0.65 ns t inreg input buffer to macrocell register delay 0.11 0.31 0.31 0.31 ns t fbk internal feedback delay 0.00 0.00 0.00 0.00 ns t pdb 5-pt bypass propagation delay 0.44 0.44 0.44 0.94 ns t pdi macrocell propagation delay 0.64 0.64 0.64 0.94 ns register/latch delays t s d-register setup time (global clock) 0.92 1.12 1.02 0.92 ns t s_pt d-register setup time (product term clock) 1.42 1.32 1.32 1.32 ns t st t-register setup time (global clock) 1.12 1.32 1.22 1.12 ns t st_pt t-register setup time (product term clock) 1.42 1.32 1.32 1.32 ns t h d-register hold time 0.88 0.68 0.98 1.08 ns t ht t-register hold time 0.88 0.68 0.98 1.08 ns t sir d-input register setup time (global clock) 0.82 1.37 1.27 1.27 ns t sir_pt d-input register setup time (product term clock) 1.45 1.45 1.45 1.45 ns t hir d-input register hold time (global clock) 0.88 0.63 0.73 0.73 ns t hir_pt d-input register hold time (product term clock) 0.88 0.63 0.73 0.73 ns t coi register clock to output/feedback mux time 0.52 0.52 0.52 0.52 ns t ces clock enable setup time 2.25 2.25 2.25 2.25 ns t ceh clock enable hold time 1.88 1.88 1.88 1.88 ns t sl latch setup time (global clock) 0.92 1.12 1.02 0.92 ns t sl_pt latch setup time (product term clock) 1.42 1.32 1.32 1.32 ns t hl latch hold time 1.17 1.17 1.17 1.17 ns t goi latch gate to output/feedback mux time 0.33 0.33 0.33 0.33 ns
lattice semiconductor ispmach 4000v/b/c/z family data sheet 28 t pdli propagation delay through transparent latch to output/ feedback mux 0.25 0.25 0.25 0.25 ns t sri asynchronous reset or set to output/feedback mux delay 0.28 0.28 0.28 0.28 ns t srr asynchronous reset or set recovery time 1.67 1.67 1.67 1.67 ns control delays t bclk glb pt clock delay 1.12 1.12 1.12 1.12 ns t ptclk macrocell pt clock delay 0.87 0.87 0.87 0.87 ns t bsr block pt set/reset delay 1.83 1.83 1.83 1.83 ns t ptsr macrocell pt set/reset delay 1.11 1.41 1.51 1.61 ns t gptoe global pt oe delay 2.83 4.13 5.33 5.33 ns t ptoe macrocell pt oe delay 1.83 2.13 2.33 2.83 ns timing v.3.2 note: internal timing parameters are not tested and are for reference only. refer to timing model in this data sheet for furthe r details. ispmach 4000v/b/c internal timing parameters (cont.) over recommended operating conditions parameter description -2.5 -2.7 -3 -3.5 units
lattice semiconductor ispmach 4000v/b/c/z family data sheet 29 ispmach 4000v/b/c internal timing parameters over recommended operating conditions parameter description -5 -75 -10 units min. max. min. max. min. max. in/out delays t in input buffer delay 0.95 1.50 2.00 ns t goe global oe pin delay 4.04 6.04 7.04 ns t gclk_in global clock input buffer delay 1.83 2.28 3.28 ns t buf delay through output buffer 1.00 1.50 1.50 ns t en output enable time 0.96 0.96 0.96 ns t dis output disable time 0.96 0.96 0.96 ns routing/glb delays t route delay through grp 1.51 2.26 3.26 ns t mcell macrocell delay 1.05 1.45 1.95 ns t inreg input buffer to macrocell register delay 0.56 0.96 1.46 ns t fbk internal feedback delay 0.00 0.00 0.00 ns t pdb 5-pt bypass propagation delay 1.54 2.24 3.24 ns t pdi macrocell propagation delay 0.94 1.24 1.74 ns register/latch delays t s d-register setup time (global clock) 1.32 1.57 1.57 ns t s_pt d-register setup time (product term clock) 1.32 1.32 1.32 ns t st t-register setup time (global clock) 1.52 1.77 1.77 ns t st_pt t-register setup time (product term clock) 1.32 1.32 1.32 ns t h d-register hold time 1.68 2.93 3.93 ns t ht t-register hold time 1.68 2.93 3.93 ns t sir d-input register setup time (global clock) 1.52 1.57 1.57 ns t sir_pt d-input register setup time (product term clock) 1.45 1.45 1.45 ns t hir d-input register hold time (global clock) 0.68 1.18 1.18 ns t hir_pt d-input register hold time (product term clock) 0.68 1.18 1.18 ns t coi register clock to output/feedback mux time 0.52 0.67 1.17 ns t ces clock enable setup time 2.25 2.25 2.25 ns t ceh clock enable hold time 1.88 1.88 1.88 ns t sl latch setup time (global clock) 1.32 1.57 1.57 ns t sl_pt latch setup time (product term clock) 1.32 1.32 1.32 ns t hl latch hold time 1.17 1.17 1.17 ns t goi latch gate to output/feedback mux time 0.33 0.33 0.33 ns t pdli propagation delay through transparent latch to output/ feedback mux 0.25 0.25 0.25 ns t sri asynchronous reset or set to output/feedback mux delay 0.28 0.28 0.28 ns t srr asynchronous reset or set recovery time 1.67 1.67 1.67 ns control delays t bclk glb pt clock delay 1.12 1.12 0.62 ns t ptclk macrocell pt clock delay 0.87 0.87 0.87 ns t bsr glb pt set/reset delay 1.83 1.83 1.83 ns t ptsr macrocell pt set/reset delay 2.51 3.41 3.41 ns
lattice semiconductor ispmach 4000v/b/c/z family data sheet 30 t gptoe global pt oe delay 5.58 5.58 5.78 ns t ptoe macrocell pt oe delay 3.58 4.28 4.28 ns timing v.3.2 note: internal timing parameters are not tested and are for reference only. refer to timing model in this data sheet for furthe r details. ispmach 4000v/b/c internal timing parameters (cont.) over recommended operating conditions parameter description -5 -75 -10 units min. max. min. max. min. max.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 31 ispmach 4000z internal timing parameters over recommended operating conditions parameter description -35 -37 -42 units min. max. min. max. min. max. in/out delays t in input buffer delay 0.75 0.80 0.75 ns t goe global oe pin delay 2.25 2.25 2.30 ns t gclk_in global clock input buffer delay 1.60 1.60 1.95 ns t buf delay through output buffer 0.75 0.90 0.90 ns t en output enable time 2.25 2.25 2.50 ns t dis output disable time 1.35 1.35 2.50 ns routing/glb delays t route delay through grp 1.60 1.60 2.15 ns t mcell macrocell delay 0.65 0.75 0.85 ns t inreg input buffer to macrocell register delay 0.91 1.00 1.00 ns t fbk internal feedback delay 0.05 0.00 0.00 ns t pdb 5-pt bypass propagation delay 0.40 0.40 0.40 ns t pdi macrocell propagation delay 0.25 0.25 0.65 ns register/latch delays t s d-register setup time (global clock) 0.80 0.95 0.90 ns t s_pt d-register setup time (product term clock) 1.35 1.95 1.90 ns t st t-register setup time (global clock) 1.00 1.15 1.10 ns t st_pt t-register setup time (product term clock) 1.55 1.75 2.10 ns t h d-register hold time 1.40 1.55 1.80 ns t ht t-resister hold time 1.40 1.55 1.80 ns t sir d-input register setup time (global clock) 0.94 0.90 1.50 ns t sir_pt d-input register setup time (product term clock) 1.45 1.45 1.45 ns t hir d-input register hold time (global clock) 1.06 1.20 1.10 ns t hir_pt d-input register hold time (product term clock) 0.88 1.00 1.00 ns t coi register clock to output/feedback mux time 0.65 0.70 0.65 ns t ces clock enable setup time 1.00 2.00 2.00 ns t ceh clock enable hold time 0.00 0.00 0.00 ns t sl latch setup time (global clock) 0.80 0.95 0.90 ns t sl_pt latch setup time (product term clock) 1.55 1.95 1.90 ns t hl latch hold time 1.40 1.80 1.80 ns t goi latch gate to output/feedback mux time 0.40 0.33 0.33 ns t pdli propagation delay through transparent latch to output/ feedback mux 0.30 0.25 0.25 ns t sri asynchronous reset or set to output/feedback mux delay 0.28 0.28 1.27 ns t srr asynchronous reset or set recovery delay 2.00 1.67 1.80 ns control delays t bclk glb pt clock delay 1.30 1.50 1.55 ns t ptclk macrocell pt clock delay 1.50 1.70 1.55 ns t bsr glb pt set/reset delay 1.10 1.83 1.83 ns t ptsr macrocell pt set/reset delay 1.22 2.02 1.83 ns
lattice semiconductor ispmach 4000v/b/c/z family data sheet 32 t gptoe global pt oe delay 1.9 2.35 2.60 ns t ptoe macrocell pt oe delay 2.4 3.35 2.60 ns note: internal timing parameters are not tested and are for reference only. refer to the timing model in this data sheet for timing v.2.2 further details. ispmach 4000z internal timing parameters (cont.) over recommended operating conditions parameter description -35 -37 -42 units min. max. min. max. min. max.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 33 ispmach 4000z internal timing parameters (cont.) over recommended operating conditions parameter description -45 -5 -75 units min. max. min. max. min. max. in/out delays t in input buffer delay 0.95 1.25 1.80 ns t goe global oe pin delay 3.00 3.50 4.30 ns t gclk_in global clock input buffer delay 1.95 2.05 2.15 ns t buf delay through output buffer 1.10 1.00 1.30 ns t en output enable time 2.50 2.50 2.70 ns t dis output disable time 2.50 2.50 2.70 ns routing/glb delays t route delay through grp 2.25 2.05 2.50 ns t mcell macrocell delay 0.65 0.65 1.00 ns t inreg input buffer to macrocell register delay 1.00 1.00 1.00 ns t fbk internal feedback delay 0.35 0.05 0.05 ns t pdb 5-pt bypass propagation delay 0.20 0.70 1.90 ns t pdi macrocell propagation delay 0.45 0.65 1.00 ns register/latch delays t s d-register setup time (global clock) 1.00 1.10 1.35 ns t s_pt d-register setup time (product term clock) 2.10 1.90 2.45 ns t st t-register setup time (global clock) 1.20 1.30 1.55 ns t st_pt t-register setup time (product term clock) 2.30 2.10 2.75 ns t h d-register hold time 1.90 1.90 3.15 ns t ht t-resister hold time 1.90 1.90 3.15 ns t sir d-input register setup time (global clock) 1.30 1.10 0.75 ns t sir_pt d-input register setup time (product term clock) 1.45 1.45 1.45 ns t hir d-input register hold time (global clock) 1.30 1.50 1.95 ns t hir_pt d-input register hold time (product term clock) 1.00 1.00 1.18 ns t coi register clock to output/feedback mux time 0.75 1.15 1.05 ns t ces clock enable setup time 2.00 2.00 2.00 ns t ceh clock enable hold time 0.00 0.00 0.00 ns t sl latch setup time (global clock) 1.00 1.00 1.65 ns t sl_pt latch setup time (product term clock) 2.10 1.90 2.15 ns t hl latch hold time 2.00 2.00 1.17 ns t goi latch gate to output/feedback mux time 0.33 0.33 0.33 ns t pdli propagation delay through transparent latch to output/ feedback mux 0.25 0.25 0.25 ns t sri asynchronous reset or set to output/feedback mux delay 0.97 0.97 0.28 ns t srr asynchronous reset or set recovery delay 1.80 1.80 1.67 ns control delays t bclk glb pt clock delay 1.55 1.55 1.25 ns t ptclk macrocell pt clock delay 1.55 1.55 1.25 ns t bsr glb pt set/reset delay 1.83 1.83 1.83 ns t ptsr macrocell pt set/reset delay 1.83 1.83 2.72 ns t gptoe global pt oe delay 4.30 4.20 3.50 ns
lattice semiconductor ispmach 4000v/b/c/z family data sheet 34 t ptoe macrocell pt oe delay 2.50 2.70 2.00 ns note: internal timing parameters are not tested and are for reference only. refer to the timing model in this data sheet for timing v.2.2 further details. ispmach 4000z internal timing parameters (cont.) over recommended operating conditions parameter description -45 -5 -75 units min. max. min. max. min. max.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 35 ispmach 4000v/b/c timing adders 1 adder type base parameter description -25 -27 -3 -35 units min. max. min. max. min. max. min. max. optional delay adders t indio t inreg input register delay 0.95 1.00 1.00 1.00 ns t exp t mcell product term expander delay 0.33 0.33 0.33 0.33 ns t orp output routing pool delay 0.05 0.05 0.05 0.05 ns t bla t route additional block loading adder 0.03 0.05 0.05 0.05 ns t ioi input adjusters lvttl_in t in , t gclk_in , t goe using lvttl standard 0.60 0.60 0.60 0.60 ns lvcmos33_in t in , t gclk_in , t goe using lvcmos 3.3 standard 0.60 0.60 0.60 0.60 ns lvcmos25_in t in , t gclk_in , t goe using lvcmos 2.5 standard 0.60 0.60 0.60 0.60 ns lvcmos18_in t in , t gclk_in , t goe using lvcmos 1.8 standard 0.00 0.00 0.00 0.00 ns pci_in t in , t gclk_in , t goe using pci compatible input 0.60 0.60 0.60 0.60 ns t ioo output adjusters lvttl_out t buf , t en , t dis output con?ured as ttl buffer 0.20 0.20 0.20 0.20 ns lvcmos33_out t buf , t en , t dis output con?ured as 3.3v buffer 0.20 0.20 0.20 0.20 ns lvcmos25_out t buf , t en , t dis output con?ured as 2.5v buffer 0.10 0.10 0.10 0.10 ns lvcmos18_out t buf , t en , t dis output con?ured as 1.8v buffer 0.00 0.00 0.00 0.00 ns pci_out t buf , t en , t dis output con?ured as pci compatible buffer 0.20 0.20 0.20 0.20 ns slow slew t buf , t en output con?ured for slow slew rate 1.00 1.00 1.00 1.00 ns note: open drain timing is the same as corresponding lvcmos timing. timing v.3.2 1. refer to technical note tn1004: ispmach 4000 timing model design and usage guidelines for information regarding use of these adders.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 36 ispmach 4000v/b/c timing adders 1 (cont.) adder type base parameter description -5 -75 -10 units min. max. min. max. min. max. optional delay adders t indio t inreg input register delay 1.00 1.00 1.00 ns t exp t mcell product term expander delay 0.33 0.33 0.33 ns t orp output routing pool delay 0.05 0.05 0.05 ns t bla t route additional block loading adder 0.05 0.05 0.05 ns t ioi input adjusters lvttl_in t in , t gclk_in , t goe using lvttl standard 0.60 0.60 0.60 ns lvcmos33_in t in , t gclk_in , t goe using lvcmos 3.3 standard 0.60 0.60 0.60 ns lvcmos25_in t in , t gclk_in , t goe using lvcmos 2.5 standard 0.60 0.60 0.60 ns lvcmos18_in t in , t gclk_in , t goe using lvcmos 1.8 standard 0.00 0.00 0.00 ns pci_in t in , t gclk_in , t goe using pci compatible input 0.60 0.60 0.60 ns t ioo output adjusters lvttl_out t buf , t en , t dis output con?ured as ttl buffer 0.20 0.20 0.20 ns lvcmos33_out t buf , t en , t dis output con?ured as 3.3v buffer 0.20 0.20 0.20 ns lvcmos25_out t buf , t en , t dis output con?ured as 2.5v buffer 0.10 0.10 0.10 ns lvcmos18_out t buf , t en , t dis output con?ured as 1.8v buffer 0.00 0.00 0.00 ns pci_out t buf , t en , t dis output con?ured as pci compatible buffer 0.20 0.20 0.20 ns slow slew t buf , t en output con?ured for slow slew rate 1.00 1.00 1.00 ns note: open drain timing is the same as corresponding lvcmos timing. timing v.3.2 1. refer to technical note tn1004: ispmach 4000 timing model design and usage guidelines for information regarding use of these adders.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 37 ispmach 4000z timing adders 1 adder type base parameter description -35 -37 -42 units min. max. min. max. min. max. optional delay adders t indio t inreg input register delay 1.00 1.00 1.30 ns t exp t mcell product term expander delay 0.40 0.40 0.45 ns t orp output routing pool delay 0.40 0.40 0.40 ns t bla t route additional block load- ing adder 0.04 0.05 0.05 ns t ioi input adjusters lvttl_in t in, t gclk_in, t goe using lvttl standard 0.60 0.60 0.60 ns lvcmos33_in t in, t gclk_in, t goe using lvcmos 3.3 standard 0.60 0.60 0.60 ns lvcmos25_in t in, t gclk_in, t goe using lvcmos 2.5 standard 0.60 0.60 0.60 ns lvcmos18_in t in, t gclk_in, t goe using lvcmos 1.8 standard 0.00 0.00 0.00 ns pci_in t in, t gclk_in, t goe using pci compatible input 0.60 0.60 0.60 ns t ioo output adjusters lvttl_out t buf, t en, t dis output con?ured as ttl buffer 0.20 0.20 0.20 ns lvcmos33_out t buf, t en, t dis output con?ured as 3.3v buffer 0.20 0.20 0.20 ns lvcmos25_out t buf, t en, t dis output con?ured as 2.5v buffer 0.10 0.10 0.10 ns lvcmos18_out t buf, t en, t dis output con?ured as 1.8v buffer 0.00 0.00 0.00 ns pci_out t buf, t en, t dis output con?ured as pci compatible buffer 0.20 0.20 0.20 ns slow slew t buf, t en output con?ured for slow slew rate 1.00 1.00 1.00 ns note: open drain timing is the same as corresponding lvcmos timing. timing v.2.2 1. refer to technical note tn 1004, ispmach 4000 timing model design and usage guidelines for information regarding the use of these adders.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 38 ispmach 4000z timing adders (cont.) 1 adder type base parameter description -45 -5 -75 units min. max. min. max. min. max. optional delay adders t indio t inreg input register delay 1.30 1.30 1.30 ns t exp t mcell product term expander delay 0.45 0.45 0.50 ns t orp output routing pool delay 0.40 0.40 0.40 ns t bla t route additional block load- ing adder 0.05 0.05 0.05 ns t ioi input adjusters lvttl_in t in, t gclk_in, t goe using lvttl standard 0.60 0.60 0.60 ns lvcmos33_in t in, t gclk_in, t goe using lvcmos 3.3 standard 0.60 0.60 0.60 ns lvcmos25_in t in, t gclk_in, t goe using lvcmos 2.5 standard 0.60 0.60 0.60 ns lvcmos18_in t in, t gclk_in, t goe using lvcmos 1.8 standard 0.00 0.00 0.00 ns pci_in t in, t gclk_in, t goe using pci compatible input 0.60 0.60 0.60 ns t ioo output adjusters lvttl_out t buf, t en, t dis output con?ured as ttl buffer 0.20 0.20 0.20 ns lvcmos33_out t buf, t en, t dis output con?ured as 3.3v buffer 0.20 0.20 0.20 ns lvcmos25_out t buf, t en, t dis output con?ured as 2.5v buffer 0.10 0.10 0.10 ns lvcmos18_out t buf, t en, t dis output con?ured as 1.8v buffer 0.00 0.00 0.00 ns pci_out t buf, t en, t dis output con?ured as pci compatible buffer 0.20 0.20 0.20 ns slow slew t buf, t en output con?ured for slow slew rate 1.00 1.00 1.00 ns note: open drain timing is the same as corresponding lvcmos timing. timing v.2.2 1. refer to technical note tn 1004, ispmach 4000 timing model design and usage guidelines for information regarding use of these adders.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 39 boundary scan waveforms and timing speci?ations symbol parameter min. max. units t btcp tck [bscan test] clock cycle 40 ns t btch tck [bscan test] pulse width high 20 ns t btcl tck [bscan test] pulse width low 20 ns t btsu tck [bscan test] setup time 8 ns t bth tck [bscan test] hold time 10 ns t brf tck [bscan test] rise and fall time 50 mv/ns t btco tap controller falling edge of clock to valid output 10 ns t btoz tap controller falling edge of clock to data output disable 10 ns t btvo tap controller falling edge of clock to data output enable 10 ns t btcpsu bscan test capture register setup time 8 ns t btcph bscan test capture register hold time 10 ns t btuco bscan test update reg, falling edge of clock to valid output 25 ns t btuoz bscan test update reg, falling edge of clock to output disable 25 ns t btuov bscan test update reg, falling edge of clock to output enable 25 ns
lattice semiconductor ispmach 4000v/b/c/z family data sheet 40 power consumption power estimation coef?ients 1 device a b ispmach 4032v/b 11.3 0.010 ispmach 4032c 1.3 0.010 ispmach 4064v/b 11.5 0.010 ispmach 4064c 1.5 0.010 ispmach 4128v/b 11.5 0.011 ispmach 4128c 1.5 0.011 ispmach 4256v/b 12 0.011 ispmach 4256c 2 0.011 ispmach 4384v/b 12.5 0.013 ispmach 4384c 2.5 0.013 ispmach 4512v/b 13 0.013 ispmach 4512c 3 0.013 ispmach 4032zc 0.010 0.010 ispmach 4064zc 0.011 0.010 ispmach 4128zc 0.012 0.010 ispmach 4256zc 0.013 0.010 1. for further information about the use of these coef?ients, refer to technical note tn1005, power estimation in ispmach 4000v/b/c/z devices. 0 100 50 50 100 200 150 250 150 200 250 300 350 400 frequency (mhz) i cc (ma) i cc (ma) note: the devices are configured with maximum number of 16-bit counters, typical current at 1.8v, 25 c. 150 200 300 250 100 50 0 4032v/b 4064v/b 4128v/b 4384v/b 4256v/b 4512v/b ispmach 4000c typical i cc vs. frequency note: the devices are configured with maximum number of 16-bit counters, typical current at 3.3v, 2.5v, 25 c. 4032c 4064c 4128c 4384c 4256c 4512c ispmach 4000v/b typical i cc vs. frequency 4032zc 4064zc 4128zc 4256zc 60 80 100 40 20 0100 50 150 200 250 300 350 400 frequency (mhz) i cc (ma) 150 200 300 250 100 50 0 note: the devices are configured with maximum number of 16-bit counters, typical current at 1.8v, 25 c. ispmach 4000z typical i cc vs. frequency (preliminary information) 0300 frequency (mhz) 0
lattice semiconductor ispmach 4000v/b/c/z family data sheet 41 switching test conditions figure 12 shows the output test load that is used for ac testing. the speci? values for resistance, capacitance, voltage, and other test conditions are shown in table 11. figure 12. output test load, lvttl and lvcmos standards table 11. test fixture required components test condition r 1 r 2 c l 1 timing ref. v cco lvcmos i/o, (l -> h, h -> l) 106 106 35pf lvcmos 3.3 = 1.5v lvcmos 3.3 = 3.0v lvcmos 2.5 = v cco /2 lvcmos 2.5 = 2.3v lvcmos 1.8 = v cco /2 lvcmos 1.8 = 1.65v lvcmos i/o (z -> h) 106 35pf 1.5v 3.0v lvcmos i/o (z -> l) 106 ? 35pf 1.5v 3.0v lvcmos i/o (h -> z) 106 5pf v oh - 0.3 3.0v lvcmos i/o (l -> z) 106 ? 5pf v ol + 0.3 3.0v 1. c l includes test ?tures and probe capacitance. v cco r 1 r 2 c l dut test point 0213a/ispm4 k
lattice semiconductor ispmach 4000v/b/c/z family data sheet 42 signal descriptions ispmach 4000v/b/c orp reference table ispmach 4000z orp reference table signal names description tms input ?this pin is the ieee 1149.1 test mode select input, which is used to control the state machine. tck input ?this pin is the ieee 1149.1 test clock input pin, used to clock through the state machine. tdi input ?this pin is the ieee 1149.1 test data in pin, used to load data. tdo output ?this pin is the ieee 1149.1 test data out pin used to shift data out. goe0/io, goe1/io these pins are con?ured to be either global output enable input or as general i/o pins. gnd ground nc not connected v cc the power supply pins for logic core and jtag port. clk0/i, clk1/i, clk2/i, clk3/i these pins are con?ured to be either clk input or as an input. v cco0 , v cco1 the power supply pins for each i/o bank. yzz input/output 1 ?these are the general purpose i/o used by the logic array. y is glb reference (alpha) and z is macrocell reference (numeric). z: 0-15. ispmach 4032 y: a-b ispmach 4064 y: a-d ispmach 4128 y: a-h ispmach 4256 y: a-p ispmach 4384 y: a-p, ax-hx ispmach 4512 y: a-p, ax-px 1. in some packages, certain i/os are only available for use as inputs. see the signal connections table for details. 4032v/b/c 4064v/b/c 4128v/b/c 4256v/b/c 4384v/b/c 4512v/b/c number of i/os 30 1 32 30 2 32 64 64 92 3 96 64 96 4 128 160 128 192 128 208 number of glbs 2 2 4 4 4 8 8 8 16 16 16 16 16 16 16 16 number of i/os / glb 16 16 8 8 16 8 12 12 4 8 8 10 8 8 8 mixture of 8 & 4 5 reference orp ta b l e 16 i/os / glb 8 i/os / glb 16 i/os / glb 8 i/os / glb 12 i/os / glb 4 i/os / glb 8 i/os / glb 8 i/os / glb 10 i/os / glb 8 i/os / glb 8 i/os / glb 8 i/os / glb 4 i/os / glb 1. 32-macrocell device, 44 tqfp: 2 glbs have 15 out of 16 i/os bonded out. 2. 64-macrocells device, 44 tqfp: 2 glbs have 7 out of 8 i/os bonded out. 3. 128-macrocell device, 128 tqfp: 4 glbs have 11 out of 12 i/os 4. 256-macrocell device, 144 tqfp: 16 glbs have 6 i/os per 5. 512-macrocell device: 20 glbs have 8 i/os per, 12 glbs have 4 i/os per 4032z 4064z 4128z 4256z number of i/os 32 32 64 64 96 64 96 1 128 number of glbs 24488161616 number of i/os / glb 16 8 16 8 12 4 8 8 reference orp table 16 i/os / glb 8 i/os / glb 16 i/os / glb 8 i/os / glb 12 i/os / glb 4 i/os / glb 8 i/os / glb 8 i/os / glb 1. 256-macrocell device, 132 csbga: 16 glbs have 6 i/os per
lattice semiconductor ispmach 4000v/b/c/z family data sheet 43 ispmach 4000v/b/c/z power supply and nc connections 1 signal 44-pin tqfp 2 48-pin tqfp 2 56-ball csbga 3 100-pin tqfp 2 128-pin tqfp 2 vcc 11, 33 12, 36 k2, a9 25, 40, 75, 90 32, 51, 96, 115 vcco0 vcco (bank 0) 6 6 f3 13, 33, 95 3, 17, 30, 41, 122 vcco1 vcco (bank 1) 28 30 e8 45, 63, 83 58, 67, 81, 94, 105 gnd 12, 34 13, 37 h3, c8 1, 26, 51, 76 1, 33, 65, 97 gnd (bank 0) 5 5 d3 7, 18, 32, 96 10, 24, 40, 113, 123 gnd (bank 1) 27 29 g8 46, 57, 68, 82 49, 59, 74, 88, 104 nc 4032z : a8, b10, e1, e3, f8, f10, j1, k3 1. all grounds must be electrically connected at the board level. however, for the purposes of i/o current loading, grounds are associated with the bank shown. 2. pin orientation follows the conventional order from pin 1 marking of the top side view and counter-clockwise. 3. pin orientation a1 starts from the upper left corner of the top side view with alphabetical order ascending vertically and nu merical order ascending horizontally.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 44 ispmach 4000v/b/c/z power supply and nc connections 1 (cont.) signal 132-ball csbga 7 144-pin tqfp 4 176-pin tqfp 4 256-ball ftbga/fpbga 2, 3, 7, 9 vcc p1, a14, b7, n8 36, 57, 108, 129 42, 69, 88, 130, 157, 176 b2, b15, g8, g9, k8, k9, r2, r15 vcco0 vcco (bank 0) g3, p5, c1 8 , m2 8 , c5 3, 19, 34, 47, 136 4, 22, 40, 56, 166 d6, f4, h7, j7, l4, n6 vcco1 vcco (bank 1) m10, m14 8 , h12, a10, c13 8 64, 75, 91, 106, 119 78, 92, 110, 128, 144 d11, f13, h10, j10, l13, n11 gnd b1, p2, n14, a13 1, 37, 73, 109 2, 46 5 , 65, 90, 134, 153 a1, a16, c6, c11, f3, f14, g7, g10, h8, h9, j8, j9, k7, k10, l3, l14, p6, p11, t1, t16 gnd (bank 0) e2, k2, n4, b4 10, 18 6 , 27, 46, 127, 137 13, 31, 55, 155, 167 gnd (bank 1) n11, k13, e13, b11 55, 65, 82, 90 6 , 99, 118 67, 79, 101, 119, 143 nc 4064z: c1, c3, e1, e3, h2, j3, k1, m2, m4, n5, p7, p8, m8, p10, p11, p14, m12, k14, k12, g13, g14, e14, c13, b13, b10, c10, a7, b5, a5, a4, a1 4128z: p8, a7 4128v : 17, 20, 38, 45, 72, 89, 92, 110, 117, 144 4256v : 18, 90 1, 43, 44, 45, 89, 131, 132, 133 4256v/b/c, 128 i/o: a4, a5, a6, a11, a12, a13, a15, b5, b6, b11, b12, b14, c7, d1, d4, d5, d10, d12, d16, e1, e2, e4, e5, e7, e10, e13, e14, e15, e16, f1, f2, f15, f16, g1, g4, g5, g6, g12, g13, g14, j11, k3, k4, k15, l1, l2, l12, l15, l16, m1, m2, m3, m4, m5, m12, m13, m15, m16, n1, n2, n7, n10, n12, n14, p5, p12, r4, r5, r6, r11, r12, r16, t2, t4, t5, t6, t11, t12, t13, t15 4256v/b/c, 160 i/o: a5, a12, a15, b5, b6, b11, b12, b14, d4, d5, d12, e1, e4, e5, e13, e15, e16, f1, f2, f15, g1, g5, g12, g14, l1, l2, l12, l15, l16, m1, m2, m3, m12, m16, n1, n12, n14, p5, r4, r5, r6, r11, r12, r16, t4, t5, t12, t15 4384v/b/c: b5, b12, d5, d12, e1, e15, e16, f2, l12, m1, m2, m16, n12, r5, r12, t4 4512v/b/c: none 1. all grounds must be electrically connected at the board level. however, for the purposes of i/o current loading, grounds are associated with the bank shown. 2. internal gnds and i/o gnds (bank 0/1) are connected inside package. 3. v cco balls connect to two power planes within the package, one for v cco0 and one for v cco1 . 4. pin orientation follows the conventional order from pin 1 marking of the top side view and counter-clockwise. 5. ispmach 4384v/b/c pin 46 is tied to gnd (bank 0). 6. ispmach 4128v only. 7. pin orientation a1 starts from the upper left corner of the top side view with alphabetical order ascending vertically and nu merical order ascending horizontally. 8. ispmach 4128z and 4256z only. nc for ispmach 4064z. 9. use 256 ftbga package for all new designs. refer to pcn#14a-07 for 256 fpbga package discontinuance.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 45 ispmach 4032v/b/c and 4064v/b/c logic signal connections: 44-pin tqfp pin number bank number ispmach 4032v/b/c ispmach 4064v/b/c glb/mc/pad orp glb/mc/pad orp 1 - tdi - tdi - 2 0 a5 a^5 a10 a^5 3 0 a6 a^6 a12 a^6 4 0 a7 a^7 a14 a^7 5 0 gnd (bank 0) - gnd (bank 0) - 6 0 vcco (bank 0) - vcco (bank 0) - 7 0 a8 a^8 b0 b^0 8 0 a9 a^9 b2 b^1 9 0 a10 a^10 b4 b^2 10 - tck - tck - 11 - vcc - vcc - 12 - gnd - gnd - 13 0 a12 a^12 b8 b^4 14 0 a13 a^13 b10 b^5 15 0 a14 a^14 b12 b^6 16 0 a15 a^15 b14 b^7 17 1 clk2/i - clk2/i - 18 1 b0 b^0 c0 c^0 19 1 b1 b^1 c2 c^1 20 1 b2 b^2 c4 c^2 21 1 b3 b^3 c6 c^3 22 1 b4 b^4 c8 c^4 23 - tms - tms - 24 1 b5 b^5 c10 c^5 25 1 b6 b^6 c12 c^6 26 1 b7 b^7 c14 c^7 27 1 gnd (bank 1) - gnd (bank 1) - 28 1 vcco (bank 1) - vcco (bank 1) - 29 1 b8 b^8 d0 d^0 30 1 b9 b^9 d2 d^1 31 1 b10 b^10 d4 d^2 32 - tdo - tdo - 33 - vcc - vcc - 34 - gnd - gnd - 35 1 b12 b^12 d8 d^4 36 1 b13 b^13 d10 d^5 37 1 b14 b^14 d12 d^6 38 1 b15/goe1 b^15 d14/goe1 d^7 39 0 clk0/i - clk0/i - 40 0 a0/goe0 a^0 a0/goe0 a^0 41 0 a1 a^1 a2 a^1
lattice semiconductor ispmach 4000v/b/c/z family data sheet 46 42 0 a2 a^2 a4 a^2 43 0 a3 a^3 a6 a^3 44 0 a4 a^4 a8 a^4 ispmach 4032v/b/c/z and 4064v/b/c/z logic signal connections: 48-pin tqfp pin number bank number ispmach 4032v/b/c/z ispmach 4064v/b/c ispmach 4064z glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp 1 - tdi - tdi - tdi - 2 0 a5 a^5 a10 a^5 a8 a^5 3 0 a6 a^6 a12 a^6 a10 a^6 4 0 a7 a^7 a14 a^7 a11 a^7 5 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - 6 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - 7 0 a8 a^8 b0 b^0 b15 b^7 8 0 a9 a^9 b2 b^1 b12 b^6 9 0 a10 a^10 b4 b^2 b10 b^5 10 0 a11 a^11 b6 b^3 b8 b^4 11 - tck - tck - tck - 12 - vcc - vcc - vcc - 13 - gnd - gnd - gnd - 14 0 a12 a^12 b8 b^4 b6 b^3 15 0 a13 a^13 b10 b^5 b4 b^2 16 0 a14 a^14 b12 b^6 b2 b^1 17 0 a15 a^15 b14 b^7 b0 b^0 18 0 clk1/i - clk1/i - clk1/i - 19 1 clk2/i - clk2/i - clk2/i - 20 1 b0 b^0 c0 c^0 c0 c^0 21 1 b1 b^1 c2 c^1 c1 c^1 22 1 b2 b^2 c4 c^2 c2 c^2 23 1 b3 b^3 c6 c^3 c4 c^3 24 1 b4 b^4 c8 c^4 c6 c^4 25 - tms - tms - tms - 26 1 b5 b^5 c10 c^5 c8 c^5 27 1 b6 b^6 c12 c^6 c10 c^6 28 1 b7 b^7 c14 c^7 c11 c^7 29 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - 30 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - 31 1 b8 b^8 d0 d^0 d15 d^7 32 1 b9 b^9 d2 d^1 d12 d^6 ispmach 4032v/b/c and 4064v/b/c logic signal connections: 44-pin tqfp (cont.) pin number bank number ispmach 4032v/b/c ispmach 4064v/b/c glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 47 33 1 b10 b^10 d4 d^2 d10 d^5 34 1 b11 b^11 d6 d^3 d8 d^4 35 - tdo - tdo - tdo - 36 - vcc - vcc - vcc - 37 - gnd - gnd - gnd - 38 1 b12 b^12 d8 d^4 d6 d^3 39 1 b13 b^13 d10 d^5 d4 d^2 40 1 b14 b^14 d12 d^6 d2 d^1 41 1 b15/goe1 b^15 d14/goe1 d^7 d0/goe1 d^0 42 1 clk3/i - clk3/i - clk3/i - 43 0 clk0/i - clk0/i - clk0/i - 44 0 a0/goe0 a^0 a0/goe0 a^0 a0/goe0 a^0 45 0 a1 a^1 a2 a^1 a1 a^1 46 0 a2 a^2 a4 a^2 a2 a^2 47 0 a3 a^3 a6 a^3 a4 a^3 48 0 a4 a^4 a8 a^4 a6 a^4 ispmach 4032z and 4064z logic signal connections: 56-ball csbga ball number bank number ispmach 4032z ispmach 4064z glb/mc/pad orp glb/mc/pad orp b1 - tdi - tdi - c3 0 a5 a^5 a8 a^5 c1 0 a6 a^6 a10 a^6 d1 0 a7 a^7 a11 a^7 d3 0 gnd (bank 0) - gnd (bank 0) - e3 0 nc 1 -i 1 - e1 0 nc 1 -i 1 - f3 0 vcco (bank 0) - vcco (bank 0) - f1 0 a8 a^8 b15 b^7 g3 0 a9 a^9 b12 b^6 g1 0 a10 a^10 b10 b^5 h1 0 a11 a^11 b8 b^4 j10nc-i- k1 - tck - tck - k2 - vcc - vcc - h3 - gnd - gnd - k3 - nc 1 -i 1 - k4 0 a12 a^12 b6 b^3 h4 0 a13 a^13 b4 b^2 h5 0 a14 a^14 b2 b^1 ispmach 4032v/b/c/z and 4064v/b/c/z logic signal connections: 48-pin tqfp (cont.) pin number bank number ispmach 4032v/b/c/z ispmach 4064v/b/c ispmach 4064z glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 48 k5 0 a15 a^15 b0 b^0 h6 0 clk1/i - clk1/i - k6 1 clk2/i - clk2/i - h7 1 b0 b^0 c0 c^0 k7 1 b1 b^1 c1 c^1 k8 1 b2 b^2 c2 c^2 k9 1 b3 b^3 c4 c^3 k10 1 b4 b^4 c6 c^4 j10 - tms - tms - h8 1 b5 b^5 c8 c^5 h10 1 b6 b^6 c10 c^6 g10 1 b7 b^7 c11 c^7 g8 1 gnd (bank 1) - gnd (bank 1) - f8 1 nc 1 -i 1 - f10 1 nc 1 -i 1 - e8 1 vcco (bank 1) - vcco (bank 1) - e10 1 b8 b^8 d15 d^7 d8 1 b9 b^9 d12 d^6 d10 1 b10 b^10 d10 d^5 c10 1 b11 b^11 d8 d^4 b10 1 nc 1 -i 1 - a10 - tdo - tdo - a9 - vcc - vcc - c8 - gnd - gnd - a8 1 nc 1 -i 1 - a7 1 b12 b^12 d6 d^3 c7 1 b13 b^13 d4 d^2 c6 1 b14 b^14 d2 d^1 a6 1 b15/goe1 b^15 d0/goe1 d^0 c5 1 clk3/i - clk3/i - a5 0 clk0/i - clk0/i - c4 0 a0/goe0 a^0 a0/goe0 a^0 a4 0 a1 a^1 a1 a^1 a3 0 a2 a^2 a2 a^2 a2 0 a3 a^3 a4 a^3 a1 0 a4 a^4 a6 a^4 1. for device migration considerations, these nc pins are input signal pins in ispmach 4064z devices. ispmach 4032z and 4064z logic signal connections: 56-ball csbga (cont.) ball number bank number ispmach 4032z ispmach 4064z glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 49 ispmach 4064v/b/c/z, 4128v/b/c/z, 4256v/b/c/z logic signal connections: 100-pin tqfp pin number bank number ispmach 4064v/b/c/z ispmach 4128v/b/c/z ispmach 4256v/b/c/z glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp 1 - gnd - gnd - gnd - 2 - tdi - tdi - tdi - 3 0 a8 a^8 b0 b^0 c12 c^3 4 0 a9 a^9 b2 b^1 c10 c^2 5 0 a10 a^10 b4 b^2 c6 c^1 6 0 a11 a^11 b6 b^3 c2 c^0 7 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - 8 0 a12 a^12 b8 b^4 d12 d^3 9 0 a13 a^13 b10 b^5 d10 d^2 10 0 a14 a^14 b12 b^6 d6 d^1 11 0 a15 a^15 b13 b^7 d4 d^0 12* 0 i - i - i - 13 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - 14 0 b15 b^15 c14 c^7 e4 e^0 15 0 b14 b^14 c12 c^6 e6 e^1 16 0 b13 b^13 c10 c^5 e10 e^2 17 0 b12 b^12 c8 c^4 e12 e^3 18 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - 19 0 b11 b^11 c6 c^3 f2 f^0 20 0 b10 b^10 c5 c^2 f6 f^1 21 0 b9 b^9 c4 c^1 f10 f^2 22 0 b8 b^8 c2 c^0 f12 f^3 23* 0 i - i - i - 24 - tck - tck - tck - 25 - vcc - vcc - vcc - 26 - gnd - gnd - gnd - 27* 0 i - i - i - 28 0 b7 b^7 d13 d^7 g12 g^3 29 0 b6 b^6 d12 d^6 g10 g^2 30 0 b5 b^5 d10 d^5 g6 g^1 31 0 b4 b^4 d8 d^4 g2 g^0 32 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - 33 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - 34 0 b3 b^3 d6 d^3 h12 h^3 35 0 b2 b^2 d4 d^2 h10 h^2 36 0 b1 b^1 d2 d^1 h6 h^1 37 0 b0 b^0 d0 d^0 h2 h^0 38 0 clk1/i - clk1/i - clk1/i - 39 1 clk2/i - clk2/i - clk2/i - 40 - vcc - vcc - vcc - 41 1 c0 c^0 e0 e^0 i2 i^0
lattice semiconductor ispmach 4000v/b/c/z family data sheet 50 42 1 c1 c^1 e2 e^1 i6 i^1 43 1 c2 c^2 e4 e^2 i10 i^2 44 1 c3 c^3 e6 e^3 i12 i^3 45 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - 46 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - 47 1 c4 c^4 e8 e^4 j2 j^0 48 1 c5 c^5 e10 e^5 j6 j^1 49 1 c6 c^6 e12 e^6 j10 j^2 50 1 c7 c^7 e14 e^7 j12 j^3 51 - gnd - gnd - gnd - 52 - tms - tms - tms - 53 1 c8 c^8 f0 f^0 k12 k^3 54 1 c9 c^9 f2 f^1 k10 k^2 55 1 c10 c^10 f4 f^2 k6 k^1 56 1 c11 c^11 f6 f^3 k2 k^0 57 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - 58 1 c12 c^12 f8 f^4 l12 l^3 59 1 c13 c^13 f10 f^5 l10 l^2 60 1 c14 c^14 f12 f^6 l6 l^1 61 1 c15 c^15 f13 f^7 l4 l^0 62* 1 i - i - i - 63 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - 64 1 d15 d^15 g14 g^7 m4 m^0 65 1 d14 d^14 g12 g^6 m6 m^1 66 1 d13 d^13 g10 g^5 m10 m^2 67 1 d12 d^12 g8 g^4 m12 m^3 68 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - 69 1 d11 d^11 g6 g^3 n2 n^0 70 1 d10 d^10 g5 g^2 n6 n^1 71 1 d9 d^9 g4 g^1 n10 n^2 72 1 d8 d^8 g2 g^0 n12 n^3 73* 1 i - i - i - 74 - tdo - tdo - tdo - 75 - vcc - vcc - vcc - 76 - gnd - gnd - gnd - 77* 1 i - i - i - 78 1 d7 d^7 h13 h^7 o12 o^3 79 1 d6 d^6 h12 h^6 o10 o^2 80 1 d5 d^5 h10 h^5 o6 o^1 81 1 d4 d^4 h8 h^4 o2 o^0 82 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - ispmach 4064v/b/c/z, 4128v/b/c/z, 4256v/b/c/z logic signal connections: 100-pin tqfp (cont.) pin number bank number ispmach 4064v/b/c/z ispmach 4128v/b/c/z ispmach 4256v/b/c/z glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 51 83 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - 84 1 d3 d^3 h6 h^3 p12 p^3 85 1 d2 d^2 h4 h^2 p10 p^2 86 1 d1 d^1 h2 h^1 p6 p^1 87 1 d0/goe1 d^0 h0/goe1 h^0 p2/oe1 p^0 88 1 clk3/i - clk3/i - clk3/i - 89 0 clk0/i - clk0/i - clk0/i - 90 - vcc - vcc - vcc - 91 0 a0/goe0 a^0 a0/goe0 a^0 a2/goe0 a^0 92 0 a1 a^1 a2 a^1 a6 a^1 93 0 a2 a^2 a4 a^2 a10 a^2 94 0 a3 a^3 a6 a^3 a12 a^3 95 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - 96 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - 97 0 a4 a^4 a8 a^4 b2 b^0 98 0 a5 a^5 a10 a^5 b6 b^1 99 0 a6 a^6 a12 a^6 b10 b^2 100 0 a7 a^7 a14 a^7 b12 b^3 *this pin is input only. ispmach 4128v/b/c logic signal connections: 128-pin tqfp pin number bank number ispmach 4128v/b/c glb/mc/pad orp 1 0 gnd - 2 0 tdi - 3 0 vcco (bank 0) - 4 0 b0 b^0 5 0 b1 b^1 6 0 b2 b^2 7 0 b4 b^3 8 0 b5 b^4 9 0 b6 b^5 10 0 gnd (bank 0) - 11 0 b8 b^6 12 0 b9 b^7 13 0 b10 b^8 14 0 b12 b^9 15 0 b13 b^10 16 0 b14 b^11 17 0 vcco (bank 0) - 18 0 c14 c^11 ispmach 4064v/b/c/z, 4128v/b/c/z, 4256v/b/c/z logic signal connections: 100-pin tqfp (cont.) pin number bank number ispmach 4064v/b/c/z ispmach 4128v/b/c/z ispmach 4256v/b/c/z glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 52 19 0 c13 c^10 20 0 c12 c^9 21 0 c10 c^8 22 0 c9 c^7 23 0 c8 c^6 24 0 gnd (bank 0) - 25 0 c6 c^5 26 0 c5 c^4 27 0 c4 c^3 28 0 c2 c^2 29 0 c0 c^0 30 0 vcco (bank 0) - 31 0 tck - 32 0 vcc - 33 0 gnd - 34 0 d14 d^11 35 0 d13 d^10 36 0 d12 d^9 37 0 d10 d^8 38 0 d9 d^7 39 0 d8 d^6 40 0 gnd (bank 0) - 41 0 vcco (bank 0) - 42 0 d6 d^5 43 0 d5 d^4 44 0 d4 d^3 45 0 d2 d^2 46 0 d1 d^1 47 0 d0 d^0 48 0 clk1/i - 49 1 gnd (bank 1) - 50 1 clk2/i - 51 1 vcc - 52 1 e0 e^0 53 1 e1 e^1 54 1 e2 e^2 55 1 e4 e^3 56 1 e5 e^4 57 1 e6 e^5 58 1 vcco (bank 1) - 59 1 gnd (bank 1) - 60 1 e8 e^6 61 1 e9 e^7 ispmach 4128v/b/c logic signal connections: 128-pin tqfp (cont.) pin number bank number ispmach 4128v/b/c glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 53 62 1 e10 e^8 63 1 e12 e^9 64 1 e14 e^11 65 1 gnd - 66 1 tms - 67 1 vcco (bank 1) - 68 1 f0 f^0 69 1 f1 f^1 70 1 f2 f^2 71 1 f4 f^3 72 1 f5 f^4 73 1 f6 f^5 74 1 gnd (bank 1) - 75 1 f8 f^6 76 1 f9 f^7 77 1 f10 f^8 78 1 f12 f^9 79 1 f13 f^10 80 1 f14 f^11 81 1 vcco (bank 1) - 82 1 g14 g^11 83 1 g13 g^10 84 1 g12 g^9 85 1 g10 g^8 86 1 g9 g^7 87 1 g8 g^6 88 1 gnd (bank 1) - 89 1 g6 g^5 90 1 g5 g^4 91 1 g4 g^3 92 1 g2 g^2 93 1 g0 g^0 94 1 vcco (bank 1) - 95 1 tdo - 96 1 vcc - 97 1 gnd - 98 1 h14 h^11 99 1 h13 h^10 100 1 h12 h^9 101 1 h10 h^8 102 1 h9 h^7 103 1 h8 h^6 104 1 gnd (bank 1) - ispmach 4128v/b/c logic signal connections: 128-pin tqfp (cont.) pin number bank number ispmach 4128v/b/c glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 54 105 1 vcco (bank 1) - 106 1 h6 h^5 107 1 h5 h^4 108 1 h4 h^3 109 1 h2 h^2 110 1 h1 h^1 111 1 h0/goe1 h^0 112 1 clk3/i - 113 0 gnd (bank 0) - 114 0 clk0/i - 115 0 vcc - 116 0 a0/goe0 a^0 117 0 a1 a^1 118 0 a2 a^2 119 0 a4 a^3 120 0 a5 a^4 121 0 a6 a^5 122 0 vcco (bank 0) - 123 0 gnd (bank 0) - 124 0 a8 a^6 125 0 a9 a^7 126 0 a10 a^8 127 0 a12 a^9 128 0 a14 a^11 ispmach 4064z, 4128z and 4256z logic signal connections: 132-ball csbga ball number bank number ispmach 4064z ispmach 4128z ispmach 4256z glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp b1 - gnd - gnd - gnd - b2 - tdi - tdi - tdi - c1 0 nc - vcco (bank 0) - vcco (bank 0) - c3 0 nc - b0 b^0 c12 c^6 c2 0 a8 a^8 b1 b^1 c10 c^5 d1 0 a9 a^9 b2 b^2 c8 c^4 d3 0 a10 a^10 b4 b^3 c6 c^3 d2 0 a11 a^11 b5 b^4 c4 c^2 e1 0 nc b6 b^5 c2 c^1 e2 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - ispmach 4128v/b/c logic signal connections: 128-pin tqfp (cont.) pin number bank number ispmach 4128v/b/c glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 55 e3 0 nc - b8 b^6 d12 d^6 f2 0 a12 a^12 b9 b^7 d10 d^5 f1 0 a13 a^13 b10 b^8 d8 d^4 f3 0 a14 a^14 b12 b^9 d6 d^3 g1 0 a15 a^15 b13 b^10 d4 d^2 g2 0 i - b14 b^11 d2 d^1 g3 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - h2 0 nc - c14 c^11 e2 e^1 h1 0 b15 b^15 c13 c^10 e4 e^2 h3 0 b14 b^14 c12 c^9 e6 e^3 j1 0 b13 b^13 c10 c^8 e8 e^4 j2 0 b12 b^12 c9 c^7 e10 e^5 j3 0 nc - c8 c^6 e12 e^6 k2 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - k1 0 nc - c6 c^5 f2 f^1 k3 0 b11 b^11 c5 c^4 f4 f^2 l2 0 b10 b^10 c4 c^3 f6 f^3 l1 0 b9 b^9 c2 c^2 f8 f^4 l3 0 b8 b^8 c1 c^1 f10 f^5 m1 0 i - c0 c^0 f12 f^6 m2 0 nc - vcco (bank 0) - vcco (bank 0) - n1 - tck - tck - tck - p1 - vcc - vcc - vcc - p2 - gnd - gnd - gnd - n2 0 i - d14 d^11 g12 g^6 p3 0 b7 b^7 d13 d^10 g10 g^5 m3 0 b6 b^6 d12 d^9 g8 g^4 n3 0 b5 b^5 d10 d^8 g6 g^3 p4 0 b4 b^4 d9 d^7 g4 g^2 m4 0 nc - d8 d^6 g2 g^1 n4 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - p5 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - n5 0 nc - d6 d^5 h12 h^6 m5 0 b3 b^3 d5 d^4 h10 h^5 n6 0 b2 b^2 d4 d^3 h8 h^4 p6 0 b1 b^1 d2 d^2 h6 h^3 m6 0 b0 b^0 d1 d^1 h4 h^2 p7 0 nc - d0 d^0 h2 h^1 n7 0 clk1/i - clk1/i - clk1/i - m7 1 clk2/i - clk2/i - clk2/i - n8 - vcc - vcc - vcc - ispmach 4064z, 4128z and 4256z logic signal connections: 132-ball csbga (cont.) ball number bank number ispmach 4064z ispmach 4128z ispmach 4256z glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 56 p8 1 nc 1 -nc 1 -i 1 - m8 1 nc - e0 e^0 i2 i^1 p9 1 c0 c^0 e1 e^1 i4 i^2 n9 1 c1 c^1 e2 e^2 i6 i^3 m9 1 c2 c^2 e4 e^3 i8 i^4 n10 1 c3 c^3 e5 e^4 i10 i^5 p10 1 nc - e6 e^5 i12 i^6 m10 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - n11 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - p11 1 nc - e8 e^6 j2 j^1 m11 1 c4 c^4 e9 e^7 j4 j^2 p12 1 c5 c^5 e10 e^8 j6 j^3 n12 1 c6 c^6 e12 e^9 j8 j^4 p13 1 c7 c^7 e13 e^10 j10 j^5 p14 1 nc - e14 e^11 j12 j^6 n14 - gnd - gnd - gnd - n13 - tms - tms - tms - m14 1 nc - vcco (bank 1) - vcco (bank 1) - m12 1 nc - f0 f^0 k12 k^6 m13 1 c8 c^8 f1 f^1 k10 k^5 l14 1 c9 c^9 f2 f^2 k8 k^4 l12 1 c10 c^10 f4 f^3 k6 k^3 l13 1 c11 c^11 f5 f^4 k4 k^2 k14 1 nc - f6 f^5 k2 k^1 k13 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - k12 1 nc - f8 f^6 l12 l^6 j13 1 c12 c^12 f9 f^7 l10 l^5 j14 1 c13 c^13 f10 f^8 l8 l^4 j12 1 c14 c^14 f12 f^9 l6 l^3 h14 1 c15 c^15 f13 f^10 l4 l^2 h13 1 i - f14 f^11 l2 l^1 h12 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - g13 1 nc - g14 g^11 m2 m^1 g14 1 nc - g13 g^10 m4 m^2 g12 1 d15 d^15 g12 g^9 m6 m^3 f14 1 d14 d^14 g10 g^8 m8 m^4 f13 1 d13 d^13 g9 g^7 m10 m^5 f12 1 d12 d^12 g8 g^6 m12 m^6 e13 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - e14 1 nc - g6 g^5 n2 n^1 e12 1 d11 d^11 g5 g^4 n4 n^2 ispmach 4064z, 4128z and 4256z logic signal connections: 132-ball csbga (cont.) ball number bank number ispmach 4064z ispmach 4128z ispmach 4256z glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 57 d13 1 d10 d^10 g4 g^3 n6 n^3 d14 1 d9 d^9 g2 g^2 n8 n^4 d12 1 d8 d^8 g1 g^1 n10 n^5 c14 1 i - g0 g^0 n12 n^6 c13 1 nc - vcco (bank 1) - vcco (bank 1) - b14 - tdo - tdo - tdo - a14 - vcc - vcc - vcc - a13 - gnd - gnd - gnd - b13 1 nc - h14 h^11 o12 o^6 a12 1 i - h13 h^10 o10 o^5 c12 1 d7 d^7 h12 h^9 o8 o^4 b12 1 d6 d^6 h10 h^8 o6 o^3 a11 1 d5 d^5 h9 h^7 o4 o^2 c11 1 d4 d^4 h8 h^6 o2 o^1 b11 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - a10 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - b10 1 nc - h6 h^5 p12 p^6 c10 1 nc - h5 h^4 p10 p^5 b9 1 d3 d^3 h4 h^3 p8 p^4 a9 1 d2 d^2 h2 h^2 p6 p^3 c9 1 d1 d^1 h1 h^1 p4 p^2 a8 1 d0/goe1 d^0 h0/goe1 h^0 p2/goe1 p^1 b8 1 clk3/i - clk3/i - clk3/i - c8 0 clk0/i - clk0/i - clk0/i - b7 - vcc - vcc - vcc - a7 0 nc 1 -nc 1 -i 1 - c7 0 a0/goe0 a^0 a0/goe0 a^0 a2/goe0 a^1 a6 0 a1 a^1 a1 a^1 a4 a^2 b6 0 a2 a^2 a2 a^2 a6 a^3 c6 0 a3 a^3 a4 a^3 a8 a^4 b5 0 nc - a5 a^4 a10 a^5 a5 0 nc - a6 a^5 a12 a^6 c5 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - b4 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - a4 0 nc - a8 a^6 b2 b^1 c4 0 a4 a^4 a9 a^7 b4 b^2 a3 0 a5 a^5 a10 a^8 b6 b^3 b3 0 a6 a^6 a12 a^9 b8 b^4 a2 0 a7 a^7 a13 a^10 b10 b^5 a1 0 nc - a14 a^11 b12 b^6 1. for device migration considerations, these nc pins are input signal pins in ispmach 4256z device. ispmach 4064z, 4128z and 4256z logic signal connections: 132-ball csbga (cont.) ball number bank number ispmach 4064z ispmach 4128z ispmach 4256z glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 58 ispmach 4128v and 4256v logic signal connections: 144-pin tqfp pin number bank number ispmach 4128v ispmach 4256v glb/mc/pad orp glb/mc/pad orp 1 - gnd - gnd - 2 - tdi - tdi - 3 0 vcco (bank 0) - vcco (bank 0) - 4 0 b0 b^0 c12 c^6 5 0 b1 b^1 c10 c^5 6 0 b2 b^2 c8 c^4 7 0 b4 b^3 c6 c^3 8 0 b5 b^4 c4 c^2 9 0 b6 b^5 c2 c^1 10 0 gnd (bank 0) - gnd (bank 0) - 11 0 b8 b^6 d14 d^7 12 0 b9 b^7 d12 d^6 13 0 b10 b^8 d10 d^5 14 0 b12 b^9 d8 d^4 15 0 b13 b^10 d6 d^3 16 0 b14 b^11 d4 d^2 17 - nc 2 -i 2 - 18 0 gnd (bank 0) 1 - nc 1 - 19 0 vcco (bank 0) - vcco (bank 0) - 20 0 nc 2 -i 2 - 21 0 c14 c^11 e2 e^1 22 0 c13 c^10 e4 e^2 23 0 c12 c^9 e6 e^3 24 0 c10 c^8 e8 e^4 25 0 c9 c^7 e10 e^5 26 0 c8 c^6 e12 e^6 27 0 gnd (bank 0) - gnd (bank 0) - 28 0 c6 c^5 f2 f^1 29 0 c5 c^4 f4 f^2 30 0 c4 c^3 f6 f^3 31 0 c2 c^2 f8 f^4 32 0 c1 c^1 f10 f^5 33 0 c0 c^0 f12 f^6 34 0 vcco (bank 0) - vcco (bank 0) - 35 - tck - tck - 36 - vcc - vcc - 37 - gnd - gnd - 38 0 nc 2 -i 2 - 39 0 d14 d^11 g12 g^6 40 0 d13 d^10 g10 g^5 41 0 d12 d^9 g8 g^4 42 0 d10 d^8 g6 g^3
lattice semiconductor ispmach 4000v/b/c/z family data sheet 59 43 0 d9 d^7 g4 g^2 44 0 d8 d^6 g2 g^1 45 0 nc 2 -i 2 - 46 0 gnd (bank 0) - gnd (bank 0) - 47 0 vcco (bank 0) - vcco (bank 0) - 48 0 d6 d^5 h12 h^6 49 0 d5 d^4 h10 h^5 50 0 d4 d^3 h8 h^4 51 0 d2 d^2 h6 h^3 52 0 d1 d^1 h4 h^2 53 0 d0 d^0 h2 h^1 54 0 clk1/i - clk1/i - 55 1 gnd (bank 1) - gnd (bank 1) - 56 1 clk2/i - clk2/i - 57 - vcc - vcc - 58 1 e0 e^0 i2 i^1 59 1 e1 e^1 i4 i^2 60 1 e2 e^2 i6 i^3 61 1 e4 e^3 i8 i^4 62 1 e5 e^4 i10 i^5 63 1 e6 e^5 i12 i^6 64 1 vcco (bank 1) - vcco (bank 1) - 65 1 gnd (bank 1) - gnd (bank 1) - 66 1 e8 e^6 j2 j^1 67 1 e9 e^7 j4 j^2 68 1 e10 e^8 j6 j^3 69 1 e12 e^9 j8 j^4 70 1 e13 e^10 j10 j^5 71 1 e14 e^11 j12 j^6 72 1 nc 2 -i 2 - 73 - gnd - gnd - 74 - tms - tms - 75 1 vcco (bank 1) - vcco (bank 1) - 76 1 f0 f^0 k12 k^6 77 1 f1 f^1 k10 k^5 78 1 f2 f^2 k8 k^4 79 1 f4 f^3 k6 k^3 80 1 f5 f^4 k4 k^2 81 1 f6 f^5 k2 k^1 82 1 gnd (bank 1) - gnd (bank 1) - 83 1 f8 f^6 l14 l^7 84 1 f9 f^7 l12 l^6 85 1 f10 f^8 l10 l^5 ispmach 4128v and 4256v logic signal connections: 144-pin tqfp (cont.) pin number bank number ispmach 4128v ispmach 4256v glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 60 86 1 f12 f^9 l8 l^4 87 1 f13 f^10 l6 l^3 88 1 f14 f^11 l4 l^2 89 1 nc 2 -i 2 - 90 1 gnd (bank 1) 1 - nc 1 - 91 1 vcco (bank 1) - vcco (bank 1) - 92 1 nc 2 -i 2 - 93 1 g14 g^11 m2 m^1 94 1 g13 g^10 m4 m^2 95 1 g12 g^9 m6 m^3 96 1 g10 g^8 m8 m^4 97 1 g9 g^7 m10 m^5 98 1 g8 g^6 m12 m^6 99 1 gnd (bank 1) - gnd (bank 1) - 100 1 g6 g^5 n2 n^1 101 1 g5 g^4 n4 n^2 102 1 g4 g^3 n6 n^3 103 1 g2 g^2 n8 n^4 104 1 g1 g^1 n10 n^5 105 1 g0 g^0 n12 n^6 106 1 vcco (bank 1) - vcco (bank 1) - 107 - tdo - tdo - 108 - vcc - vcc - 109 - gnd - gnd - 110 1 nc 2 -i 2 - 111 1 h14 h^11 o12 o^6 112 1 h13 h^10 o10 o^5 113 1 h12 h^9 o8 o^4 114 1 h10 h^8 o6 o^3 115 1 h9 h^7 o4 o^2 116 1 h8 h^6 o2 o^1 117 1 nc 2 -i 2 - 118 1 gnd (bank 1) - gnd (bank 1) - 119 1 vcco (bank 1) - vcco (bank 1) - 120 1 h6 h^5 p12 p^6 121 1 h5 h^4 p10 p^5 122 1 h4 h^3 p8 p^4 123 1 h2 h^2 p6 p^3 124 1 h1 h^1 p4 p^2 125 1 h0/goe1 h^0 p2/goe1 p^1 126 1 clk3/i - clk3/i - 127 0 gnd (bank 0) - gnd (bank 0) - 128 0 clk0/i - clk0/i - ispmach 4128v and 4256v logic signal connections: 144-pin tqfp (cont.) pin number bank number ispmach 4128v ispmach 4256v glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 61 129 - vcc - vcc - 130 0 a0/goe0 a^0 a2/goe0 a^1 131 0 a1 a^1 a4 a^2 132 0 a2 a^2 a6 a^3 133 0 a4 a^3 a8 a^4 134 0 a5 a^4 a10 a^5 135 0 a6 a^5 a12 a^6 136 0 vcco (bank 0) - vcco (bank 0) - 137 0 gnd (bank 0) - gnd (bank 0) - 138 0 a8 a^6 b2 b^1 139 0 a9 a^7 b4 b^2 140 0 a10 a^8 b6 b^3 141 0 a12 a^9 b8 b^4 142 0 a13 a^10 b10 b^5 143 0 a14 a^11 b12 b^6 144 0 nc 2 -i 2 - 1. for device migration considerations, these nc pins are gnd pins for i/o banks in ispmach 4128v devices. 2. for device migration considerations, these nc pins are input signal pins in ispmach 4256v devices. ispmach 4256v/b/c/z, 4384v/b/c, 4512v/b/c, logic signal connections: 176-pin tqfp pin number bank number ispmach 4256v/b/c/z ispmach 4384v/b/c ispmach 4512v/b/c glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp 1 - nc - nc - nc - 2 - gnd - gnd - gnd - 3 - tdi - tdi - tdi - 4 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - 5 0 c14 c^7 c14 c^7 c14 c^7 6 0 c12 c^6 c12 c^6 c12 c^6 7 0 c10 c^5 c10 c^5 c10 c^5 8 0 c8 c^4 c8 c^4 c8 c^4 9 0 c6 c^3 c6 c^3 c6 c^3 10 0 c4 c^2 c4 c^2 c4 c^2 11 0 c2 c^1 c2 c^1 c2 c^1 12 0 c0 c^0 c0 c^0 c0 c^0 13 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - 14 0 d14 d^7 e14 e^7 g14 g^7 15 0 d12 d^6 e12 e^6 g12 g^6 16 0 d10 d^5 e10 e^5 g10 g^5 17 0 d8 d^4 e8 e^4 g8 g^4 18 0 d6 d^3 e6 e^3 g6 g^3 ispmach 4128v and 4256v logic signal connections: 144-pin tqfp (cont.) pin number bank number ispmach 4128v ispmach 4256v glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 62 19 0 d4 d^2 e4 e^2 g4 g^2 20 0 d2 d^1 e2 e^1 g2 g^1 21 0 d0 d^0 e0 e^0 g0 g^0 22 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - 23 0 e0 e^0 h0 h^0 j0 j^0 24 0 e2 e^1 h2 h^1 j2 j^1 25 0 e4 e^2 h4 h^2 j4 j^2 26 0 e6 e^3 h6 h^3 j6 j^3 27 0 e8 e^4 h8 h^4 j8 j^4 28 0 e10 e^5 h10 h^5 j10 j^5 29 0 e12 e^6 h12 h^6 j12 j^6 30 0 e14 e^7 h14 h^7 j14 j^7 31 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - 32 0 f0 f^0 j0 j^0 n0 n^0 33 0 f2 f^1 j2 j^1 n2 n^1 34 0 f4 f^2 j4 j^2 n4 n^2 35 0 f6 f^3 j6 j^3 n6 n^3 36 0 f8 f^4 j8 j^4 n8 n^4 37 0 f10 f^5 j10 j^5 n10 n^5 38 0 f12 f^6 j12 j^6 n12 n^6 39 0 f14 f^7 j14 j^7 n14 n^7 40 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - 41 - tck - tck - tck - 42 - vcc - vcc - vcc - 43 - nc - nc - nc - 44 - nc - nc - nc - 45 - nc - nc - nc - 46 - gnd - gnd (bank 0) - gnd - 47 0 g14 g^7 k14 k^7 o14 o^7 48 0 g12 g^6 k12 k^6 o12 o^6 49 0 g10 g^5 k10 k^5 o10 o^5 50 0 g8 g^4 k8 k^4 o8 o^4 51 0 g6 g^3 k6 k^3 o6 o^3 52 0 g4 g^2 k4 k^2 o4 o^2 53 0 g2 g^1 k2 k^1 o2 o^1 54 0 g0 g^0 k0 k^0 o0 o^0 55 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - 56 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - 57 0 h14 h^7 l14 l^7 p14 p^7 58 0 h12 h^6 l12 l^6 p12 p^6 59 0 h10 h^5 l10 l^5 p10 p^5 ispmach 4256v/b/c/z, 4384v/b/c, 4512v/b/c, logic signal connections: 176-pin tqfp (cont.) pin number bank number ispmach 4256v/b/c/z ispmach 4384v/b/c ispmach 4512v/b/c glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 63 60 0 h8 h^4 l8 l^4 p8 p^4 61 0 h6 h^3 l6 l^3 p6 p^3 62 0 h4 h^2 l4 l^2 p4 p^2 63 0 h2 h^1 l2 l^1 p2 p^1 64 0 h0 h^0 l0 l^0 p0 p^0 65 - gnd - gnd - gnd - 66 0 clk1/i - clk1/i - clk1/i - 67 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - 68 1 clk2/i - clk2/i - clk2/i - 69 - vcc - vcc - vcc - 70 1 i0 i^0 m0 m^0 ax0 ax^0 71 1 i2 i^1 m2 m^1 ax2 ax^1 72 1 i4 i^2 m4 m^2 ax4 ax^2 73 1 i6 i^3 m6 m^3 ax6 ax^3 74 1 i8 i^4 m8 m^4 ax8 ax^4 75 1 i10 i^5 m10 m^5 ax10 ax^5 76 1 i12 i^6 m12 m^6 ax12 ax^6 77 1 i14 i^7 m14 m^7 ax14 ax^7 78 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - 79 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - 80 1 j0 j^0 n0 n^0 bx0 bx^0 81 1 j2 j^1 n2 n^1 bx2 bx^1 82 1 j4 j^2 n4 n^2 bx4 bx^2 83 1 j6 j^3 n6 n^3 bx6 bx^3 84 1 j8 j^4 n8 n^4 bx8 bx^4 85 1 j10 j^5 n10 n^5 bx10 bx^5 86 1 j12 j^6 n12 n^6 bx12 bx^6 87 1 j14 j^7 n14 n^7 bx14 bx^7 88 - vcc - vcc - vcc - 89 - nc - nc - nc - 90 - gnd - gnd - gnd - 91 - tms - tms - tms - 92 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - 93 1 k14 k^7 o14 o^7 cx14 cx^7 94 1 k12 k^6 o12 o^6 cx12 cx^6 95 1 k10 k^5 o10 o^5 cx10 cx^5 96 1 k8 k^4 o8 o^4 cx8 cx^4 97 1 k6 k^3 o6 o^3 cx6 cx^3 98 1 k4 k^2 o4 o^2 cx4 cx^2 99 1 k2 k^1 o2 o^1 cx2 cx^1 100 1 k0 k^0 o0 o^0 cx0 cx^0 ispmach 4256v/b/c/z, 4384v/b/c, 4512v/b/c, logic signal connections: 176-pin tqfp (cont.) pin number bank number ispmach 4256v/b/c/z ispmach 4384v/b/c ispmach 4512v/b/c glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 64 101 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - 102 1 l14 l^7 ax14 ax^7 gx14 gx^7 103 1 l12 l^6 ax12 ax^6 gx12 gx^6 104 1 l10 l^5 ax10 ax^5 gx10 gx^5 105 1 l8 l^4 ax8 ax^4 gx8 gx^4 106 1 l6 l^3 ax6 ax^3 gx6 gx^3 107 1 l4 l^2 ax4 ax^2 gx4 gx^2 108 1 l2 l^1 ax2 ax^1 gx2 gx^1 109 1 l0 l^0 ax0 ax^0 gx0 gx^0 110 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - 111 1 m0 m^0 dx0 dx^0 jx0 jx^0 112 1 m2 m^1 dx2 dx^1 jx2 jx^1 113 1 m4 m^2 dx4 dx^2 jx4 jx^2 114 1 m6 m^3 dx6 dx^3 jx6 jx^3 115 1 m8 m^4 dx8 dx^4 jx8 jx^4 116 1 m10 m^5 dx10 dx^5 jx10 jx^5 117 1 m12 m^6 dx12 dx^6 jx12 jx^6 118 1 m14 m^7 dx14 dx^7 jx14 jx^7 119 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - 120 1 n0 n^0 fx0 fx^0 nx0 nx^0 121 1 n2 n^1 fx2 fx^1 nx2 nx^1 122 1 n4 n^2 fx4 fx^2 nx4 nx^2 123 1 n6 n^3 fx6 fx^3 nx6 nx^3 124 1 n8 n^4 fx8 fx^4 nx8 nx^4 125 1 n10 n^5 fx10 fx^5 nx10 nx^5 126 1 n12 n^6 fx12 fx^6 nx12 nx^6 127 1 n14 n^7 fx14 fx^7 nx14 nx^7 128 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - 129 - tdo - tdo - tdo - 130 - vcc - vcc - vcc - 131 - nc - nc - nc - 132 - nc - nc - nc - 133 - nc - nc - nc - 134 - gnd - gnd - gnd - 135 1 o14 o^7 gx14 gx^7 ox14 ox^7 136 1 o12 o^6 gx12 gx^6 ox12 ox^6 137 1 o10 o^5 gx10 gx^5 ox10 ox^5 138 1 o8 o^4 gx8 gx^4 ox8 ox^4 139 1 o6 o^3 gx6 gx^3 ox6 ox^3 140 1 o4 o^2 gx4 gx^2 ox4 ox^2 141 1 o2 o^1 gx2 gx^1 ox2 ox^1 ispmach 4256v/b/c/z, 4384v/b/c, 4512v/b/c, logic signal connections: 176-pin tqfp (cont.) pin number bank number ispmach 4256v/b/c/z ispmach 4384v/b/c ispmach 4512v/b/c glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 65 142 1 o0 o^0 gx0 gx^0 ox0 ox^0 143 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - 144 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - 145 1 p14 p^7 hx14 hx^7 px14 px^7 146 1 p12 p^6 hx12 hx^6 px12 px^6 147 1 p10 p^5 hx10 hx^5 px10 px^5 148 1 p8 p^4 hx8 hx^4 px8 px^4 149 1 p6 p^3 hx6 hx^3 px6 px^3 150 1 p4 p^2 hx4 hx^2 px4 px^2 151 1 p2/goe1 p^1 hx2/goe1 hx^1 px2/goe1 px^1 152 1 p0 p^0 hx0 hx^0 px0 px^0 153 - gnd - gnd - gnd - 154 1 clk3/i - clk3/i - clk3/i - 155 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - 156 0 clk0/i - clk0/i - clk0/i - 157 - vcc - vcc - vcc - 158 0 a0 a^0 a0 a^0 a0 a^0 159 0 a2/goe0 a^1 a2/goe0 a^1 a2//goe0 a^1 160 0 a4 a^2 a4 a^2 a4 a^2 161 0 a6 a^3 a6 a^3 a6 a^3 162 0 a8 a^4 a8 a^4 a8 a^4 163 0 a10 a^5 a10 a^5 a10 a^5 164 0 a12 a^6 a12 a^6 a12 a^6 165 0 a14 a^7 a14 a^7 a14 a^7 166 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - 167 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - 168 0 b0 b^0 b0 b^0 b0 b^0 169 0 b2 b^1 b2 b^1 b2 b^1 170 0 b4 b^2 b4 b^2 b4 b^2 171 0 b6 b^3 b6 b^3 b6 b^3 172 0 b8 b^4 b8 b^4 b8 b^4 173 0 b10 b^5 b10 b^5 b10 b^5 174 0 b12 b^6 b12 b^6 b12 b^6 175 0 b14 b^7 b14 b^7 b14 b^7 176 - vcc - vcc - vcc - ispmach 4256v/b/c/z, 4384v/b/c, 4512v/b/c, logic signal connections: 176-pin tqfp (cont.) pin number bank number ispmach 4256v/b/c/z ispmach 4384v/b/c ispmach 4512v/b/c glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 66 ispmach 4256v/b/c, 4384v/b/c, 4512v/b/c logic signal connections: 256-ball ftbga/fpbga ball number i/o bank ispmach 4256v/b/c 128-i/o ispmach 4256v/b/c 160-i/o ispmach 4384v/b/c ispmach 4512v/b/c glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp -- ----vcc-vcc- - - gnd - gnd - gnd - gnd - c3 - tdi - tdi - tdi - tdi - - 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - b1 0 c14 c^7 c14 c^9 c14 c^7 c14 c^7 f5 0 c12 c^6 c12 c^8 c12 c^6 c12 c^6 d3 0 c10 c^5 c10 c^7 c10 c^5 c10 c^5 c1 0 c8 c^4 c9 c^6 c8 c^4 c8 c^4 c2 0 c6 c^3 c8 c^5 c6 c^3 c6 c^3 e3 0 c4 c^2 c6 c^4 c4 c^2 c4 c^2 d2 0 c2 c^1 c4 c^3 c2 c^1 c2 c^1 f6 0 c0 c^0 c2 c^2 c0 c^0 c0 c^0 d1 0 nc - c1 c^1 f6 f^3 h0 h^0 e2 0 nc - c0 c^0 f4 f^2 h4 h^1 e4 0 nc - nc - d6 d^3 f4 f^2 g5 0 nc - nc - d4 d^2 f6 f^3 e1 0 nc - nc - nc - f8 f^4 - 0 - - vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - - 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - f2 0 nc - nc - nc - f10 f^5 f1 0 nc - nc - d2 d^1 f12 f^6 g1 0 nc - nc - d0 d^0 f14 f^7 g6 0 nc - d14 d^9 f2 f^1 h8 h^2 g4 0 nc - d12 d^8 f0 f^0 h12 h^3 h6 0 d14 d^7 d10 d^7 e14 e^7 g14 g^7 g3 0 d12 d^6 d9 d^6 e12 e^6 g12 g^6 h5 0 d10 d^5 d8 d^5 e10 e^5 g10 g^5 g2 0 d8 d^4 d6 d^4 e8 e^4 g8 g^4 h1 0 d6 d^3 d4 d^3 e6 e^3 g6 g^3 h2 0 d4 d^2 d2 d^2 e4 e^2 g4 g^2 h3 0 d2 d^1 d1 d^1 e2 e^1 g2 g^1 h4 0 d0 d^0 d0 d^0 e0 e^0 g0 g^0 - 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - - 0 - - gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - j4 0 e0 e^0 e0 e^0 h0 h^0 j0 j^0 j3 0 e2 e^1 e1 e^1 h2 h^1 j2 j^1 j2 0 e4 e^2 e2 e^2 h4 h^2 j4 j^2 j1 0 e6 e^3 e4 e^3 h6 h^3 j6 j^3 k1 0 e8 e^4 e6 e^4 h8 h^4 j8 j^4 j5 0 e10 e^5 e8 e^5 h10 h^5 j10 j^5 k2 0 e12 e^6 e9 e^6 h12 h^6 j12 j^6
lattice semiconductor ispmach 4000v/b/c/z family data sheet 67 j6 0 e14 e^7 e10 e^7 h14 h^7 j14 j^7 k3 0 nc - e12 e^8 g0 g^0 i0 i^0 k4 0 nc - e14 e^9 g2 g^1 i4 i^1 l1 0 nc - nc - i14 i^7 k0 k^0 l2 0 nc - nc - i12 i^6 k2 k^1 m1 0 nc - nc - nc - k4 k^2 - 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - - 0 - - vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - m2 0 nc - nc - nc - k6 k^3 n1 0 nc - nc - i10 i^5 k8 k^4 m3 0 nc - nc - i8 i^4 k10 k^5 m4 0 nc - f0 f^0 g4 g^2 i8 i^2 n2 0 nc - f1 f^1 g6 g^3 i12 i^3 k5 0 f0 f^0 f2 f^2 j0 j^0 n0 n^0 p1 0 f2 f^1 f4 f^3 j2 j^1 n2 n^1 k6 0 f4 f^2 f6 f^4 j4 j^2 n4 n^2 n3 0 f6 f^3 f8 f^5 j6 j^3 n6 n^3 l5 0 f8 f^4 f9 f^6 j8 j^4 n8 n^4 p2 0 f10 f^5 f10 f^7 j10 j^5 n10 n^5 l6 0 f12 f^6 f12 f^8 j12 j^6 n12 n^6 r1 0 f14 f^7 f14 f^9 j14 j^7 n14 n^7 - 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - p3 - tck - tck - tck - tck - - - vcc - vcc - vcc - vcc - - - gnd - gnd - gnd - gnd - - 0 - - gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - t2 0 nc - g14 g^9 i6 i^3 k12 k^6 m5 0 nc - g12 g^8 i4 i^2 k14 k^7 n4 0 g14 g^7 g10 g^7 k14 k^7 o14 o^7 t3 0 g12 g^6 g9 g^6 k12 k^6 o12 o^6 r3 0 g10 g^5 g8 g^5 k10 k^5 o10 o^5 m6 0 g8 g^4 g6 g^4 k8 k^4 o8 o^4 p4 0 g6 g^3 g4 g^3 k6 k^3 o6 o^3 l7 0 g4 g^2 g2 g^2 k4 k^2 o4 o^2 n5 0 g2 g^1 g1 g^1 k2 k^1 o2 o^1 m7 0 g0 g^0 g0 g^0 k0 k^0 o0 o^0 p5 0 nc - nc - g8 g^4 m0 m^0 r4 0 nc - nc - g10 g^5 m4 m^1 t4 0 nc - nc - nc - l0 l^0 - 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - - 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - ispmach 4256v/b/c, 4384v/b/c, 4512v/b/c logic signal connections: 256-ball ftbga/fpbga (cont.) ball number i/o bank ispmach 4256v/b/c 128-i/o ispmach 4256v/b/c 160-i/o ispmach 4384v/b/c ispmach 4512v/b/c glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 68 r5 0 nc - nc - nc - l4 l^1 t5 0 nc - nc - i2 i^1 l8 l^2 r6 0 nc - nc - i0 i^0 l12 l^3 t6 0 nc - h14 h^9 g12 g^6 m8 m^2 n7 0 nc - h12 h^8 g14 g^7 m12 m^3 p7 0 h14 h^7 h10 h^7 l14 l^7 p14 p^7 r7 0 h12 h^6 h9 h^6 l12 l^6 p12 p^6 l8 0 h10 h^5 h8 h^5 l10 l^5 p10 p^5 t7 0 h8 h^4 h6 h^4 l8 l^4 p8 p^4 m8 0 h6 h^3 h4 h^3 l6 l^3 p6 p^3 n8 0 h4 h^2 h2 h^2 l4 l^2 p4 p^2 r8 0 h2 h^1 h1 h^1 l2 l^1 p2 p^1 p8 0 h0 h^0 h0 h^0 l0 l^0 p0 p^0 - - gnd - gnd - gnd - gnd - t8 0 clk1/i - clk1/i - clk1/i - clk1/i - - 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - n9 1 clk2/i - clk2/i - clk2/i - clk2/i - - - vcc - vcc - vcc - vcc - p9 1 i0 i^0 i0 i^0 m0 m^0 ax0 ax^0 r9 1 i2 i^1 i1 i^1 m2 m^1 ax2 ax^1 t9 1 i4 i^2 i2 i^2 m4 m^2 ax4 ax^2 t10 1 i6 i^3 i4 i^3 m6 m^3 ax6 ax^3 r10 1 i8 i^4 i6 i^4 m8 m^4 ax8 ax^4 m9 1 i10 i^5 i8 i^5 m10 m^5 ax10 ax^5 p10 1 i12 i^6 i9 i^6 m12 m^6 ax12 ax^6 l9 1 i14 i^7 i10 i^7 m14 m^7 ax14 ax^7 n10 1 nc - i12 i^8 bx14 bx^7 dx0 dx^0 t11 1 nc - i14 i^9 bx12 bx^6 dx4 dx^1 r11 1 nc - nc - p0 p^0 ex0 ex^0 t12 1 nc - nc - p2 p^1 ex4 ex^1 n12 1 nc - nc - nc - ex8 ex^2 - 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - - 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - r12 1 nc - nc - nc - ex12 ex^3 t13 1 nc - j0 j^0 bx10 bx^5 dx8 dx^2 p12 1 nc - j1 j^1 bx8 bx^4 dx12 dx^3 m10 1 j0 j^0 j2 j^2 n0 n^0 bx0 bx^0 r13 1 j2 j^1 j4 j^3 n2 n^1 bx2 bx^1 l10 1 j4 j^2 j6 j^4 n4 n^2 bx4 bx^2 t14 1 j6 j^3 j8 j^5 n6 n^3 bx6 bx^3 m11 1 j8 j^4 j9 j^6 n8 n^4 bx8 bx^4 ispmach 4256v/b/c, 4384v/b/c, 4512v/b/c logic signal connections: 256-ball ftbga/fpbga (cont.) ball number i/o bank ispmach 4256v/b/c 128-i/o ispmach 4256v/b/c 160-i/o ispmach 4384v/b/c ispmach 4512v/b/c glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 69 r14 1 j10 j^5 j10 j^7 n10 n^5 bx10 bx^5 p13 1 j12 j^6 j12 j^8 n12 n^6 bx12 bx^6 n13 1 j14 j^7 j14 j^9 n14 n^7 bx14 bx^7 m12 1 nc - nc - p4 p^2 fx0 fx^0 t15 1 nc - nc - p6 p^3 fx2 fx^1 - - vcc - vcc - vcc - vcc - - - gnd - gnd - gnd - gnd - - 1 - - gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - p14 - tms - tms - tms - tms - - 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - l12 1 nc - nc - nc - fx4 fx^2 r16 1 nc - nc - p8 p^4 fx6 fx^3 n14 1 nc - nc - p10 p^5 fx8 fx^4 p15 1 k14 k^7 k14 k^9 o14 o^7 cx14 cx^7 l11 1 k12 k^6 k12 k^8 o12 o^6 cx12 cx^6 p16 1 k10 k^5 k10 k^7 o10 o^5 cx10 cx^5 k11 1 k8 k^4 k9 k^6 o8 o^4 cx8 cx^4 m14 1 k6 k^3 k8 k^5 o6 o^3 cx6 cx^3 k12 1 k4 k^2 k6 k^4 o4 o^2 cx4 cx^2 n15 1 k2 k^1 k4 k^3 o2 o^1 cx2 cx^1 n16 1 k0 k^0 k2 k^2 o0 o^0 cx0 cx^0 m15 1 nc - k1 k^1 bx6 bx^3 hx0 hx^0 m13 1 nc - k0 k^0 bx4 bx^2 hx4 hx^1 - 1 - - vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - - 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - m16 1 nc - nc - nc - fx10 fx^5 l15 1 nc - nc - p12 p^6 fx12 fx^6 l16 1 nc - nc - p14 p^7 fx14 fx^7 j11 1 nc - l14 l^9 bx2 bx^1 hx8 hx^2 k15 1 nc - l12 l^8 bx0 bx^0 hx12 hx^3 j12 1 l14 l^7 l10 l^7 ax14 ax^7 gx14 gx^7 k13 1 l12 l^6 l9 l^6 ax12 ax^6 gx12 gx^6 k14 1 l10 l^5 l8 l^5 ax10 ax^5 gx10 gx^5 k16 1 l8 l^4 l6 l^4 ax8 ax^4 gx8 gx^4 j16 1 l6 l^3 l4 l^3 ax6 ax^3 gx6 gx^3 j15 1 l4 l^2 l2 l^2 ax4 ax^2 gx4 gx^2 h16 1 l2 l^1 l1 l^1 ax2 ax^1 gx2 gx^1 j13 1 l0 l^0 l0 l^0 ax0 ax^0 gx0 gx^0 - 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - - 1 - - gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - j14 1 m0 m^0 m0 m^0 dx0 dx^0 jx0 jx^0 ispmach 4256v/b/c, 4384v/b/c, 4512v/b/c logic signal connections: 256-ball ftbga/fpbga (cont.) ball number i/o bank ispmach 4256v/b/c 128-i/o ispmach 4256v/b/c 160-i/o ispmach 4384v/b/c ispmach 4512v/b/c glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 70 h15 1 m2 m^1 m1 m^1 dx2 dx^1 jx2 jx^1 h14 1 m4 m^2 m2 m^2 dx4 dx^2 jx4 jx^2 h13 1 m6 m^3 m4 m^3 dx6 dx^3 jx6 jx^3 g16 1 m8 m^4 m6 m^4 dx8 dx^4 jx8 jx^4 h12 1 m10 m^5 m8 m^5 dx10 dx^5 jx10 jx^5 g15 1 m12 m^6 m9 m^6 dx12 dx^6 jx12 jx^6 h11 1 m14 m^7 m10 m^7 dx14 dx^7 jx14 jx^7 f16 1 nc - m12 m^8 cx0 cx^0 ix0 ix^0 g13 1 nc - m14 m^9 cx2 cx^1 ix4 ix^1 g14 1 nc - nc - ex14 ex^7 kx0 kx^0 f15 1 nc - nc - ex12 ex^6 kx2 kx^1 e16 1 nc - nc - nc - kx4 kx^2 - 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - - 1 - - vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - e15 1 nc - nc - nc - kx6 kx^3 g12 1 nc - nc - ex10 ex^5 kx8 kx^4 e13 1 nc - nc - ex8 ex^4 kx10 kx^5 d16 1 nc - n0 n^0 cx4 cx^2 ix8 ix^2 e14 1 nc - n1 n^1 cx6 cx^3 ix12 ix^3 g11 1 n0 n^0 n2 n^2 fx0 fx^0 nx0 nx^0 d15 1 n2 n^1 n4 n^3 fx2 fx^1 nx2 nx^1 f11 1 n4 n^2 n6 n^4 fx4 fx^2 nx4 nx^2 c16 1 n6 n^3 n8 n^5 fx6 fx^3 nx6 nx^3 f12 1 n8 n^4 n9 n^6 fx8 fx^4 nx8 nx^4 d14 1 n10 n^5 n10 n^7 fx10 fx^5 nx10 nx^5 c15 1 n12 n^6 n12 n^8 fx12 fx^6 nx12 nx^6 b16 1 n14 n^7 n14 n^9 fx14 fx^7 nx14 nx^7 - 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - c14 - tdo - tdo - tdo - tdo - - - vcc - vcc - vcc - vcc - - - gnd - gnd - gnd - gnd - - 1 - - gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - a15 1 nc - nc - ex6 ex^3 kx12 kx^6 b14 1 nc - nc - ex4 ex^2 kx14 kx^7 e12 1 o14 o^7 o14 o^9 gx14 gx^7 ox14 ox^7 a14 1 o12 o^6 o12 o^8 gx12 gx^6 ox12 ox^6 c13 1 o10 o^5 o10 o^7 gx10 gx^5 ox10 ox^5 d13 1 o8 o^4 o9 o^6 gx8 gx^4 ox8 ox^4 e11 1 o6 o^3 o8 o^5 gx6 gx^3 ox6 ox^3 b13 1 o4 o^2 o6 o^4 gx4 gx^2 ox4 ox^2 f10 1 o2 o^1 o4 o^3 gx2 gx^1 ox2 ox^1 ispmach 4256v/b/c, 4384v/b/c, 4512v/b/c logic signal connections: 256-ball ftbga/fpbga (cont.) ball number i/o bank ispmach 4256v/b/c 128-i/o ispmach 4256v/b/c 160-i/o ispmach 4384v/b/c ispmach 4512v/b/c glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 71 c12 1 o0 o^0 o2 o^2 gx0 gx^0 ox0 ox^0 e10 1 nc - o1 o^1 cx8 cx^4 mx0 mx^0 a13 1 nc - o0 o^0 cx10 cx^5 mx4 mx^1 d12 1 nc - nc - nc - lx0 lx^0 - 1 gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - gnd (bank 1) - - 1 vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - vcco (bank 1) - b12 1 nc - nc - nc - lx4 lx^1 a12 1 nc - nc - ex2 ex^1 lx8 lx^2 b11 1 nc - nc - ex0 ex^0 lx12 lx^3 a11 1 nc - p14 p^9 cx12 cx^6 mx8 mx^2 d10 1 nc - p12 p^8 cx14 cx^7 mx12 mx^3 c10 1 p14 p^7 p10 p^7 hx14 hx^7 px14 px^7 b10 1 p12 p^6 p9 p6 hx12 hx^6 px12 px^6 a10 1 p10 p^5 p8 p^5 hx10 hx^5 px10 px^5 a9 1 p8 p^4 p6 p^4 hx8 hx^4 px8 px^4 f9 1 p6 p^3 p4 p^3 hx6 hx^3 px6 px^3 b9 1 p4 p^2 p2 p^2 hx4 hx^2 px4 px^2 e9 1 p2/goe1 p^1 p1/goe1 p^1 hx2/goe1 hx^1 px2/goe1 px^1 c9 1 p0 p^0 p0 p^0 hx0 hx^0 px0 px^0 - - gnd - gnd gnd - gnd - d9 1 clk3/i - clk3/i - clk3/i - clk3/i - - 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - b8 0 clk0/i - clk0/i - clk0/i - clk0/i - - - vcc - vcc - vcc - vcc - d8 0 a0 a^0 a0 a^0 a0 a^0 a0 a^0 c8 0 a2/goe0 a^1 a1/goe0 a^1 a2/goe0 a^1 a2/goe0 a^1 a8 0 a4 a^2 a2 a^2 a4 a^2 a4 a^2 a7 0 a6 a^3 a4 a^3 a6 a^3 a6 a^3 b7 0 a8 a^4 a6 a^4 a8 a^4 a8 a^4 e8 0 a10 a^5 a8 a^5 a10 a^5 a10 a^5 d7 0 a12 a^6 a9 a^6 a12 a^6 a12 a^6 f8 0 a14 a^7 a10 a^7 a14 a^7 a14 a^7 c7 0 nc - a12 a^8 f14 f^7 d0 d^0 a6 0 nc - a14 a^9 f12 f^6 d4 d^1 b6 0 nc - nc - d14 d^7 e0 e^0 a5 0 nc - nc - d12 d^6 e4 e^1 b5 0 nc - nc - nc - e8 e^2 - 0 vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - vcco (bank 0) - - 0 gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - gnd (bank 0) - d5 0 nc - nc - nc - e12 e^3 a4 0 nc - b0 b^0 f10 f^5 d8 d^2 ispmach 4256v/b/c, 4384v/b/c, 4512v/b/c logic signal connections: 256-ball ftbga/fpbga (cont.) ball number i/o bank ispmach 4256v/b/c 128-i/o ispmach 4256v/b/c 160-i/o ispmach 4384v/b/c ispmach 4512v/b/c glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 72 e7 0 nc - b1 b^1 f8 f^4 d12 d^3 a3 0 b0 b^0 b2 b^2 b0 b^0 b0 b^0 f7 0 b2 b^1 b4 b^3 b2 b^1 b2 b^1 b4 0 b4 b^2 b6 b^4 b4 b^2 b4 b^2 c5 0 b6 b^3 b8 b^5 b6 b^3 b6 b^3 a2 0 b8 b^4 b9 b^6 b8 b^4 b8 b^4 e6 0 b10 b^5 b10 b^7 b10 b^5 b10 b^5 b3 0 b12 b^6 b12 b^8 b12 b^6 b12 b^6 c4 0 b14 b^7 b14 b^9 b14 b^7 b14 b^7 d4 0 nc - nc - d10 d^5 f0 f^0 e5 0 nc - nc - d8 d^4 f2 f^1 - - vcc - vcc - vcc - vcc - -- ----gnd-gnd- - 0 - - - - gnd (bank 0) - gnd (bank 0) - note: vcc, vcco and gnd are tied together to their respective common signal on the package substrate. see power supply and nc c on- nections table for vcc/ vcco/gnd pin de?itions. ispmach 4256v/b/c, 4384v/b/c, 4512v/b/c logic signal connections: 256-ball ftbga/fpbga (cont.) ball number i/o bank ispmach 4256v/b/c 128-i/o ispmach 4256v/b/c 160-i/o ispmach 4384v/b/c ispmach 4512v/b/c glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp glb/mc/pad orp
lattice semiconductor ispmach 4000v/b/c/z family data sheet 73 part number description ispmach 4000 family speed grade offering -25 -27 -3 -35 -37 -42 -45 -5 -75 -10 com com com com com com com com ind com ind ext ind ispmach 4032v/b/c ? ????? 1 ? ispmach 4064v/b/c ? ????? 1 ? ispmach 4128v/b/c ? ????? 1 ? ispmach 4256v/b/c ? ????? 1 ? ispmach 4384v/b/c ? ???? ? ispmach 4512v/b/c ? ???? ? ispmach 4032zc ? ????? ispmach 4064zc ? ????? ispmach 4128zc ? ??? ispmach 4256zc ? ??? 1. 3.3v only. device number 4032 = 32 macrocells 4064 = 64 macrocells 4128 = 128 macrocells 4256 = 256 macrocells 4384 = 384 macrocells 4512 = 512 macrocells lc xxxx x x ?xx xx xxx x x xx production status blank = final production es = engineering samples i/o designator (if applicable) a = 128 i/os b = 160 i/os supply voltage v = 3.3v b = 2.5v c = 1.8v power z = zero power blank = low power speed 25 = 2.5ns 27 = 2.7ns 3 = 3.0ns 35 = 3.5ns 37 = 3.7ns 42 = 4.2ns 45 = 4.5ns 5 = 5.0ns 75 = 7.5ns 10 = 10.0ns 1. for automotive aec-q100 compliant devices, refer to the la-ispmach 4000v/z automotive family data sheet (ds1017). 2. use ftbga package. fpbga package devices have been discontinued via pcn#14a-07. pin/ball count 44 (1.0mm thickness) 48 (1.0mm thickness) 56 100 128 132 144 176 256 package t = tqfp ft = ftbga f = fpbga 2 m = csbga tn = lead-free tqfp ftn= lead-free ftbga fn = lead-free fpbga 2 mn = lead-free csbg a operating temperature range c = commercial i = industrial e = extended 1 device family
lattice semiconductor ispmach 4000v/b/c/z family data sheet 74 ordering information note: ispmach 4000 devices are all dual marked except the slowest commercial speed grade ispmach 4000z devices. for example, the commercial speed grade lc4128c-5t100c is also marked with the industrial grade -75i. the commercial grade is always one speed grade faster than the associated dual mark industrial grade. the slow- est commercial speed grade ispmach 4000z devices are marked as commercial grade only. conventional packaging ispmach 4000zc (zero power, 1.8v) commercial devices device part number macrocells voltage t pd package pin/ball count i/o grade lc4032zc lc4032zc-35m56c 32 1.8 3.5 csbga 56 32 c lc4032zc-5m56c 32 1.8 5 csbga 56 32 c lc4032zc-75m56c 32 1.8 7.5 csbga 56 32 c lc4032zc-35t48c 32 1.8 3.5 tqfp 48 32 c lc4032zc-5t48c 32 1.8 5 tqfp 48 32 c lc4032zc-75t48c 32 1.8 7.5 tqfp 48 32 c lc4064zc lc4064zc-37m132c 64 1.8 3.7 csbga 132 64 c lc4064zc-5m132c 64 1.8 5 csbga 132 64 c lc4064zc-75m132c 64 1.8 7.5 csbga 132 64 c lc4064zc-37t100c 64 1.8 3.7 tqfp 100 64 c lc4064zc-5t100c 64 1.8 5 tqfp 100 64 c lc4064zc-75t100c 64 1.8 7.5 tqfp 100 64 c lc4064zc-37m56c 64 1.8 3.7 csbga 56 32 c lc4064zc-5m56c 64 1.8 5 csbga 56 32 c lc4064zc-75m56c 64 1.8 7.5 csbga 56 32 c lc4064zc-37t48c 64 1.8 3.7 tqfp 48 32 c lc4064zc-5t48c 64 1.8 5 tqfp 48 32 c lc4064zc-75t48c 64 1.8 7.5 tqfp 48 32 c lc4128zc lc4128zc-42m132c 128 1.8 4.2 csbga 132 96 c lc4128zc-75m132c 128 1.8 7.5 csbga 132 96 c lc4128zc-42t100c 128 1.8 4.2 tqfp 100 64 c lc4128zc-75t100c 128 1.8 7.5 tqfp 100 64 c lc4256zc lc4256zc-45t176c 256 1.8 4.5 tqfp 176 128 c lc4256zc-75t176c 256 1.8 7.5 tqfp 176 128 c lc4256zc-45m132c 256 1.8 4.5 csbga 132 96 c lc4256zc-75m132c 256 1.8 7.5 csbga 132 96 c lc4256zc-45t100c 256 1.8 4.5 tqfp 100 64 c lc4256zc-75t100c 256 1.8 7.5 tqfp 100 64 c ispmach 4000zc (1.8v, zero power) industrial devices device part number macrocells voltage tpd package pin/ball count i/o grade lc4032zc lc4032zc-5m56i 32 1.8 5 csbga 56 32 i lc4032zc-75m56i 32 1.8 7.5 csbga 56 32 i lc4032zc-5t48i 32 1.8 5 tqfp 48 32 i lc4032zc-75t48i 32 1.8 7.5 tqfp 48 32 i
lattice semiconductor ispmach 4000v/b/c/z family data sheet 75 lc4064zc lc4064zc-5m132i 64 1.8 5 csbga 132 64 i lc4064zc-75m132i 64 1.8 7.5 csbga 132 64 i lc4064zc-5t100i 64 1.8 5 tqfp 100 64 i lc4064zc-75t100i 64 1.8 7.5 tqfp 100 64 i lc4064zc-5m56i 64 1.8 5 csbga 56 34 i lc4064zc-75m56i 64 1.8 7.5 csbga 56 34 i lc4064zc-5t48i 64 1.8 5 tqfp 48 32 i lc4064zc-75t48i 64 1.8 7.5 tqfp 48 32 i lc4128zc lc4128zc-75m132i 128 1.8 7.5 csbga 132 96 i lc4128zc-75t100i 128 1.8 7.5 tqfp 100 64 i lc4256zc lc4256zc-75t176i 256 1.8 7.5 tqfp 176 128 i lc4256zc-75m132i 256 1.8 7.5 csbga 132 96 i lc4256zc-75t100i 256 1.8 7.5 tqfp 100 64 i ispmach 4000zc (1.8v, zero power) extended temperature devices family part number macrocells voltage t pd package pin/ball count i/o grade lc4032zc lc4032zc-75t48e 32 1.8 7.5 tqfp 48 32 e lc4064zc lc4064zc-75t100e 64 1.8 7.5 tqfp 100 64 e lc4064zc-75t48e 64 1.8 7.5 tqfp 48 32 e lc4128zc lc4128zc-75t100e 128 1.8 7.5 tqfp 100 64 e lc4256zc lc4256zc-75t176e 256 1.8 7.5 tqfp 176 128 e lc4256zc-75t100e 256 1.8 7.5 tqfp 100 64 e ispmach 4000c (1.8v) commercial devices device part number macrocells voltage t pd package pin/ball count i/o grade lc4032c lc4032c-25t48c 32 1.8 2.5 tqfp 48 32 c lc4032c-5t48c 32 1.8 5 tqfp 48 32 c lc4032c-75t48c 32 1.8 7.5 tqfp 48 32 c lc4032c-25t44c 32 1.8 2.5 tqfp 44 30 c lc4032c-5t44c 32 1.8 5 tqfp 44 30 c lc4032c-75t44c 32 1.8 7.5 tqfp 44 30 c lc4064c lc4064c-25t100c 64 1.8 2.5 tqfp 100 64 c lc4064c-5t100c 64 1.8 5 tqfp 100 64 c lc4064c-75t100c 64 1.8 7.5 tqfp 100 64 c lc4064c-25t48c 64 1.8 2.5 tqfp 48 32 c lc4064c-5t48c 64 1.8 5 tqfp 48 32 c lc4064c-75t48c 64 1.8 7.5 tqfp 48 32 c lc4064c-25t44c 64 1.8 2.5 tqfp 44 30 c lc4064c-5t44c 64 1.8 5 tqfp 44 30 c lc4064c-75t44c 64 1.8 7.5 tqfp 44 30 c ispmach 4000zc (1.8v, zero power) industrial devices (cont.) device part number macrocells voltage tpd package pin/ball count i/o grade
lattice semiconductor ispmach 4000v/b/c/z family data sheet 76 lc4128c lc4128c-27t128c 128 1.8 2.7 tqfp 128 92 c lc4128c-5t128c 128 1.8 5 tqfp 128 92 c lc4128c-75t128c 128 1.8 7.5 tqfp 128 92 c lc4128c-27t100c 128 1.8 2.7 tqfp 100 64 c lc4128c-5t100c 128 1.8 5 tqfp 100 64 c lc4128c-75t100c 128 1.8 7.5 tqfp 100 64 c lc4256c lc4256c-3ft256ac 256 1.8 3 ftbga 256 128 c lc4256c-5ft256ac 256 1.8 5 ftbga 256 128 c lc4256c-75ft256ac 256 1.8 7.5 ftbga 256 128 c lc4256c-3ft256bc 256 1.8 3 ftbga 256 160 c lc4256c-5ft256bc 256 1.8 5 ftbga 256 160 c lc4256c-75ft256bc 256 1.8 7.5 ftbga 256 160 c lc4256c-3f256ac 1 256 1.8 3 fpbga 256 128 c lc4256c-5f256ac 1 256 1.8 5 fpbga 256 128 c lc4256c-75f256ac 1 256 1.8 7.5 fpbga 256 128 c lc4256c-3f256bc 1 256 1.8 3 fpbga 256 160 c lc4256c-5f256bc 1 256 1.8 5 fpbga 256 160 c lc4256c-75f256bc 1 256 1.8 7.5 fpbga 256 160 c lc4256c-3t176c 256 1.8 3 tqfp 176 128 c lc4256c-5t176c 256 1.8 5 tqfp 176 128 c lc4256c-75t176c 256 1.8 7.5 tqfp 176 128 c lc4256c-3t100c 256 1.8 3 tqfp 100 64 c lc4256c-5t100c 256 1.8 5 tqfp 100 64 c lc4256c-75t100c 256 1.8 7.5 tqfp 100 64 c lc4384c lc4384c-35ft256c 384 1.8 3.5 ftbga 256 192 c lc4384c-5ft256c 384 1.8 5 ftbga 256 192 c lc4384c-75ft256c 384 1.8 7.5 ftbga 256 192 c lc4384c-35f256c 1 384 1.8 3.5 fpbga 256 192 c lc4384c-5f256c 1 384 1.8 5 fpbga 256 192 c lc4384c-75f256c 1 384 1.8 7.5 fpbga 256 192 c lc4384c-35t176c 384 1.8 3.5 tqfp 176 128 c lc4384c-5t176c 384 1.8 5 tqfp 176 128 c lc4384c-75t176c 384 1.8 7.5 tqfp 176 128 c lc4512c lc4512c-35ft256c 512 1.8 3.5 ftbga 256 208 c lc4512c-5ft256c 512 1.8 5 ftbga 256 208 c lc4512c-75ft256c 512 1.8 7.5 ftbga 256 208 c lc4512c-35f256c 1 512 1.8 3.5 fpbga 256 208 c lc4512c-5f256c 1 512 1.8 5 fpbga 256 208 c lc4512c-75f256c 1 512 1.8 7.5 fpbga 256 208 c lc4512c-35t176c 512 1.8 3.5 tqfp 176 128 c lc4512c-5t176c 512 1.8 5 tqfp 176 128 c lc4512c-75t176c 512 1.8 7.5 tqfp 176 128 c 1. use ftbga package. fpbga package devices have been discontinued via pcn#14a-07. ispmach 4000c (1.8v) commercial devices (cont.) device part number macrocells voltage t pd package pin/ball count i/o grade
lattice semiconductor ispmach 4000v/b/c/z family data sheet 77 ispmach 4000c (1.8v) industrial devices family part number macrocells voltage t pd package pin/ball count i/o grade lc4032c lc4032c-5t48i 32 1.8 5 tqfp 48 32 i lc4032c-75t48i 32 1.8 7.5 tqfp 48 32 i lc4032c-10t48i 32 1.8 10 tqfp 48 32 i lc4032c-5t44i 32 1.8 5 tqfp 44 30 i lc4032c-75t44i 32 1.8 7.5 tqfp 44 30 i lc4032c-10t44i 32 1.8 10 tqfp 44 30 i lc4064c lc4064c-5t100i 64 1.8 5 tqfp 100 64 i lc4064c-75t100i 64 1.8 7.5 tqfp 100 64 i lc4064c-10t100i 64 1.8 10 tqfp 100 64 i lc4064c-5t48i 64 1.8 5 tqfp 48 32 i lc4064c-75t48i 64 1.8 7.5 tqfp 48 32 i lc4064c-10t48i 64 1.8 10 tqfp 48 32 i lc4064c-5t44i 64 1.8 5 tqfp 44 30 i lc4064c-75t44i 64 1.8 7.5 tqfp 44 30 i lc4064c-10t44i 64 1.8 10 tqfp 44 30 i lc4128c lc4128c-5t128i 128 1.8 5 tqfp 128 92 i lc4128c-75t128i 128 1.8 7.5 tqfp 128 92 i lc4128c-10t128i 128 1.8 10 tqfp 128 92 i lc4128c-5t100i 128 1.8 5 tqfp 100 64 i lc4128c-75t100i 128 1.8 7.5 tqfp 100 64 i lc4128c-10t100i 128 1.8 10 tqfp 100 64 i lc4256c lc4256c-5ft256ai 256 1.8 5 ftbga 256 128 i lc4256c-75ft256ai 256 1.8 7.5 ftbga 256 128 i lc4256c-10ft256ai 256 1.8 10 ftbga 256 128 i lc4256c-5ft256bi 256 1.8 5 ftbga 256 160 i lc4256c-75ft256bi 256 1.8 7.5 ftbga 256 160 i lc4256c-10ft256bi 256 1.8 10 ftbga 256 160 i lc4256c-5f256ai 1 256 1.8 5 fpbga 256 128 i lc4256c-75f256ai 1 256 1.8 7.5 fpbga 256 128 i lc4256c-10f256ai 1 256 1.8 10 fpbga 256 128 i lc4256c-5f256bi 1 256 1.8 5 fpbga 256 160 i lc4256c-75f256bi 1 256 1.8 7.5 fpbga 256 160 i lc4256c-10f256bi 1 256 1.8 10 fpbga 256 160 i lc4256c-5t176i 256 1.8 5 tqfp 176 128 i lc4256c-75t176i 256 1.8 7.5 tqfp 176 128 i lc4256c-10t176i 256 1.8 10 tqfp 176 128 i lc4256c-5t100i 256 1.8 5 tqfp 100 64 i lc4256c-75t100i 256 1.8 7.5 tqfp 100 64 i lc4256c-10t100i 256 1.8 10 tqfp 100 64 i
lattice semiconductor ispmach 4000v/b/c/z family data sheet 78 lc4384c lc4384c-5ft256i 384 1.8 5 ftbga 256 192 i lc4384c-75ft256i 384 1.8 7.5 ftbga 256 192 i lc4384c-10ft256i 384 1.8 10 ftbga 256 192 i lc4384c-5f256i 1 384 1.8 5 fpbga 256 192 i lc4384c-75f256i 1 384 1.8 7.5 fpbga 256 192 i lc4384c-10f256i 1 384 1.8 10 fpbga 256 192 i lc4384c-5t176i 384 1.8 5 tqfp 176 128 i lc4384c-75t176i 384 1.8 7.5 tqfp 176 128 i lc4384c-10t176i 384 1.8 10 tqfp 176 128 i lc4512c lc4512c-5ft256i 512 1.8 5 ftbga 256 208 i lc4512c-75ft256i 512 1.8 7.5 ftbga 256 208 i lc4512c-10ft256i 512 1.8 10 ftbga 256 208 i lc4512c-5f256i 1 512 1.8 5 fpbga 256 208 i lc4512c-75f256i 1 512 1.8 7.5 fpbga 256 208 i lc4512c-10f256i 1 512 1.8 10 fpbga 256 208 i lc4512c-5t176i 512 1.8 5 tqfp 176 128 i lc4512c-75t176i 512 1.8 7.5 tqfp 176 128 i lc4512c-10t176i 512 1.8 10 tqfp 176 128 i 1. use ftbga package. fpbga package devices have been discontinued via pcn#14a-07. ispmach 4000b (2.5v) commercial devices device part number macrocells voltage t pd package pin/ball count i/o grade lc4032b lc4032b-25t48c 32 2.5 2.5 tqfp 48 32 c lc4032b-5t48c 32 2.5 5 tqfp 48 32 c lc4032b-75t48c 32 2.5 7.5 tqfp 48 32 c lc4032b-25t44c 32 2.5 2.5 tqfp 44 30 c lc4032b-5t44c 32 2.5 5 tqfp 44 30 c lc4032b-75t44c 32 2.5 7.5 tqfp 44 30 c lc4064b lc4064b-25t100c 64 2.5 2.5 tqfp 100 64 c lc4064b-5t100c 64 2.5 5 tqfp 100 64 c lc4064b-75t100c 64 2.5 7.5 tqfp 100 64 c lc4064b-25t48c 64 2.5 2.5 tqfp 48 32 c lc4064b-5t48c 64 2.5 5 tqfp 48 32 c lc4064b-75t48c 64 2.5 7.5 tqfp 48 32 c lc4064b-25t44c 64 2.5 2.5 tqfp 44 30 c lc4064b-5t44c 64 2.5 5 tqfp 44 30 c lc4064b-75t44c 64 2.5 7.5 tqfp 44 30 c lc4128b lc4128b-27t128c 128 2.5 2.7 tqfp 128 92 c lc4128b-5t128c 128 2.5 5 tqfp 128 92 c lc4128b-75t128c 128 2.5 7.5 tqfp 128 92 c lc4128b-27t100c 128 2.5 2.7 tqfp 100 64 c lc4128b-5t100c 128 2.5 5 tqfp 100 64 c lc4128b-75t100c 128 2.5 7.5 tqfp 100 64 c ispmach 4000c (1.8v) industrial devices (cont.) family part number macrocells voltage t pd package pin/ball count i/o grade
lattice semiconductor ispmach 4000v/b/c/z family data sheet 79 lc4256b lc4256b-3ft256ac 256 2.5 3 ftbga 256 128 c lc4256b-5ft256ac 256 2.5 5 ftbga 256 128 c lc4256b-75ft256ac 256 2.5 7.5 ftbga 256 128 c lc4256b-3ft256bc 256 2.5 3 ftbga 256 160 c lc4256b-5ft256bc 256 2.5 5 ftbga 256 160 c lc4256b-75ft256bc 256 2.5 7.5 ftbga 256 160 c lc4256b-3f256ac 1 256 2.5 3 fpbga 256 128 c lc4256b-5f256ac 1 256 2.5 5 fpbga 256 128 c lc4256b-75f256ac 1 256 2.5 7.5 fpbga 256 128 c lc4256b-3f256bc 1 256 2.5 3 fpbga 256 160 c lc4256b-5f256bc 1 256 2.5 5 fpbga 256 160 c lc4256b-75f256bc 1 256 2.5 7.5 fpbga 256 160 c lc4256b-3t176c 256 2.5 3 tqfp 176 128 c lc4256b-5t176c 256 2.5 5 tqfp 176 128 c lc4256b-75t176c 256 2.5 7.5 tqfp 176 128 c lc4256b-3t100c 256 2.5 3 tqfp 100 64 c lc4256b-5t100c 256 2.5 5 tqfp 100 64 c lc4256b-75t100c 256 2.5 7.5 tqfp 100 64 c lc4384b lc4384b-35ft256c 384 2.5 3.5 ftbga 256 192 c lc4384b-5ft256c 384 2.5 5 ftbga 256 192 c lc4384b-75ft256c 384 2.5 7.5 ftbga 256 192 c lc4384b-35f256c 1 384 2.5 3.5 fpbga 256 192 c lc4384b-5f256c 1 384 2.5 5 fpbga 256 192 c lc4384b-75f256c 1 384 2.5 7.5 fpbga 256 192 c lc4384b-35t176c 384 2.5 3.5 tqfp 176 128 c lc4384b-5t176c 384 2.5 5 tqfp 176 128 c lc4384b-75t176c 384 2.5 7.5 tqfp 176 128 c lc4512b lc4512b-35ft256c 512 2.5 3.5 ftbga 256 208 c lc4512b-5ft256c 512 2.5 5 ftbga 256 208 c lc4512b-75ft256c 512 2.5 7.5 ftbga 256 208 c lc4512b-35f256c 1 512 2.5 3.5 fpbga 256 208 c lc4512b-5f256c 1 512 2.5 5 fpbga 256 208 c lc4512b-75f256c 1 512 2.5 7.5 fpbga 256 208 c lc4512b-35t176c 512 2.5 3.5 tqfp 176 128 c lc4512b-5t176c 512 2.5 5 tqfp 176 128 c lc4512b-75t176c 512 2.5 7.5 tqfp 176 128 c 1. use ftbga package. fpbga package devices have been discontinued via pcn#14a-07. ispmach 4000b (2.5v) commercial devices (cont.) device part number macrocells voltage t pd package pin/ball count i/o grade
lattice semiconductor ispmach 4000v/b/c/z family data sheet 80 ispmach 4000b (2.5v) industrial devices family part number macrocells voltage t pd package pin/ball count i/o grade lc4032b lc4032b-5t48i 32 2.5 5 tqfp 48 32 i lc4032b-75t48i 32 2.5 7.5 tqfp 48 32 i lc4032b-10t48i 32 2.5 10 tqfp 48 32 i lc4032b-5t44i 32 2.5 5 tqfp 44 30 i lc4032b-75t44i 32 2.5 7.5 tqfp 44 30 i lc4032b-10t44i 32 2.5 10 tqfp 44 30 i lc4064b lc4064b-5t100i 64 2.5 5 tqfp 100 64 i lc4064b-75t100i 64 2.5 7.5 tqfp 100 64 i lc4064b-10t100i 64 2.5 10 tqfp 100 64 i lc4064b-5t48i 64 2.5 5 tqfp 48 32 i lc4064b-75t48i 64 2.5 7.5 tqfp 48 32 i lc4064b-10t48i 64 2.5 10 tqfp 48 32 i lc4064b-5t44i 64 2.5 5 tqfp 44 30 i lc4064b-75t44i 64 2.5 7.5 tqfp 44 30 i lc4064b-10t44i 64 2.5 10 tqfp 44 30 i lc4128b lc4128b-5t128i 128 2.5 5 tqfp 128 92 i lc4128b-75t128i 128 2.5 7.5 tqfp 128 92 i lc4128b-10t128i 128 2.5 10 tqfp 128 92 i lc4128b-5t100i 128 2.5 5 tqfp 100 64 i lc4128b-75t100i 128 2.5 7.5 tqfp 100 64 i lc4128b-10t100i 128 2.5 10 tqfp 100 64 i lc4256b lc4256b-5ft256ai 256 2.5 5 ftbga 256 128 i lc4256b-75ft256ai 256 2.5 7.5 ftbga 256 128 i lc4256b-10ft256ai 256 2.5 10 ftbga 256 128 i lc4256b-5ft256bi 256 2.5 5 ftbga 256 160 i lc4256b-75ft256bi 256 2.5 7.5 ftbga 256 160 i lc4256b-10ft256bi 256 2.5 10 ftbga 256 160 i lc4256b-5f256ai 1 256 2.5 5 fpbga 256 128 i lc4256b-75f256ai 1 256 2.5 7.5 fpbga 256 128 i lc4256b-10f256ai 1 256 2.5 10 fpbga 256 128 i lc4256b-5f256bi 1 256 2.5 5 fpbga 256 160 i lc4256b-75f256bi 1 256 2.5 7.5 fpbga 256 160 i lc4256b-10f256bi 1 256 2.5 10 fpbga 256 160 i lc4256b-5t176i 256 2.5 5 tqfp 176 128 i lc4256b-75t176i 256 2.5 7.5 tqfp 176 128 i lc4256b-10t176i 256 2.5 10 tqfp 176 128 i lc4256b-5t100i 256 2.5 5 tqfp 100 64 i lc4256b-75t100i 256 2.5 7.5 tqfp 100 64 i lc4256b-10t100i 256 2.5 10 tqfp 100 64 i
lattice semiconductor ispmach 4000v/b/c/z family data sheet 81 lc4384b lc4384b-5ft256i 384 2.5 5 ftbga 256 192 i lc4384b-75ft256i 384 2.5 7.5 ftbga 256 192 i lc4384b-10ft256i 384 2.5 10 ftbga 256 192 i lc4384b-5f256i 1 384 2.5 5 fpbga 256 192 i lc4384b-75f256i 1 384 2.5 7.5 fpbga 256 192 i lc4384b-10f256i 1 384 2.5 10 fpbga 256 192 i lc4384b-5t176i 384 2.5 5 tqfp 176 128 i lc4384b-75t176i 384 2.5 7.5 tqfp 176 128 i lc4384b-10t176i 384 2.5 10 tqfp 176 128 i lc4512b lc4512b-5ft256i 512 2.5 5 ftbga 256 208 i lc4512b-75ft256i 512 2.5 7.5 ftbga 256 208 i lc4512b-10ft256i 512 2.5 10 ftbga 256 208 i lc4512b-5f256i 1 512 2.5 5 fpbga 256 208 i lc4512b-75f256i 1 512 2.5 7.5 fpbga 256 208 i lc4512b-10f256i 1 512 2.5 10 fpbga 256 208 i lc4512b-5t176i 512 2.5 5 tqfp 176 128 i lc4512b-75t176i 512 2.5 7.5 tqfp 176 128 i lc4512b-10t176i 512 2.5 10 tqfp 176 128 i 1. use ftbga package. fpbga package devices have been discontinued via pcn#14a-07. ispmach 4000v (3.3v) commercial devices device part number macrocells voltage t pd package pin/ball count i/o grade lc4032v lc4032v-25t48c 32 3.3 2.5 tqfp 48 32 c lc4032v-5t48c 32 3.3 5 tqfp 48 32 c lc4032v-75t48c 32 3.3 7.5 tqfp 48 32 c lc4032v-25t44c 32 3.3 2.5 tqfp 44 30 c lc4032v-5t44c 32 3.3 5 tqfp 44 30 c lc4032v-75t44c 32 3.3 7.5 tqfp 44 30 c lc4064v lc4064v-25t100c 64 3.3 2.5 tqfp 100 64 c lc4064v-5t100c 64 3.3 5 tqfp 100 64 c lc4064v-75t100c 64 3.3 7.5 tqfp 100 64 c lc4064v-25t48c 64 3.3 2.5 tqfp 48 32 c lc4064v-5t48c 64 3.3 5 tqfp 48 32 c lc4064v-75t48c 64 3.3 7.5 tqfp 48 32 c lc4064v-25t44c 64 3.3 2.5 tqfp 44 30 c lc4064v-5t44c 64 3.3 5 tqfp 44 30 c lc4064v-75t44c 64 3.3 7.5 tqfp 44 30 c ispmach 4000b (2.5v) industrial devices (cont.) family part number macrocells voltage t pd package pin/ball count i/o grade
lattice semiconductor ispmach 4000v/b/c/z family data sheet 82 lc4128v lc4128v-27t144c 128 3.3 2.7 tqfp 144 96 c lc4128v-5t144c 128 3.3 5 tqfp 144 96 c lc4128v-75t144c 128 3.3 7.5 tqfp 144 96 c lc4128v-27t128c 128 3.3 2.7 tqfp 128 92 c lc4128v-5t128c 128 3.3 5 tqfp 128 92 c lc4128v-75t128c 128 3.3 7.5 tqfp 128 92 c lc4128v-27t100c 128 3.3 2.7 tqfp 100 64 c lc4128v-5t100c 128 3.3 5 tqfp 100 64 c lc4128v-75t100c 128 3.3 7.5 tqfp 100 64 c lc4256v lc4256v-3ft256ac 256 3.3 3 ftbga 256 128 c lc4256v-5ft256ac 256 3.3 5 ftbga 256 128 c lc4256v-75ft256ac 256 3.3 7.5 ftbga 256 128 c lc4256v-3ft256bc 256 3.3 3 ftbga 256 160 c lc4256v-5ft256bc 256 3.3 5 ftbga 256 160 c lc4256v-75ft256bc 256 3.3 7.5 ftbga 256 160 c lc4256v-3f256ac 1 256 3.3 3 fpbga 256 128 c lc4256v-5f256ac 1 256 3.3 5 fpbga 256 128 c lc4256v-75f256ac 1 256 3.3 7.5 fpbga 256 128 c lc4256v-3f256bc 1 256 3.3 3 fpbga 256 160 c lc4256v-5f256bc 1 256 3.3 5 fpbga 256 160 c lc4256v-75f256bc 1 256 3.3 7.5 fpbga 256 160 c lc4256v-3t176c 256 3.3 3 tqfp 176 128 c lc4256v-5t176c 256 3.3 5 tqfp 176 128 c lc4256v-75t176c 256 3.3 7.5 tqfp 176 128 c lc4256v-3t144c 256 3.3 3 tqfp 144 96 c lc4256v-5t144c 256 3.3 5 tqfp 144 96 c lc4256v-75t144c 256 3.3 7.5 tqfp 144 96 c lc4256v-3t100c 256 3.3 3 tqfp 100 64 c lc4256v-5t100c 256 3.3 5 tqfp 100 64 c lc4256v-75t100c 256 3.3 7.5 tqfp 100 64 c lc4384v lc4384v-35ft256c 384 3.3 3.5 ftbga 256 192 c lc4384v-5ft256c 384 3.3 5 ftbga 256 192 c lc4384v-75ft256c 384 3.3 7.5 ftbga 256 192 c lc4384v-35f256c 1 384 3.3 3.5 fpbga 256 192 c lc4384v-5f256c 1 384 3.3 5 fpbga 256 192 c lc4384v-75f256c 1 384 3.3 7.5 fpbga 256 192 c lc4384v-35t176c 384 3.3 3.5 tqfp 176 128 c lc4384v-5t176c 384 3.3 5 tqfp 176 128 c lc4384v-75t176c 384 3.3 7.5 tqfp 176 128 c ispmach 4000v (3.3v) commercial devices (cont.) device part number macrocells voltage t pd package pin/ball count i/o grade
lattice semiconductor ispmach 4000v/b/c/z family data sheet 83 lc4512v lc4512v-35ft256c 512 3.3 3.5 ftbga 256 208 c lc4512v-5ft256c 512 3.3 5 ftbga 256 208 c lc4512v-75ft256c 512 3.3 7.5 ftbga 256 208 c lc4512v-35f256c 1 512 3.3 3.5 fpbga 256 208 c lc4512v-5f256c 1 512 3.3 5 fpbga 256 208 c lc4512v-75f256c 1 512 3.3 7.5 fpbga 256 208 c lc4512v-35t176c 512 3.3 3.5 tqfp 176 128 c lc4512v-5t176c 512 3.3 5 tqfp 176 128 c lc4512v-75t176c 512 3.3 7.5 tqfp 176 128 c 1. use ftbga package. fpbga package devices have been discontinued via pcn#14a-07. ispmach 4000v (3.3v) industrial devices family part number macrocells voltage t pd package pin/ball count i/o grade lc4032v lc4032v-5t48i 32 3.3 5 tqfp 48 32 i lc4032v-75t48i 32 3.3 7.5 tqfp 48 32 i lc4032v-10t48i 32 3.3 10 tqfp 48 32 i lc4032v-5t44i 32 3.3 5 tqfp 44 30 i lc4032v-75t44i 32 3.3 7.5 tqfp 44 30 i lc4032v-10t44i 32 3.3 10 tqfp 44 30 i lc4064v lc4064v-5t100i 64 3.3 5 tqfp 100 64 i lc4064v-75t100i 64 3.3 7.5 tqfp 100 64 i lc4064v-10t100i 64 3.3 10 tqfp 100 64 i lc4064v-5t48i 64 3.3 5 tqfp 48 32 i lc4064v-75t48i 64 3.3 7.5 tqfp 48 32 i lc4064v-10t48i 64 3.3 10 tqfp 48 32 i lc4064v-5t44i 64 3.3 5 tqfp 44 30 i lc4064v-75t44i 64 3.3 7.5 tqfp 44 30 i lc4064v-10t44i 64 3.3 10 tqfp 44 30 i lc4128v lc4128v-5t144i 128 3.3 5 tqfp 144 96 i lc4128v-75t144i 128 3.3 7.5 tqfp 144 96 i lc4128v-10t144i 128 3.3 10 tqfp 144 96 i lc4128v-5t128i 128 3.3 5 tqfp 128 92 i lc4128v-75t128i 128 3.3 7.5 tqfp 128 92 i lc4128v-10t128i 128 3.3 10 tqfp 128 92 i lc4128v-5t100i 128 3.3 5 tqfp 100 64 i lc4128v-75t100i 128 3.3 7.5 tqfp 100 64 i lc4128v-10t100i 128 3.3 10 tqfp 100 64 i ispmach 4000v (3.3v) commercial devices (cont.) device part number macrocells voltage t pd package pin/ball count i/o grade
lattice semiconductor ispmach 4000v/b/c/z family data sheet 84 lc4256v lc4256v-5ft256ai 256 3.3 5 ftbga 256 128 i lc4256v-75ft256ai 256 3.3 7.5 ftbga 256 128 i lc4256v-10ft256ai 256 3.3 10 ftbga 256 128 i lc4256v-5ft256bi 256 3.3 5 ftbga 256 160 i lc4256v-75ft256bi 256 3.3 7.5 ftbga 256 160 i lc4256v-10ft256bi 256 3.3 10 ftbga 256 160 i lc4256v-5f256ai 1 256 3.3 5 fpbga 256 128 i lc4256v-75f256ai 1 256 3.3 7.5 fpbga 256 128 i lc4256v-10f256ai 1 256 3.3 10 fpbga 256 128 i lc4256v-5f256bi 1 256 3.3 5 fpbga 256 160 i lc4256v-75f256bi 1 256 3.3 7.5 fpbga 256 160 i lc4256v-10f256bi 1 256 3.3 10 fpbga 256 160 i lc4256v-5t176i 256 3.3 5 tqfp 176 128 i lc4256v-75t176i 256 3.3 7.5 tqfp 176 128 i lc4256v-10t176i 256 3.3 10 tqfp 176 128 i lc4256v-5t144i 256 3.3 5 tqfp 144 96 i lc4256v-75t144i 256 3.3 7.5 tqfp 144 96 i lc4256v-10t144i 256 3.3 10 tqfp 144 96 i lc4256v-5t100i 256 3.3 5 tqfp 100 64 i lc4256v-75t100i 256 3.3 7.5 tqfp 100 64 i lc4256v-10t100i 256 3.3 10 tqfp 100 64 i lc4384v lc4384v-5ft256i 384 3.3 5 ftbga 256 192 i lc4384v-75ft256i 384 3.3 7.5 ftbga 256 192 i lc4384v-10ft256i 384 3.3 10 ftbga 256 192 i lc4384v-5f256i 1 384 3.3 5 fpbga 256 192 i lc4384v-75f256i 1 384 3.3 7.5 fpbga 256 192 i lc4384v-10f256i 1 384 3.3 10 fpbga 256 192 i lc4384v-5t176i 384 3.3 5 tqfp 176 128 i lc4384v-75t176i 384 3.3 7.5 tqfp 176 128 i lc4384v-10t176i 384 3.3 10 tqfp 176 128 i lc4512v lc4512v-5ft256i 512 3.3 5 ftbga 256 208 i lc4512v-75ft256i 512 3.3 7.5 ftbga 256 208 i lc4512v-10ft256i 512 3.3 10 ftbga 256 208 i lc4512v-5f256i 1 512 3.3 5 fpbga 256 208 i lc4512v-75f256i 1 512 3.3 7.5 fpbga 256 208 i lc4512v-10f256i 1 512 3.3 10 fpbga 256 208 i lc4512v-5t176i 512 3.3 5 tqfp 176 128 i lc4512v-75t176i 512 3.3 7.5 tqfp 176 128 i lc4512v-10t176i 512 3.3 10 tqfp 176 128 i 1. use ftbga package. fpbga package devices have been discontinued via pcn#14a-07. ispmach 4000v (3.3v) industrial devices (cont.) family part number macrocells voltage t pd package pin/ball count i/o grade
lattice semiconductor ispmach 4000v/b/c/z family data sheet 85 ispmach 4000v (3.3v) extended temperature devices device part number macrocells voltage t pd package pin/ball count i/o grade lc4032v lc4032v-75t48e 32 3.3 7.5 tqfp 48 32 e lc4032v-75t44e 32 3.3 7.5 tqfp 44 30 e lc4064v lc4064v-75t100e 64 3.3 7.5 tqfp 100 64 e lc4064v-75t48e 64 3.3 7.5 tqfp 48 32 e lc4064v-75t44e 64 3.3 7.5 tqfp 44 30 e lc4128v lc4128v-75t144e 128 3.3 7.5 tqfp 144 96 e lc4128v-75t128e 128 3.3 7.5 tqfp 128 92 e lc4128v-75t100e 128 3.3 7.5 tqfp 100 64 e lc4256v lc4256v-75t176e 256 3.3 7.5 tqfp 176 128 e lc4256v-75t144e 256 3.3 7.5 tqfp 144 96 e lc4256v-75t100e 256 3.3 7.5 tqfp 100 64 e
lattice semiconductor ispmach 4000v/b/c/z family data sheet 86 lead-free packaging ispmach 4000z (zero power, 1.8v) lead-free commercial devices device part number macrocells voltage t pd package pin/ball count i/o grade lc4032zc lc4032zc-35mn56c 32 1.8 3.5 lead-free csbga 56 32 c lc4032zc-5mn56c 32 1.8 5 lead-free csbga 56 32 c lc4032zc-75mn56c 32 1.8 7.5 lead-free csbga 56 32 c LC4032ZC-35TN48C 32 1.8 3.5 lead-free tqfp 48 32 c lc4032zc-5tn48c 32 1.8 5 lead-free tqfp 48 32 c lc4032zc-75tn48c 32 1.8 7.5 lead-free tqfp 48 32 c lc4064zc lc4064zc-37mn132c 64 1.8 3.7 lead-free csbga 132 64 c lc4064zc-5mn132c 64 1.8 5 lead-free csbga 132 64 c lc4064zc-75mn132c 64 1.8 7.5 lead-free csbga 132 64 c lc4064zc-37tn100c 64 1.8 3.7 lead-free tqfp 100 64 c lc4064zc-5tn100c 64 1.8 5 lead-free tqfp 100 64 c lc4064zc-75tn100c 64 1.8 7.5 lead-free tqfp 100 64 c lc4064zc-37mn56c 64 1.8 3.7 lead-free csbga 56 32 c lc4064zc-5mn56c 64 1.8 5 lead-free csbga 56 32 c lc4064zc-75mn56c 64 1.8 7.5 lead-free csbga 56 32 c lc4064zc-37tn48c 64 1.8 3.7 lead-free tqfp 48 32 c lc4064zc-5tn48c 64 1.8 5 lead-free tqfp 48 32 c lc4064zc-75tn48c 64 1.8 7.5 lead-free tqfp 48 32 c lc4128zc lc4128zc-42mn132c 128 1.8 4.2 lead-free csbga 132 96 c lc4128zc-75mn132c 128 1.8 7.5 lead-free csbga 132 96 c lc4128zc-42tn100c 128 1.8 4.2 lead-free tqfp 100 64 c lc4128zc-75tn100c 128 1.8 7.5 lead-free tqfp 100 64 c lc4256zc lc4256zc-45tn176c 256 1.8 4.5 lead-free tqfp 176 128 c lc4256zc-75tn176c 256 1.8 7.5 lead-free tqfp 176 128 c lc4256zc-45mn132c 256 1.8 4.5 lead-free csbga 132 96 c lc4256zc-75mn132c 256 1.8 7.5 lead-free csbga 132 96 c lc4256zc-45tn100c 256 1.8 4.5 lead-free tqfp 100 64 c lc4256zc-75tn100c 256 1.8 7.5 lead-free tqfp 100 64 c ispmach 4000z (zero power, 1.8v) lead-free industrial devices device part number macrocells voltage t pd package pin/ball count i/o grade lc4032zc lc4032zc-5mn56i 32 1.8 5 lead-free csbga 56 32 i lc4032zc-75mn56i 32 1.8 7.5 lead-free csbga 56 32 i lc4032zc-5tn48i 32 1.8 5 lead-free tqfp 48 32 i lc4032zc-75tn48i 32 1.8 7.5 lead-free tqfp 48 32 i
lattice semiconductor ispmach 4000v/b/c/z family data sheet 87 lc4064zc lc4064zc-5mn132i 64 1.8 5 lead-free csbga 132 64 i lc4064zc-75mn132i 64 1.8 7.5 lead-free csbga 132 64 i lc4064zc-5tn100i 64 1.8 5 lead-free tqfp 100 64 i lc4064zc-75tn100i 64 1.8 7.5 lead-free tqfp 100 64 i lc4064zc-5mn56i 64 1.8 5 lead-free csbga 56 32 i lc4064zc-75mn56i 64 1.8 7.5 lead-free csbga 56 32 i lc4064zc-5tn48i 64 1.8 5 lead-free tqfp 48 32 i lc4064zc-75tn48i 64 1.8 7.5 lead-free tqfp 48 32 i lc4128zc lc4128zc-75mn132i 128 1.8 7.5 lead-free csbga 132 96 i lc4128zc-75tn100i 128 1.8 7.5 lead-free tqfp 100 64 i lc4256zc lc4256zc-75tn176i 256 1.8 7.5 lead-free tqfp 176 128 i lc4256zc-75mn132i 256 1.8 7.5 lead-free csbga 132 96 i lc4256zc-75tn100i 256 1.8 7.5 lead-free tqfp 100 64 i ispmach 4000z (zero power, 1.8v) lead-free extended temperature devices device part number macrocells voltage t pd package pin/ball count i/o grade lc4032zc lc4032zc-75tn48e 32 1.8 7.5 lead-free tqfp 48 32 e lc4064zc lc4064zc-75tn100e 64 1.8 7.5 lead-free tqfp 100 64 e lc4064zc-75tn48e 64 1.8 7.5 lead-free tqfp 48 32 e lc4128zc lc4128zc-75tn100e 128 1.8 7.5 lead-free tqfp 100 64 e lc4256zc lc4256zc-75tn176e 256 1.8 7.5 lead-free tqfp 176 128 e lc4256zc-75tn100e 256 1.8 7.5 lead-free tqfp 100 64 e ispmach 4000c (1.8v) lead-free commercial devices device part number macrocells voltage t pd package pin/ball count i/o grade lc4032c lc4032c-25tn48c 32 1.8 2.5 lead-free tqfp 48 32 c lc4032c-5tn48c 32 1.8 5 lead-free tqfp 48 32 c lc4032c-75tn48c 32 1.8 7.5 lead-free tqfp 48 32 c lc4032c-25tn44c 32 1.8 2.5 lead-free tqfp 44 30 c lc4032c-5tn44c 32 1.8 5 lead-free tqfp 44 30 c lc4032c-75tn44c 32 1.8 7.5 lead-free tqfp 44 30 c ispmach 4000z (zero power, 1.8v) lead-free industrial devices (cont.) device part number macrocells voltage t pd package pin/ball count i/o grade
lattice semiconductor ispmach 4000v/b/c/z family data sheet 88 lc4064c lc4064c-25tn100c 64 1.8 2.5 lead-free tqfp 100 64 c lc4064c-5tn100c 64 1.8 5 lead-free tqfp 100 64 c lc4064c-75tn100c 64 1.8 7.5 lead-free tqfp 100 64 c lc4064c-25tn48c 64 1.8 2.5 lead-free tqfp 48 32 c lc4064c-5tn48c 64 1.8 5 lead-free tqfp 48 32 c lc4064c-75tn48c 64 1.8 7.5 lead-free tqfp 48 32 c lc4064c-25tn44c 64 1.8 2.5 lead-free tqfp 44 30 c lc4064c-5tn44c 64 1.8 5 lead-free tqfp 44 30 c lc4064c-75tn44c 64 1.8 7.5 lead-free tqfp 44 30 c lc4128c lc4128c-27tn128c 128 1.8 2.7 lead-free tqfp 128 92 c lc4128c-5tn128c 128 1.8 5 lead-free tqfp 128 92 c lc4128c-75tn128c 128 1.8 7.5 lead-free tqfp 128 92 c lc4128c-27tn100c 128 1.8 2.7 lead-free tqfp 100 64 c lc4128c-5tn100c 128 1.8 5 lead-free tqfp 100 64 c lc4128c-75tn100c 128 1.8 7.5 lead-free tqfp 100 64 c lc4256c lc4256c-3ftn256ac 256 1.8 3 lead-free ftbga 256 128 c lc4256c-5ftn256ac 256 1.8 5 lead-free ftbga 256 128 c lc4256c-75ftn256ac 256 1.8 7.5 lead-free ftbga 256 128 c lc4256c-3ftn256bc 256 1.8 3 lead-free ftbga 256 160 c lc4256c-5ftn256bc 256 1.8 5 lead-free ftbga 256 160 c lc4256c-75ftn256bc 256 1.8 7.5 lead-free ftbga 256 160 c lc4256c-3fn256ac 1 256 1.8 3 lead-free fpbga 256 128 c lc4256c-5fn256ac 1 256 1.8 5 lead-free fpbga 256 128 c lc4256c-75fn256ac 1 256 1.8 7.5 lead-free fpbga 256 128 c lc4256c-3fn256bc 1 256 1.8 3 lead-free fpbga 256 160 c lc4256c-5fn256bc 1 256 1.8 5 lead-free fpbga 256 160 c lc4256c-75fn256bc 1 256 1.8 7.5 lead-free fpbga 256 160 c lc4256c-3tn176c 256 1.8 3 lead-free tqfp 176 128 c lc4256c-5tn176c 256 1.8 5 lead-free tqfp 176 128 c lc4256c-75tn176c 256 1.8 7.5 lead-free tqfp 176 128 c lc4256c-3tn100c 256 1.8 3 lead-free tqfp 100 64 c lc4256c-5tn100c 256 1.8 5 lead-free tqfp 100 64 c lc4256c-75tn100c 256 1.8 7.5 lead-free tqfp 100 64 c lc4384c lc4384c-35ftn256c 384 1.8 3.5 lead-free ftbga 256 192 c lc4384c-5ftn256c 384 1.8 5 lead-free ftbga 256 192 c lc4384c-75ftn256c 384 1.8 7.5 lead-free ftbga 256 192 c lc4384c-35fn256c 1 384 1.8 3.5 lead-free fpbga 256 192 c lc4384c-5fn256c 1 384 1.8 5 lead-free fpbga 256 192 c lc4384c-75fn256c 1 384 1.8 7.5 lead-free fpbga 256 192 c lc4384c-35tn176c 384 1.8 3.5 lead-free tqfp 176 128 c lc4384c-5tn176c 384 1.8 5 lead-free tqfp 176 128 c lc4384c-75tn176c 384 1.8 7.5 lead-free tqfp 176 128 c ispmach 4000c (1.8v) lead-free commercial devices (cont.) device part number macrocells voltage t pd package pin/ball count i/o grade
lattice semiconductor ispmach 4000v/b/c/z family data sheet 89 lc4512c lc4512c-35ftn256c 512 1.8 3.5 lead-free ftbga 256 208 c lc4512c-5ftn256c 512 1.8 5 lead-free ftbga 256 208 c lc4512c-75ftn256c 512 1.8 7.5 lead-free ftbga 256 208 c lc4512c-35fn256c 1 512 1.8 3.5 lead-free fpbga 256 208 c lc4512c-5fn256c 1 512 1.8 5 lead-free fpbga 256 208 c lc4512c-75fn256c 1 512 1.8 7.5 lead-free fpbga 256 208 c lc4512c-35tn176c 512 1.8 3.5 lead-free tqfp 176 128 c lc4512c-5tn176c 512 1.8 5 lead-free tqfp 176 128 c lc4512c-75tn176c 512 1.8 7.5 lead-free tqfp 176 128 c 1. use ftbga package. fpbga package devices have been discontinued via pcn#14a-07. ispmach 4000c (1.8v) lead-free industrial devices device part number macrocells voltage t pd package pin/ball count i/o grade lc4032c lc4032c-5tn48i 32 1.8 5 lead-free tqfp 48 32 i lc4032c-75tn48i 32 1.8 7.5 lead-free tqfp 48 32 i lc4032c-10tn48i 32 1.8 10 lead-free tqfp 48 32 i lc4032c-5tn44i 32 1.8 5 lead-free tqfp 44 30 i lc4032c-75tn44i 32 1.8 7.5 lead-free tqfp 44 30 i lc4032c-10tn44i 32 1.8 10 lead-free tqfp 44 30 i lc4064c lc4064c-5tn100i 64 1.8 5 lead-free tqfp 100 64 i lc4064c-75tn100i 64 1.8 7.5 lead-free tqfp 100 64 i lc4064c-10tn100i 64 1.8 10 lead-free tqfp 100 64 i lc4064c-5tn48i 64 1.8 5 lead-free tqfp 48 32 i lc4064c-75tn48i 64 1.8 7.5 lead-free tqfp 48 32 i lc4064c-10tn48i 64 1.8 10 lead-free tqfp 48 32 i lc4064c-5tn44i 64 1.8 5 lead-free tqfp 44 30 i lc4064c-75tn44i 64 1.8 5 lead-free tqfp 44 30 i lc4064c-10tn44i 64 1.8 10 lead-free tqfp 44 30 i lc4128c lc4128c-5tn128i 128 1.8 5 lead-free tqfp 128 92 i lc4128c-75tn128i 128 1.8 7.5 lead-free tqfp 128 92 i lc4128c-10tn128i 128 1.8 10 lead-free tqfp 128 92 i lc4128c-5tn100i 128 1.8 5 lead-free tqfp 100 64 i lc4128c-75tn100i 128 1.8 7.5 lead-free tqfp 100 64 i lc4128c-10tn100i 128 1.8 10 lead-free tqfp 100 64 i ispmach 4000c (1.8v) lead-free commercial devices (cont.) device part number macrocells voltage t pd package pin/ball count i/o grade
lattice semiconductor ispmach 4000v/b/c/z family data sheet 90 lc4256c lc4256c-5ftn256ai 256 1.8 5 lead-free ftbga 256 128 i lc4256c-75ftn256ai 256 1.8 7.5 lead-free ftbga 256 128 i lc4256c-10ftn256ai 256 1.8 10 lead-free ftbga 256 128 i lc4256c-5ftn256bi 256 1.8 5 lead-free ftbga 256 160 i lc4256c-75ftn256bi 256 1.8 7.5 lead-free ftbga 256 160 i lc4256c-10ftn256bi 256 1.8 10 lead-free ftbga 256 160 i lc4256c-5fn256ai 1 256 1.8 5 lead-free fpbga 256 128 i lc4256c-75fn256ai 1 256 1.8 7.5 lead-free fpbga 256 128 i lc4256c-10fn256ai 1 256 1.8 10 lead-free fpbga 256 128 i lc4256c-5fn256bi 1 256 1.8 5 lead-free fpbga 256 160 i lc4256c-75fn256bi 1 256 1.8 7.5 lead-free fpbga 256 160 i lc4256c-10fn256bi 1 256 1.8 10 lead-free fpbga 256 160 i lc4256c-5tn176i 256 1.8 5 lead-free tqfp 176 128 i lc4256c-75tn176i 256 1.8 7.5 lead-free tqfp 176 128 i lc4256c-10tn176i 256 1.8 10 lead-free tqfp 176 128 i lc4256c-5tn100i 256 1.8 5 lead-free tqfp 100 64 i lc4256c-75tn100i 256 1.8 7.5 lead-free tqfp 100 64 i lc4256c-10tn100i 256 1.8 10 lead-free tqfp 100 64 i lc4384c lc4384c-5ftn256i 384 1.8 5 lead-free ftbga 256 192 i lc4384c-75ftn256i 384 1.8 7.5 lead-free ftbga 256 192 i lc4384c-10ftn256i 384 1.8 10 lead-free ftbga 256 192 i lc4384c-5fn256i 1 384 1.8 5 lead-free fpbga 256 192 i lc4384c-75fn256i 1 384 1.8 7.5 lead-free fpbga 256 192 i lc4384c-10fn256i 1 384 1.8 10 lead-free fpbga 256 192 i lc4384c-5tn176i 384 1.8 5 lead-free tqfp 176 128 i lc4384c-75tn176i 384 1.8 7.5 lead-free tqfp 176 128 i lc4384c-10tn176i 384 1.8 10 lead-free tqfp 176 128 i lc4512c lc4512c-5ftn256i 512 1.8 5 lead-free ftbga 256 208 i lc4512c-75ftn256i 512 1.8 7.5 lead-free ftbga 256 208 i lc4512c-10ftn256i 512 1.8 10 lead-free ftbga 256 208 i lc4512c-5fn256i 1 512 1.8 5 lead-free fpbga 256 208 i lc4512c-75fn256i 1 512 1.8 7.5 lead-free fpbga 256 208 i lc4512c-10fn256i 1 512 1.8 10 lead-free fpbga 256 208 i lc4512c-5tn176i 512 1.8 5 lead-free tqfp 176 128 i lc4512c-75tn176i 512 1.8 7.5 lead-free tqfp 176 128 i lc4512c-10tn176i 512 1.8 10 lead-free tqfp 176 128 i 1. use ftbga package. fpbga package devices have been discontinued via pcn#14a-07. ispmach 4000c (1.8v) lead-free industrial devices (cont.) device part number macrocells voltage t pd package pin/ball count i/o grade
lattice semiconductor ispmach 4000v/b/c/z family data sheet 91 ispmach 4000b (2.5v) lead-free commercial devices device part number macrocells voltage t pd package pin/ball count i/o grade lc4032b lc4032b-25tn48c 32 2.5 2.5 lead-free tqfp 48 32 c lc4032b-5tn48c 32 2.5 5 lead-free tqfp 48 32 c lc4032b-75tn48c 32 2.5 7.5 lead-free tqfp 48 32 c lc4032b-25tn44c 32 2.5 2.5 lead-free tqfp 44 30 c lc4032b-5tn44c 32 2.5 5 lead-free tqfp 44 30 c lc4032b-75tn44c 32 2.5 7.5 lead-free tqfp 44 30 c lc4064b lc4064b-25tn100c 64 2.5 2.5 lead-free tqfp 100 64 c lc4064b-5tn100c 64 2.5 5 lead-free tqfp 100 64 c lc4064b-75tn100c 64 2.5 7.5 lead-free tqfp 100 64 c lc4064b-25tn48c 64 2.5 2.5 lead-free tqfp 48 32 c lc4064b-5tn48c 64 2.5 5 lead-free tqfp 48 32 c lc4064b-75tn48c 64 2.5 7.5 lead-free tqfp 48 32 c lc4064b-25tn44c 64 2.5 2.5 lead-free tqfp 44 30 c lc4064b-5tn44c 64 2.5 5 lead-free tqfp 44 30 c lc4064b-75tn44c 64 2.5 7.5 lead-free tqfp 44 30 c lc4128b lc4128b-27tn128c 128 2.5 2.7 lead-free tqfp 128 92 c lc4128b-5tn128c 128 2.5 5 lead-free tqfp 128 92 c lc4128b-75tn128c 128 2.5 7.5 lead-free tqfp 128 92 c lc4128b-27tn100c 128 2.5 2.7 lead-free tqfp 100 92 c lc4128b-5tn100c 128 2.5 5 lead-free tqfp 100 92 c lc4128b-75tn100c 128 2.5 7.5 lead-free tqfp 100 92 c lc4256b lc4256b-3ftn256ac 256 2.5 3 lead-free ftbga 256 128 c lc4256b-5ftn256ac 256 2.5 5 lead-free ftbga 256 128 c lc4256b-75ftn256ac 256 2.5 7.5 lead-free ftbga 256 128 c lc4256b-3ftn256bc 256 2.5 3 lead-free ftbga 256 160 c lc4256b-5ftn256bc 256 2.5 5 lead-free ftbga 256 160 c lc4256b-75ftn256bc 256 2.5 7.5 lead-free ftbga 256 160 c lc4256b-3fn256ac 1 256 2.5 3 lead-free fpbga 256 128 c lc4256b-5fn256ac 1 256 2.5 5 lead-free fpbga 256 128 c lc4256b-75fn256ac 1 256 2.5 7.5 lead-free fpbga 256 128 c lc4256b-3fn256bc 1 256 2.5 3 lead-free fpbga 256 160 c lc4256b-5fn256bc 1 256 2.5 5 lead-free fpbga 256 160 c lc4256b-75fn256bc 1 256 2.5 7.5 lead-free fpbga 256 160 c lc4256b-3tn176c 256 2.5 3 lead-free tqfp 176 128 c lc4256b-5tn176c 256 2.5 5 lead-free tqfp 176 128 c lc4256b-75tn176c 256 2.5 7.5 lead-free tqfp 176 128 c lc4256b-3tn100c 256 2.5 3 lead-free tqfp 100 64 c lc4256b-5tn100c 256 2.5 5 lead-free tqfp 100 64 c lc4256b-75tn100c 256 2.5 7.5 lead-free tqfp 100 64 c
lattice semiconductor ispmach 4000v/b/c/z family data sheet 92 lc4384b lc4384b-35ftn256c 384 2.5 3.5 lead-free ftbga 256 192 c lc4384b-5ftn256c 384 2.5 5 lead-free ftbga 256 192 c lc4384b-75ftn256c 384 2.5 7.5 lead-free ftbga 256 192 c lc4384b-35fn256c 1 384 2.5 3.5 lead-free fpbga 256 192 c lc4384b-5fn256c 1 384 2.5 5 lead-free fpbga 256 192 c lc4384b-75fn256c 1 384 2.5 7.5 lead-free fpbga 256 192 c lc4384b-35tn176c 384 2.5 3.5 lead-free tqfp 176 128 c lc4384b-5tn176c 384 2.5 5 lead-free tqfp 176 128 c lc4384b-75tn176c 384 2.5 7.5 lead-free tqfp 176 128 c lc4512b lc4512b-35ftn256c 512 2.5 3.5 lead-free ftbga 256 208 c lc4512b-5ftn256c 512 2.5 5 lead-free ftbga 256 208 c lc4512b-75ftn256c 512 2.5 7.5 lead-free ftbga 256 208 c lc4512b-35fn256c 1 512 2.5 3.5 lead-free fpbga 256 208 c lc4512b-5fn256c 1 512 2.5 5 lead-free fpbga 256 208 c lc4512b-75fn256c 1 512 2.5 7.5 lead-free fpbga 256 208 c lc4512b-35tn176c 512 2.5 3.5 lead-free tqfp 176 128 c lc4512b-5tn176c 512 2.5 5 lead-free tqfp 176 128 c lc4512b-75tn176c 512 2.5 7.5 lead-free tqfp 176 128 c 1. use ftbga package. fpbga package devices have been discontinued via pcn#14a-07. ispmach 4000b (2.5v) lead-free industrial devices device part number macrocells voltage t pd package pin/ball count i/o grade lc4032b lc4032b-5tn48i 32 2.5 5 lead-free tqfp 48 32 i lc4032b-75tn48i 32 2.5 7.5 lead-free tqfp 48 32 i lc4032b-10tn48i 32 2.5 10 lead-free tqfp 48 32 i lc4032b-5tn44i 32 2.5 5 lead-free tqfp 44 30 i lc4032b-75tn44i 32 2.5 7.5 lead-free tqfp 44 30 i lc4032b-10tn44i 32 2.5 10 lead-free tqfp 44 30 i lc4064b lc4064b-5tn100i 64 2.5 5 lead-free tqfp 100 64 i lc4064b-75tn100i 64 2.5 7.5 lead-free tqfp 100 64 i lc4064b-10tn100i 64 2.5 10 lead-free tqfp 100 64 i lc4064b-5tn48i 64 2.5 5 lead-free tqfp 48 32 i lc4064b-75tn48i 64 2.5 7.5 lead-free tqfp 48 32 i lc4064b-10tn48i 64 2.5 10 lead-free tqfp 48 32 i lc4064b-5tn44i 64 2.5 5 lead-free tqfp 44 30 i lc4064b-75tn44i 64 2.5 7.5 lead-free tqfp 44 30 i lc4064b-10tn44i 64 2.5 10 lead-free tqfp 44 30 i ispmach 4000b (2.5v) lead-free commercial devices (cont.) device part number macrocells voltage t pd package pin/ball count i/o grade
lattice semiconductor ispmach 4000v/b/c/z family data sheet 93 lc4128b lc4128b-5tn128i 128 2.5 5 lead-free tqfp 128 92 i lc4128b-75tn128i 128 2.5 7.5 lead-free tqfp 128 92 i lc4128b-10tn128i 128 2.5 10 lead-free tqfp 128 92 i lc4128b-5tn100i 128 2.5 5 lead-free tqfp 100 64 i lc4128b-75tn100i 128 2.5 7.5 lead-free tqfp 100 64 i lc4128b-10tn100i 128 2.5 10 lead-free tqfp 100 64 i lc4256b lc4256b-5ftn256ai 256 2.5 5 lead-free ftbga 256 128 i lc4256b-75ftn256ai 256 2.5 7.5 lead-free ftbga 256 128 i lc4256b-10ftn256ai 256 2.5 10 lead-free ftbga 256 128 i lc4256b-5ftn256bi 256 2.5 5 lead-free ftbga 256 160 i lc4256b-75ftn256bi 256 2.5 7.5 lead-free ftbga 256 160 i lc4256b-10ftn256bi 256 2.5 10 lead-free ftbga 256 160 i lc4256b-5fn256ai 1 256 2.5 5 lead-free fpbga 256 128 i lc4256b-75fn256ai 1 256 2.5 7.5 lead-free fpbga 256 128 i lc4256b-10fn256ai 1 256 2.5 10 lead-free fpbga 256 128 i lc4256b-5fn256bi 1 256 2.5 5 lead-free fpbga 256 160 i lc4256b-75fn256bi 1 256 2.5 7.5 lead-free fpbga 256 160 i lc4256b-10fn256bi 1 256 2.5 10 lead-free fpbga 256 160 i lc4256b-5tn176i 256 2.5 5 lead-free tqfp 176 128 i lc4256b-75tn176i 256 2.5 7.5 lead-free tqfp 176 128 i lc4256b-10tn176i 256 2.5 10 lead-free tqfp 176 128 i lc4256b-5tn100i 256 2.5 5 lead-free tqfp 100 64 i lc4256b-75tn100i 256 2.5 7.5 lead-free tqfp 100 64 i lc4256b-10tn100i 256 2.5 10 lead-free tqfp 100 64 i lc4384b lc4384b-5ftn256i 384 2.5 5 lead-free ftbga 256 192 i lc4384b-75ftn256i 384 2.5 7.5 lead-free ftbga 256 192 i lc4384b-10ftn256i 384 2.5 10 lead-free ftbga 256 192 i lc4384b-5fn256i 1 384 2.5 5 lead-free fpbga 256 192 i lc4384b-75fn256i 1 384 2.5 7.5 lead-free fpbga 256 192 i lc4384b-10fn256i 1 384 2.5 10 lead-free fpbga 256 192 i lc4384b-5tn176i 384 2.5 5 lead-free tqfp 176 128 i lc4384b-75tn176i 384 2.5 7.5 lead-free tqfp 176 128 i lc4384b-10tn176i 384 2.5 10 lead-free tqfp 176 128 i lc4512b lc4512b-5ftn256i 512 2.5 5 lead-free ftbga 256 208 i lc4512b-75ftn256i 512 2.5 7.5 lead-free ftbga 256 208 i lc4512b-10ftn256i 512 2.5 10 lead-free ftbga 256 208 i lc4512b-5fn256i 1 512 2.5 5 lead-free fpbga 256 208 i lc4512b-75fn256i 1 512 2.5 7.5 lead-free fpbga 256 208 i lc4512b-10fn256i 1 512 2.5 10 lead-free fpbga 256 208 i lc4512b-5tn176i 512 2.5 5 lead-free tqfp 176 128 i lc4512b-75tn176i 512 2.5 7.5 lead-free tqfp 176 128 i lc4512b-10tn176i 512 2.5 10 lead-free tqfp 176 128 i 1. use ftbga package. fpbga package devices have been discontinued via pcn#14a-07. ispmach 4000b (2.5v) lead-free industrial devices (cont.) device part number macrocells voltage t pd package pin/ball count i/o grade
lattice semiconductor ispmach 4000v/b/c/z family data sheet 94 ispmach 4000v (3.3v) lead-free commercial devices device part number macrocells voltage t pd package pin/ball count i/o grade lc4032v lc4032v-25tn48c 32 3.3 2.5 lead-free tqfp 48 32 c lc4032v-5tn48c 32 3.3 5 lead-free tqfp 48 32 c lc4032v-75tn48c 32 3.3 7.5 lead-free tqfp 48 32 c lc4032v-25tn44c 32 3.3 2.5 lead-free tqfp 44 30 c lc4032v-5tn44c 32 3.3 5 lead-free tqfp 44 30 c lc4032v-75tn44c 32 3.3 7.5 lead-free tqfp 44 30 c lc4064v lc4064v-25tn100c 64 3.3 2.5 lead-free tqfp 100 64 c lc4064v-5tn100c 64 3.3 5 lead-free tqfp 100 64 c lc4064v-75tn100c 64 3.3 7.5 lead-free tqfp 100 64 c lc4064v-25tn48c 64 3.3 2.5 lead-free tqfp 48 32 c lc4064v-5tn48c 64 3.3 5 lead-free tqfp 48 32 c lc4064v-75tn48c 64 3.3 7.5 lead-free tqfp 48 32 c lc4064v-25tn44c 64 3.3 2.5 lead-free tqfp 44 30 c lc4064v-5tn44c 64 3.3 5 lead-free tqfp 44 30 c lc4064v-75tn44c 64 3.3 7.5 lead-free tqfp 44 30 c lc4128v lc4128v-27tn144c 128 3.3 2.7 lead-free tqfp 144 96 c lc4128v-5tn144c 128 3.3 5 lead-free tqfp 144 96 c lc4128v-75tn144c 128 3.3 7.5 lead-free tqfp 144 96 c lc4128v-27tn128c 128 3.3 2.7 lead-free tqfp 128 92 c lc4128v-5tn128c 128 3.3 5 lead-free tqfp 128 92 c lc4128v-75tn128c 128 3.3 7.5 lead-free tqfp 128 92 c lc4128v-27tn100c 128 3.3 2.7 lead-free tqfp 100 64 c lc4128v-5tn100c 128 3.3 5 lead-free tqfp 100 64 c lc4128v-75tn100c 128 3.3 7.5 lead-free tqfp 100 64 c
lattice semiconductor ispmach 4000v/b/c/z family data sheet 95 lc4256v lc4256v-3ftn256ac 256 3.3 3 lead-free ftbga 256 128 c lc4256v-5ftn256ac 256 3.3 5 lead-free ftbga 256 128 c lc4256v-75ftn256ac 256 3.3 7.5 lead-free ftbga 256 128 c lc4256v-3ftn256bc 256 3.3 3 lead-free ftbga 256 160 c lc4256v-5ftn256bc 256 3.3 5 lead-free ftbga 256 160 c lc4256v-75ftn256bc 256 3.3 7.5 lead-free ftbga 256 160 c lc4256v-3fn256ac 1 256 3.3 3 lead-free fpbga 256 128 c lc4256v-5fn256ac 1 256 3.3 5 lead-free fpbga 256 128 c lc4256v-75fn256ac 1 256 3.3 7.5 lead-free fpbga 256 128 c lc4256v-3fn256bc 1 256 3.3 3 lead-free fpbga 256 160 c lc4256v-5fn256bc 1 256 3.3 5 lead-free fpbga 256 160 c lc4256v-75fn256bc 1 256 3.3 7.5 lead-free fpbga 256 160 c lc4256v-3tn176c 256 3.3 3 lead-free tqfp 176 128 c lc4256v-5tn176c 256 3.3 5 lead-free tqfp 176 128 c lc4256v-75tn176c 256 3.3 7.5 lead-free tqfp 176 128 c lc4256v-3tn144c 256 3.3 3 lead-free tqfp 144 96 c lc4256v-5tn144c 256 3.3 5 lead-free tqfp 144 96 c lc4256v-75tn144c 256 3.3 7.5 lead-free tqfp 144 96 c lc4256v-3tn100c 256 3.3 3 lead-free tqfp 100 64 c lc4256v-5tn100c 256 3.3 5 lead-free tqfp 100 64 c lc4256v-75tn100c 256 3.3 7.5 lead-free tqfp 100 64 c lc4384v lc4384v-35ftn256c 384 3.3 3.5 lead-free ftbga 256 192 c lc4384v-5ftn256c 384 3.3 5 lead-free ftbga 256 192 c lc4384v-75ftn256c 384 3.3 7.5 lead-free ftbga 256 192 c lc4384v-35fn256c 1 384 3.3 3.5 lead-free fpbga 256 192 c lc4384v-5fn256c 1 384 3.3 5 lead-free fpbga 256 192 c lc4384v-75fn256c 1 384 3.3 7.5 lead-free fpbga 256 192 c lc4384v-35tn176c 384 3.3 3.5 lead-free tqfp 176 128 c lc4384v-5tn176c 384 3.3 5 lead-free tqfp 176 128 c lc4384v-75tn176c 384 3.3 7.5 lead-free tqfp 176 128 c lc4512v lc4512v-35ftn256c 512 3.3 3.5 lead-free ftbga 256 208 c lc4512v-5ftn256c 512 3.3 5 lead-free ftbga 256 208 c lc4512v-75ftn256c 512 3.3 7.5 lead-free ftbga 256 208 c lc4512v-35fn256c 1 512 3.3 3.5 lead-free fpbga 256 208 c lc4512v-5fn256c 1 512 3.3 5 lead-free fpbga 256 208 c lc4512v-75fn256c 1 512 3.3 7.5 lead-free fpbga 256 208 c lc4512v-35tn176c 512 3.3 3.5 lead-free tqfp 176 128 c lc4512v-5tn176c 512 3.3 5 lead-free tqfp 176 128 c lc4512v-75tn176c 512 3.3 7.5 lead-free tqfp 176 128 c 1. use ftbga package. fpbga package devices have been discontinued via pcn#14a-07. ispmach 4000v (3.3v) lead-free commercial devices (cont.) device part number macrocells voltage t pd package pin/ball count i/o grade
lattice semiconductor ispmach 4000v/b/c/z family data sheet 96 ispmach 4000v (3.3v) lead-free industrial devices device part number macrocells voltage t pd package pin/ball count i/o grade lc4032v lc4032v-5tn48i 32 3.3 5 lead-free tqfp 48 32 i lc4032v-75tn48i 32 3.3 7.5 lead-free tqfp 48 32 i lc4032v-10tn48i 32 3.3 10 lead-free tqfp 48 32 i lc4032v-5tn44i 32 3.3 5 lead-free tqfp 44 30 i lc4032v-75tn44i 32 3.3 7.5 lead-free tqfp 44 30 i lc4032v-10tn44i 32 3.3 10 lead-free tqfp 44 30 i lc4064v lc4064v-5tn100i 64 3.3 5 lead-free tqfp 100 64 i lc4064v-75tn100i 64 3.3 7.5 lead-free tqfp 100 64 i lc4064v-10tn100i 64 3.3 10 lead-free tqfp 100 64 i lc4064v-5tn48i 64 3.3 5 lead-free tqfp 48 32 i lc4064v-75tn48i 64 3.3 7.5 lead-free tqfp 48 32 i lc4064v-10tn48i 64 3.3 10 lead-free tqfp 48 32 i lc4064v-5tn44i 64 3.3 5 lead-free tqfp 44 30 i lc4064v-75tn44i 64 3.3 5 lead-free tqfp 44 30 i lc4064v-10tn44i 64 3.3 10 lead-free tqfp 44 30 i lc4128v lc4128v-5tn144i 128 3.3 5 lead-free tqfp 144 96 i lc4128v-75tn144i 128 3.3 7.5 lead-free tqfp 144 96 i lc4128v-10tn144i 128 3.3 10 lead-free tqfp 144 96 i lc4128v-5tn128i 128 3.3 5 lead-free tqfp 128 92 i lc4128v-75tn128i 128 3.3 7.5 lead-free tqfp 128 92 i lc4128v-10tn128i 128 3.3 10 lead-free tqfp 128 92 i lc4128v-5tn100i 128 3.3 5 lead-free tqfp 100 64 i lc4128v-75tn100i 128 3.3 7.5 lead-free tqfp 100 64 i lc4128v-10tn100i 128 3.3 10 lead-free tqfp 100 64 i
lattice semiconductor ispmach 4000v/b/c/z family data sheet 97 lc4256v lc4256v-5ftn256ai 256 3.3 5 lead-free ftbga 256 128 i lc4256v-75ftn256ai 256 3.3 7.5 lead-free ftbga 256 128 i lc4256v-10ftn256ai 256 3.3 10 lead-free ftbga 256 128 i lc4256v-5ftn256bi 256 3.3 5 lead-free ftbga 256 160 i lc4256v-75ftn256bi 256 3.3 7.5 lead-free ftbga 256 160 i lc4256v-10ftn256bi 256 3.3 10 lead-free ftbga 256 160 i lc4256v-5fn256ai 1 256 3.3 5 lead-free fpbga 256 128 i lc4256v-75fn256ai 1 256 3.3 7.5 lead-free fpbga 256 128 i lc4256v-10fn256ai 1 256 3.3 10 lead-free fpbga 256 128 i lc4256v-5fn256bi 1 256 3.3 5 lead-free fpbga 256 160 i lc4256v-75fn256bi 1 256 3.3 7.5 lead-free fpbga 256 160 i lc4256v-10fn256bi 1 256 3.3 10 lead-free fpbga 256 160 i lc4256v-5tn176i 256 3.3 5 lead-free tqfp 176 128 i lc4256v-75tn176i 256 3.3 7.5 lead-free tqfp 176 128 i lc4256v-10tn176i 256 3.3 10 lead-free tqfp 176 128 i lc4256v-5tn144i 256 3.3 5 lead-free tqfp 144 96 i lc4256v-75tn144i 256 3.3 7.5 lead-free tqfp 144 96 i lc4256v-10tn144i 256 3.3 10 lead-free tqfp 144 96 i lc4256v-5tn100i 256 3.3 5 lead-free tqfp 100 64 i lc4256v-75tn100i 256 3.3 7.5 lead-free tqfp 100 64 i lc4256v-10tn100i 256 3.3 10 lead-free tqfp 100 64 i lc4384v lc4384v-5ftn256i 384 3.3 5 lead-free ftbga 256 192 i lc4384v-75ftn256i 384 3.3 7.5 lead-free ftbga 256 192 i lc4384v-10ftn256i 384 3.3 10 lead-free ftbga 256 192 i lc4384v-5fn256i 1 384 3.3 5 lead-free fpbga 256 192 i lc4384v-75fn256i 1 384 3.3 7.5 lead-free fpbga 256 192 i lc4384v-10fn256i 1 384 3.3 10 lead-free fpbga 256 192 i lc4384v-5tn176i 384 3.3 5 lead-free tqfp 176 128 i lc4384v-75tn176i 384 3.3 7.5 lead-free tqfp 176 128 i lc4384v-10tn176i 384 3.3 10 lead-free tqfp 176 128 i lc4512v lc4512v-5ftn256i 512 3.3 5 lead-free ftbga 256 208 i lc4512v-75ftn256i 512 3.3 7.5 lead-free ftbga 256 208 i lc4512v-10ftn256i 512 3.3 10 lead-free ftbga 256 208 i lc4512v-5fn256i 1 512 3.3 5 lead-free fpbga 256 208 i lc4512v-75fn256i 1 512 3.3 7.5 lead-free fpbga 256 208 i lc4512v-10fn256i 1 512 3.3 10 lead-free fpbga 256 208 i lc4512v-5tn176i 512 3.3 5 lead-free tqfp 176 128 i lc4512v-75tn176i 512 3.3 7.5 lead-free tqfp 176 128 i lc4512v-10tn176i 512 3.3 10 lead-free tqfp 176 128 i 1. use ftbga package. fpbga package devices have been discontinued via pcn#14a-07. ispmach 4000v (3.3v) lead-free industrial devices (cont.) device part number macrocells voltage t pd package pin/ball count i/o grade
lattice semiconductor ispmach 4000v/b/c/z family data sheet 98 for further information in addition to this data sheet, the following technical notes may be helpful when designing with the ispmach 4000v/b/c/z family: ispmach 4000 timing model design and usage guidelines (tn1004) ispmach 4000v/b/c/z power consumption (tn1005) revision history ispmach 4000v (3.3v) lead-free extended temperature devices device part number macrocells voltage t pd package pin/ball count i/o grade lc4032v lc4032v-75tn48e 32 3.3 7.5 lead-free tqfp 48 32 e lc4032v-75tn44e 32 3.3 7.5 lead-free tqfp 44 30 e lc4064v lc4064v-75tn100e 64 3.3 7.5 lead-free tqfp 100 64 e lc4064v-75tn48e 64 3.3 7.5 lead-free tqfp 48 32 e lc4064v-75tn44e 64 3.3 7.5 lead-free tqfp 44 30 e lc4128v lc4128v-75tn144e 128 3.3 7.5 lead-free tqfp 144 96 e lc4128v-75tn128e 128 3.3 7.5 lead-free tqfp 128 92 e lc4128v-75tn100e 128 3.3 7.5 lead-free tqfp 100 64 e lc4256v lc4256v-75tn176e 256 3.3 7.5 lead-free tqfp 176 128 e lc4256v-75tn144e 256 3.3 7.5 lead-free tqfp 144 96 e lc4256v-75tn100e 256 3.3 7.5 lead-free tqfp 100 64 e date version change summary previous lattice releases. july 2003 17z changed device status for lc4064zc and lc4128zc to production release and updated/added ac and dc parameters as well as ordering part numbers for lc4064zc and lc4128zc devices. improved leakage current speci?ations for ispmach 4000z. for ispmach 4000v/b/c iil, iih condition now includes 0v and 3.6v end points (0 vin 3.6v). added 132-ball chip scale bga power supply and nc connections. added 132-ball chip scale bga logic signal connections for lc4064zc, lc4128zc and lc4256zc devices. added lead-free package designators. october 2003 18z hot socketing characteristics footnote 1. has been enhanced; insensitive to sequence of vcc or vcco. however, assumes monotonic rise/fall rates for vcc and vcco, provided (vin - vcco) 3.6v. improved lc4064zc t s to 2.5ns, t st to 2.7ns and f max (ext.) to 175mhz, lc4128zc t co to 3.5ns and f max (ext.) to 161mhz (version v.2.1). improved associated internal timing numbers and timing adders (version v.2.1). added ispmach 4000v/b/c/z orp reference tables. enhanced orp information in device pinout tables consistent with the orp combinations for i/o blocks tables (table 6, 7, 8 and 9 in page 9-11). corrected glb/mc/pad information in the 256-fpbga pinouts for the lc4256v/b/c 160-i/o ver- sion. added the ispmach 4000 family speed grade offering table. added the ispmach 4128zc industrial and automotive device opns december 2003 19z added the ispmach 4032zc and 4064zc industrial and automotive device opns january 2004 20z ispmach 4000z data sheet status changed from preliminary to ?al. documents production release of the ispmach 4256z device.
lattice semiconductor ispmach 4000v/b/c/z family data sheet 99 added new feature - ispmach 4000z supports operation down to 1.6v. added lead-free packaging ordering part numbers for the ispmach 4000z/c/v devices. april 2004 21z updated i pu (i/o weak pull-up resistor current) max. speci?ation for the ispmach 4000v/b/c; -150? to -200?. november 2004 22z added user electronic signature section. added ispmach 4000b (2.5v) lead-free ordering part numbers. december 2004 22z.1 updated further information section. february 2006 22z.2 clari?ation to ispmach 4000z input leakage (i ih ) speci?ation. march 2007 22.3 updated ispmach 4000 introduction section. updated signal descriptions table. june 2007 22.4 updated features bullets to include reference to ?a automotive data sheet under the ?road device offering bullet. added footnote 1 to part number description to reference the ?a automotive data sheet. changed device temperature references from ?utomotive to ?xtended temperature for non- aec-q100 quali?d devices. november 2007 23.0 added 256-ftbga package ordering part number information per pcn#14a-07. date version change summary

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